Renesas Microprocessor RZ Family Catalog

Notes: Renesas Microprocessor 1. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information. 2. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein. 3. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or RZ Family Catalog others. 4. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product. 5. Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on the product's quality grade, as indicated below. "Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots etc. "High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc. Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics. 6. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges. 7. Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or systems manufactured by you. 8. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations. 9. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. 10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics products. 11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics. 12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries. (Note 1) "Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries. (Note 2) "Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.

SALES OFFICES http://www.renesas.com Refer to "http://www.renesas.com/" for the latest and detailed information. Renesas Electronics America Inc. 2801 Scott Boulevard Santa Clara, CA 95050-2549, U.S.A. Tel: +1-408-588-6000, Fax: +1-408-588-6130 Renesas Electronics Canada Limited 9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3 Tel: +1-905-237-2004 Renesas Electronics Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K Tel: +44-1628-585-100, Fax: +44-1628-585-900 Renesas Electronics Europe GmbH Arcadiastrasse 10, 40472 Düsseldorf, Germany Tel: +49-211-6503-0, Fax: +49-211-6503-1327 Renesas Electronics (China) Co., Ltd. Room 1709, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100191, P.R.China Tel: +86-10-8235-1155, Fax: +86-10-8235-7679 Renesas Electronics (Shanghai) Co., Ltd. Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, P. R. China 200333 Tel: +86-21-2226-0888, Fax: +86-21-2226-0999 Renesas Electronics Hong Kong Limited Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong Tel: +852-2265-6688, Fax: +852 2886-9022 Renesas Electronics Taiwan Co., Ltd. 13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan Tel: +886-2-8175-9600, Fax: +886 2-8175-9670 Renesas Electronics Singapore Pte. Ltd. 80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949 Tel: +65-6213-0200, Fax: +65-6213-0300 Renesas Electronics Malaysia Sdn.Bhd. Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: +60-3-7955-9390, Fax: +60-3-7955-9510 Renesas Electronics India Pvt. Ltd. No.777C, 100 Feet Road, HAL II Stage, Indiranagar, Bangalore, India Tel: +91-80-67208700, Fax: +91-80-67208777 Renesas Electronics Korea Co., Ltd. 12F., 234 Teheran-ro, Gangnam-Gu, Seoul, 135-080, Korea Tel: +82-2-558-3737, Fax: +82-2-558-5141

Renesas Electronics © 2015 Renesas Electronics Corporation, All rights reserved. www.renesas.com R01CP0031EJ0100 Colophon 6.0 2015.10 The utilization of intelligent technology is advancing in all aspects of our lives, including electric household appliances, industrial equipment, building management, power grids, and transportation. The cloud-connected “smart society” is coming ever closer to realization. Microcontrollers are now expected to provide powerful capabilities not available previously, such as high-performance and energy-ef cient control combined with interoperation with IT networks, support for human-machine interfaces, and more. To meet the demands of this new age, Renesas has drawn on its unmatched expertise in microcontrollers to create the new RZ family of embedded processors. The lineup of these “next-generation processors that are as easy to use as conventional microcontrollers” spans three product series to meet different customer requirements. the Zenith of the Renesas micro

As embedded processors to help build the next generation of advanced products, the RZ family offers features not available elsewhere and brings new value to customer applications.

Renesas RZ Family The next-generation processor to meet the needs of the smart

society has arrived. Advanced embedded processors ready to play a key role in the smart society

RZ Family: Roadmap

RZ/G1M RZ/G-next ARM®Cortex®-A15×2(1.5GHz) (TBD) W/ SGX544MP2

RZ/G1E RZ/G series Cortex®-A7×2(1GHz) 3D Graphics HMI MPU W/SGX540 RZ/A-next (TBD) RZ/A1H Cortex®-A9(400MHz) 10MB, WXGA, 2D RZ/A1M Cortex®-A9(400MHz) RZ/A1LU RZ/A series RZ/A1L 5MB, WXGA, 2D Cortex®-A9(400MHz) Cortex®-A9(400MHz) for HMI Apps. 3MB, XGA, JPEG 3MB, XGA

