ABSTRACT BI, XIANGYU. Design and Testing of an Induction-Heated
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Thickness Measurement Methods for Physical Vapor Deposited Aluminum Coatings in Packaging Applications: a Review
coatings Review Thickness Measurement Methods for Physical Vapor Deposited Aluminum Coatings in Packaging Applications: A Review Martina Lindner 1,* and Markus Schmid 1,2 1 Fraunhofer-Institute for Process Engineering and Packaging IVV, Giggenhauser Strasse 35, Freising 85354, Germany; [email protected] 2 Chair for Food Packaging Technology, Technische Universität München, Weihenstephaner Steig 22, Freising 85354, Germany * Correspondence: [email protected]; Tel.: +49-8161-491-536 Academic Editor: Massimo Innocenti Received: 14 November 2016; Accepted: 27 December 2016; Published: 14 January 2017 Abstract: The production of barrier packaging materials, e.g., for food, by physical vapor deposition (PVD) of inorganic coatings such as aluminum on polymer substrates is an established and well understood functionalization technique today. In order to achieve a sufficient barrier against gases, a coating thickness of approximately 40 nm aluminum is necessary. This review provides a holistic overview of relevant methods commonly used in the packaging industry as well as in packaging research for determining the aluminum coating thickness. The theoretical background, explanation of methods, analysis and effects on measured values, limitations, and resolutions are provided. In industrial applications, quartz micro balances (QCM) and optical density (OD) are commonly used for monitoring thickness homogeneity. Additionally, AFM (atomic force microscopy), electrical conductivity, eddy current measurement, interference, and mass spectrometry (ICP-MS) are presented as more packaging research related methods. This work aims to be used as a guiding handbook regarding the thickness measurement of aluminum coatings for packaging technologists working in the field of metallization. Keywords: PVD; aluminum; quartz micro balance; optical density; AFM; electrical conductivity; eddy current; interference; ICP-MS; metal coating; nano-scale coatings 1. -
Thin Film Deposition
Thin Film Deposition • Physical processes – Evaporation: Thermal, E-beam, Laser, Ion-plating. – Sputtering: DC, RF, Magnetron, Reactive. – Spray: Flame, Plasma. • Chemical processes – Chemical Vapor Deposition (CVD): Thermal, MOCVD, PECVD. – Plating: Electroplating, Electroless. – Solgel – ALE • Molecular Beam Epitaxy Vacuum Evaporation • Heating a source material under vacuum until it evaporates or sublimates. • The evaporant is deposited onto a substrate to form a film. • Physical vapor deposition process. • High deposition rate, simple, easy to use. • Conductor materials in electronic circuits and devices, dielectric and optical coatings. Vacuum evaporation Mean free path of atoms in the vapor > the distance from the source to the substrate. o The mean free path, λmfp, of particles in air at T = 25 C (cm) (torr) n = P/kT For N2 molecules d = 6.2 Å Vacuum evaporation • Deposition rate: Hertz-Knudsen eq. R/(cm2s) = C(P” – P)/(2πmkT)1/2 R = nv/4, n = P/kT, v = (8kT/πm)1/2 C: Evaporation coefficient P”: Evaporant surface vapor pressure P: Hydrostatic pressure m: Evaporant molecular weight k: Boltzmann constant T: Temperature Vacuum evaporation • Evaporation coefficient: Larger for clean surfaces, smaller for contaminated surfaces. • Deposition rate: Greatly depends on the substrate-to-source geometry. • Non-uniform thickness on surface: Due to the distance dependence. Knudsen’s cosine law, cosθ/r2. Thermal Evaporation – Difficult: High melting point materials, uniformly heating, rapidly change of deposition rate, reactions between the source and the heating container. E-beam evaporation • High energy focused electron beam to heat the source material at a small area. • Larger deposition rate. • Water-cooled container (cavity or hearth): No source-container reaction. -
The Foundations of Vacuum Coating Technology
The Foundations of Vacuum Coating Technology The Foundations of Vacuum Coating Technology Donald M. Mattox Management Plus, Inc. Albuquerque, New Mexico NOYES PUBLICATIONS WILLIAM ANDREW PUBLISHING Norwich, New York, U.S.A. i Copyright © 2003, Noyes Publications / William Andrew Publishing. All rights reserved. No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording, or by any information storage and retrieval system, without permission in writing from the Publisher. Cover Art © 2003 by Brent Beckley / William Andrew Publishing Library of Congress Catalog Card Number: 2003004260 ISBN: 0-8155-1495-6 Published in the United States of America by Noyes / William Andrew Publishing 13 Eaton Avenue Norwich, NY 13815 1-800-932-7045 www.williamandrew.com www.knovel.com 10 9 8 7 6 5 4 3 2 1 This book may be purchased in quantity at discounts for education, business, or sales promotional use by contacting the Publisher. Plastics Design Library and its logo are trademarks of William Andrew Inc. Notice: To the best of our knowledge the information in this publication is accurate; however the Publisher does not assume any responsibility or liability for the accuracy or completeness of, or consequences arising from, such information. This book is intended for informational purposes only. Mention of trade names or commercial products does not constitute endorsement or recommendation for use by the Publisher. Final determination of the suitability of any information or product for any use, and the manner of that use, is the sole responsibility of the user. -
Thin Film Deposition & Vacuum Technology
Thin Film Deposition & Vacuum Technology THIN FILM DEPOSITION & VACUUM TECHNOLOGY By Stefan Cannon Lofgran A senior thesis submitted to the faculty of Brigham Young University{Idaho in partial fulfillment of the requirements for the degree of Bachelor of Science Department of Physics Brigham Young University{Idaho April 2013 2013 c Stefan Lofgran All Rights Reserved Brigham Young University{Idaho Department Approval of a senior thesis submitted by Stefan Cannon Lofgran This thesis has been reviewed by the research committee, senior thesis coor- dinator and department chair and has been found to be satisfactory. Date David Oliphant, Advisor Date Ryan Nielson, Committee Member Date Stephen McNeil, Senior Thesis Coordinator ABSTRACT THIN FILM DEPOSITION & VACUUM TECHNOLOGY Stefan Cannon Lofgran Department of Physics Bachelor of Science The study and development of thin films via physical vapor deposition has played a significant role in the development of optical coatings, semiconduc- tors, and solar cells. Closely related to the study of thin films is the de- velopment of vacuum technology and systems capable of reaching pressures suitable for growing uniform films at reasonable deposition rates. This paper explores the method of physical vapor deposition known as thermal evapo- ration via resistive or Joule heating as a means for growing thin aluminum (Al) films on a mineral glass substrate. Methods for measuring thickness are also discussed and investigated in an attempt to determine the experimen- tally produced film thickness. A detailed explanation of the development and operation of the vacuum system in which the Al films were grown is given as well as future improvements that could be made. -
Fabrication of Thin Films
Fabrication of thin films Fabrication of thin films 1. Introduction 2. Physical vapor deposition 3. Basic techniques Introduction We will be concerned today only with a few out of the numerous deposition methods Some of the deposition methods*: ● Evaporation methods: 1. Vacuum evaporation 2. Electron-beam evaporation 3. Molecular-beam epitaxy plan for today ● Sputtering 1. Diode sputtering 2. Magnetron sputtering 3. Bias sputtering 4. Ion beam sputtering ● Chemical vapor deposition ● Liquid phase chemical techniques *for more methods see for example p.15 of Handbook of Thin-Film Deposition Processes and Techniques, edited by K. Seshan, 2002 Noyes Publications Introduction Earth atmosphere is composed mainly of two elements* (nitrogen and oxygen) Water vapor constitutes about 0.25% of the mass of the atmosphere The typical sea-level pressure is about 1000 hPa The mean mass of water vapor in From Dalton's law we have for the atmospheric pressure: atmosphere is estimated at 1.27×1016 kg [34] which corresponds to 12 700 km3 (cubic kilometers) of water liquid; which Ptotal=∑ pi= p Nitrogen+ poxygen+... is roughly 55% of water in Baikal i lake (23 000km3) [35]. *the graph shows the elements in a dry atmosphere – not including water vapor; data from spark.ucar.edu/shortcontent/earths-atmosphere Introduction For an ideal gas (non-interacting point-like particles) we have from Avogadro's law for the number of gas particles in a unit volume: P V N =N N ≈6.022×1023 mol −1 P V =n RT A RT A Avogadro constant −23 −1 R=k B N A k B ≈1.38×10 J K Boltzmann constant P V N = k B T For typical laboratory conditions (room temperature, sea level) it follows that there are about 2.47×1025 particles in cubic meter of air. -
Vacuum Evaporators in Pollutioa Prevention \
Vacuum Evaporators in Pollutioa Prevention \. and Control Technology for Plating Operations George C. Cushnie Jr. CAI Engineering A Project Sponsored by the National Center for Manufacturing Sciences and Conducted in Cooperation with the National Association of Metal Finishers I Cudmic Ir.. G.C. 1994. Polhuim Pmnrion and, inol Technolozv. tin&? Operafiom. produced with ! pnmirrin f" the National Center for Manufaduring Sciences WCMS), Ann Arbor, Michigan. Copyright Q 1994 by i NCMS. EMsponsored by the Manufacturing Tcchology Directorate, Wright Laboratory (WWMTX), Air Force Materiel Caaman4 USAF, lmdcr Coop"e Ap"t number F33615-94-24423.The US. Government is authorized to qmdw and distribute reprints for Govemntd purposw notwithstanding any copyright notltion hereon. The views and wnclusions contained herein are those of the authors and should not be interpreted as necessarily representing the . official policies or mdoncmcnts, either expnsscd or implied, of Wright Laboratory or the US.Government. 3.3 VACUUM EVAPORATORS 3.3.1 Overview Vacuum evaporators are one of the earliest technologies used in the plating industry for chemical recovery. How- ever, vacuum evaporators are cumntly used less frc- quently than some other recove* technologies, such as atmospheric evaporators (see Section 3.2). This is pri- marily due to the fact that the average vacuum evapora- tion unit costs approximately ten times more than the average atmospheric unit. Also, the vacuum units have mare sophisticated and expensive operational and main- tenance requirements. Of the 3 18 plating shops respond- ing to the Users Survey, 23 shops (or 7.2%) have em- ployed vacuum evaporators (30ptal units of which ap- .