RZ/T1 Cortex®-R4(600/450MHz) RZ/T-next R-IN Engine (TBD)

RZ/T1 Cortex®-R4(600/450MHz) RZ/T series 512K TCM + 1MB RAM for Real-time Ctrl. RZ/T1 Cortex®-R4(450MHz) 512K TCM

2014 2015 2016 2017 2018 CY

ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and other countries. RZ/A Series: Roadmap Graphics display and camera input capabilities on a single chip

RZ/A1H RZ/A-next Cortex®-A9(400MHz) (TBD) Video Display Controller ch1 (A1H and A1M only) 10MB, WXGA, 2D RZ/A1M Integration of multiple layers of data and output to LCD RZ/A series Cortex®-A9(400MHz) RZ/A1LU for HMI Apps. RZ/A1L 5MB, WXGA, 2D Cortex®-A9(400MHz) Video Display Controller ch0 Cortex®-A9(400MHz) 3MB, XGA, JPEG Buffer 3MB XGA CPU 2014 2015 2016 2017 2018 CY

Internal CPU bus Storage of input images Use of graphics bus by 1 via graphics bus VDC to fetch multiple RZ/A Series: Target Applications Internal 2 layers of display data Graphics bus { 3 4

Page0 Page1 Page2 Page3 Page4 A1H (10MB) (2MB) (2MB) (2MB) (2MB) (2MB) Intercoms White goods White goods Vending machines Diagnostic panels Home audio Display audio Car audio Large-capacity on-chip RAM A1M [5MB] [1MB] [1MB] [1MB] [1MB] [1MB] A1L {3MB} {512KB} {512KB} {512KB} {512KB} {1MB}

Industrial panels Barcode scanners Of ce equipment Monitoring cameras Data communication modules Multi-function displays Backup cameras Handwriting recognition input devices (telematics, emergency communications) The bus con guration with independent buses for images and hardware-based superimposition processing make it easy to create graphical applications.

RZ/A Series Features

Large-capacity on-chip RAM: 10MB Rich peripheral functions and software

Graphics display and camera input capabilities on a single chip Graphics Camera Example system Rich peripheral functions and software solution Real-time correction of distorted images

RZ/A1 Large-capacity on-chip RAM: 10MB Input image Output image “Smooth” and CPU DRAM-less solution On-chip 2D graphics “beautiful” graphics Ability to connect Ability to process accelerator for fast display by utilizing analog CMOS imported images and image rendering large-capacity on-chip HMI functions cameras extract a variety of Conventional MPU concept RZ/A1 concept RAM to the full information 5V/12V 5V/12V Large-capacity on-chip RAM Higher costs

Regulator Regulator Regulator Regulator Regulator Network Voice 3.3V 1.2V 1.5V / 0.75V 3.3V 1.2V

Wired LAN/wireless LAN • Graphics NOR • Face recognition, Conventional MPU DDR3 SPI Flash human sensing Flash RZ/A1 • Image compression, decompression Reception of Narrowing down by Reduction of network necessary information Advantages RZ/AI of only valuable communication • Voice synthesis, over the network and etc. •No need to design a information for volume/ability to voice readout high-speed interface transmission over the increase number of network cameras exibly Higher costs •Reduced mounting area •Reduced PCB cost •No DRAM procurement issues With ample peripheral functions and software, a single chip can cover a wide range of elds, including display, camera input, 4 PCB layers for 1.2V, 3.3V communication, and audio functions. 6 PCB layers for 1.2V, 3.3V, 1.5V/0.75V (DDR3) HMI Solutions RZ/A1L Group RZ/A1L block diagram

CPU (ARM® Cortex®-A9) • Operating frequency: 400MHz • Single-precision/double-precision FPU • ARM® NEON™ On-chip memory • RZ/A1L: 3MB Full HD Main graphics and camera input functions (1920×1080) • LCD controller (VDC5): 1 channel Video input: Max. XGA Memory Timers Communications RZ/G Series LCD output: Max. XGA SRAM MTU2 10/100 Screen superimposition: 3 layers 3 MB 16-bit × 5ch Ether MAC • CMOS camera input (CEU): 1 channel SRAM L2 Cache WDT USB2.0 Large-capacity on-chip memory RTOS Main memory interface functions 128 KB 8-bit × 1ch HS 2ch h/f • NOR ash, SDRAM, NAND ash Simple HMI development as Compact HMI Cache External Bus 32-bit • QSPI serial ash: 1 channel (ability to run stored programs directly) 32 KB + 32 KB OS Timer ROM, SRAM, with microcontrollers development • SD host interface: 2 channels 32-bit × 2ch SDRAM, PCMCIA • MMC host interface: 1 channel System SPI Multi RZ/A Series Main communication functions Real-Time CLK 2ch • USB 2.0 High Speed: 2 channels (Host/Function switchable) DMAC 16ch SCIF RSPI • 10M/100M EtherMAC:1 channel 5ch 3ch Graphics • SCIF:5 channels Interrupt WXGA and RZ/A1LU RZ/A1H Controller I2C IEBus • I2C:4 channels Video Display below 4ch 1ch • SSI:4 channels Clock Generation Controller 1ch (1280×768) with SSCG SSI(I2S) SPDIF • RSPI:3 channels CMOS Camera I/F 4ch 1ch RZ/A1L RZ/A1M • CAN:2 channels JTAG Debug 1ch Package SDHI MMC 2ch 1ch • 176-LFBGA(8mm ,0.5mm pitch) ¨ Audio • 176-LFQFP(24mm¨,0.5mm pitch) CAN MOST50 2ch 1ch Image display functions only Image display functions Image display functions • 208-FBGA(28mm¨,0.5mm pitch) SCUX 4ch ASRC Smart Card I/F + 2D graphics + 3D graphics + video support 2ch Analog IrDA LIN Master •HMI solutions optimized to match the image resolution, functions, and OS ADC 1ch 2ch 12-bit × 8ch •RZ/G series: Full HD, functions: 3D Gfx, vide, OS: Linux (RichOS) •RZ/A series: WXGA and below, functions: 2D Gfx, camera input processing, OS: RTOS

RZ/A1H Group and RZ/A1M Group (Pin Compatible) RZ/A1H,and RZ/A1M block diagram RZ/A1LU Group RZ/A1LU block diagram ® ® CPU (ARM Cortex -A9) CPU (ARM® Cortex®-A9) • Operating frequency: 400MHz • Operating frequency: 400MHz • Single-precision/double-precision FPU • Single-precision/double-precision FPU ® • ARM NEON™ • ARM® NEON™ On-chip memory On-chip memory • RZ/A1H: 10MB • RZ/A1LU: 3MB • RZ/A1M: 5MB Main graphics and camera input functions Main graphics and camera input functions • LCD controller (VDC5): 1 channel Memory Timers Communications Memory Timers • LCD controller (VDC5): 2 channels Video input: Max. XGA Communications Video input: Max. XGA (CVBS analog input supported) SRAM MTU2 10/100 LCD output: Max. XGA SRAM MTU2 10/100 H:10MB/M:5MB LCD output: Max. WXGA 16-bit × 5ch Ether MAC Screen superimposition: 3 layers 3MB 16-bit × 5ch Ether MAC Screen superimposition: 4 layers SRAM L2 Cache USB2.0 • JPEG coding engine: 1 channel SRAM L2 Cache WDT • Open VG accelerator: 1 channel 128 KB WDT 128KB CAN 8-bit × 1ch HS 2ch h/f • CMOS camera input (CEU): 1 channel 8-bit × 1ch 2ch • JPEG coding engine: 1 channel Cache NAND Flash Main memory interface functions Cache

• Distortion compensation unit (IMR): 1 channel 32 KB + 32 KB OS Timer I/F 32KB + 32KB OS Timer USB2.0 • NOR ash, SDRAM, NAND ash 32-bit × 2ch • CMOS camera input (CEU): 1 channel 32-bit × 2ch HS 2ch h/f System External Bus 32-bit • QSPI serial ash: 1 channel (ability to run stored programs directly) Syst em • PAL/NTSC decoder (DVDEC): channels External Bus 32-bit PWM Timer ROM, SRAM, • SD host interface: 2 channels Real-Time CLK Main memory interface functions SDRAM, PCMCIA ROM, SRAM, DMAC 16ch 16ch • MMC host interface: 1 channel DMAC 16ch SDRAM, PCMCIA • NOR ash, SDRAM, NAND ash SPI Multi Main communication functions Graphics • QSPI serial ash: 1 channel (ability to run stored programs directly) Interrupt 2ch Interrupt SPI Multi Real-Time CLK • USB 2.0 High Speed: 2 channels (Host/Function switchable) Controller • SD host interface: 2 channels Controller Video Display 1ch SCIF RSPI • 10M/100M EtherMAC:1 channel Controller 1ch • MMC host interface: 1 channel Clock Generation Clock Generation 8ch 5ch • SCIF:5 channels with SSCG SCIF RSPI with SSCG CMOS Camera I/F 5ch 3ch Main communication functions Graphics 2 2 I C IEBus • I C:4 channels JTAG Debug 1ch • USB 2.0 High Speed: 2 channels (Host/Function switchable) JTAG Debug 4ch 1ch 2 Video Display • SSI:4 channels I C • 10M/100M EtherMAC:1channel JPEG Engine 4ch Encryption Controller 2ch SSI(I2S) SPDIF • RSPI:3 channels Encryption 1ch • SCIF:8 channels Engine* 6ch 1ch • Ethernet AVB:1 channel Engine* SSI(I2S) SPDIF 2 OpenVG 1.1 • I C:4 channels Customer 4ch 1ch Customer Enhanced eng. SDHI MMC • CAN:2 channels • SSI:6 channels Unique ID* Unique ID* 2ch 1ch Package SDHI MMC • RSPI:5 channels PAL/NTSC dec. 2ch • 176-LFBGA(8mm¨,0.5mm pitch) 2ch 1ch • Ethernet AVB:1 channel Audio CAN MOST50 Audio 5ch 1ch • 176-LFQFP(24mm¨,0.5mm pitch) SCUX 4ch ASRC CMOS Camera I/F Smart Card I/F • CAN:5 channels • 208-FBGA(28mm ,0.5mm pitch) SCUX 1ch Smart Card I/F ¨ 4ch ASRC 2ch Package Sound Generator 2ch • 256-LFBGA(11mm¨,0.5mm pitch) Fish Eye Correction IrDa Analog IrDA LIN Master Analog 1ch • 256-LFQFP(28mm¨,0.4mm pitch) 2ch 1ch 2ch ADC ADC • 324-FBGA(19mm¨,0.8mm pitch) JPEG Engine Ethernet AVB Ethernet AVB 12-bit × 8ch 1ch 12-bit × 8ch * =Option * =Option RZ/A Series: Development Environments (Integrated Development Environments) RZ/A Series: Solutions from Partner Companies

Development environments, compilers, code generation and evaluation support ARM Ltd. DS-5 (development studio 5) development environment, ARM CC Atollic AB TrueSTUDIO development environment Development • DS-5 • IAR • eBinder • e2studio*3 eSOL Co., Ltd. eBinder development environment Embedded environments IAR Systems EWARM (development environment, compiler, C-SPY debugger) Workbench KPIT Technologies Ltd. GNU tool C compiler for ARM Emulators and related products *1 *2 *1 *4 Compilers • ARM CC • IAR C/C++ compiler • ARM CC • KPIT GNU tool ARM Ltd. DSTREAM™, ULINKpro™, ULINKproD™, and ULINK2™ JTAG emulators ICEs • DSTREAM™ • I-jet • PARTNER-Jet2 from • J-Link LITE from Segger Bitran Corporation Code Debugger DS-A1 JTAG emulator, Debug Writer DW-A1 Kyoto Microcomputer Co., Ltd. • ULINKpro™ • JTAGjet-Trace • J-Link series from Segger*5 Computex Co., Ltd. PALMiCE3 JTAG emulator, CSIDE, CodeRecoder dynamic text tool • ULINKproD™ • adviceLUNAII from IAR Systems I-jet JTAG emulator Yokogawa Digital Computer Corporation Kyoto Microcomputer Co., Ltd. PARTNER-Jet2 JTAG emulator • ULINK2™ Lauterbach GmbH TRACE32 PowerDebug JTAG emulator SEGGER Microcontroller GmbH & Co. KG J-Link and J-Link Lite JTAG emulators Yokogawa Digital Computer Corporation adviceLUNA II JTAG emulator, TRQerS dynamic text/analysis tool Starter kits, evaluation boards, platforms, etc. AlphaProject Co., Ltd. AP-RZA-0A (RZ/A1H) evaluation board *1. ARM CC is included in DS-5 Starter Kit for RZ, which is available free of charge, and in the popularly priced DS-5 RZ Edition. There is also a Computex Co., Ltd. CEV-RZ/A1L (RZ/A1L) evaluation board, CKB-RZ/A1H (RZ/A1H) embedded board free evaluation version that provides full functionality but is limited to 30 days of use. Contact a DS-5 sales agent for details. Core Corporation Kiri ASURA (RZ/A1H) evaluation board *2. The IAR C/C++ compiler is available in two free versions: one is limited to a code size of 32KB but has no time limit, and the other provides full emtrion GmbH DIMM-RZ/A1H evaluation board functionality but is limited to 30 days of use. Mobiveil, Inc. Ticketing Machine evaluation board *3. Eclipse-based development environment from Renesas (http://japan.renesas.com/e2studio) Shimafuji Electric Inc. SBEV-RZ/A1L (RZ/A1L) and Wallaby-721021 (RZ/A1L) evaluation boards *4. GNU tools for RZ/A1 and technical support are provided by KPIT Technologies Ltd. (http://www.kpitgnutools.com/index.php). A-ONE Co.,ltd MP-RZA1H/FPGA-01 (RZ/A1H) embedded board *5. Renesas does not handle ICEs from Segger. Contact a sales agent for details. Wakamatsu Tsusyo Co.,Ltd. GR-PEACH (mbed) evaluation board OS A.I. Corporation RTOS TOPPERS-Pro, Pro/PX, Pro/HRP2, SafeG eForce Co., Ltd. RTOS μC3/Standard for RZ/A EmbITeK Co., Ltd. RTOS TOPPERS-EM Enea KK EneaLinux embedded Linux distribution RZ/A Series: Development Tools (Debuggers, ICEs) eSOL Co., Ltd. RTOS eT-Kernel Express Logic, Inc. RTOS ThreadX Grape Systems Inc. ThreadX μTRON Micrium, Inc. RTOS μC/OS-III Micro Digital Inc. RTOS SMX RTOS Debuggers • PARTNER-Jet2 • microVIEW-PLUS • CSIDE version 6 MiSPO Co., Ltd. RTOS NORTi Professional (RZ/ADS), NORTi Professional(RZ/EW) Real Time Engineers Ltd. RTOS FreeRTOS SEGGER Microcontroller GmbH & Co. KG RTOS embOS Timesys Corporation Embedded Linux Middleware, tools Access Co., Ltd. paneE™ UI engine for embedded devices Altia, Inc. DeepScreen GUI development environment for embedded devices ICEs • adviceLUNA II • PALMiCE3 Consilient Technologies Pvt. Ltd. H.264 decoder middleware Coressent Technology, Inc. CT-View+ embedded software Crank Software Inc. Crank Storyboard Suite GUI development environment for embedded devices Data Technology Inc. Cente series embedded middleware DynaComware Corporation DynaFont fonts eForce Co., Ltd. μNet3 standard TCP/IP stack Supported • exeGCC from Kyoto Microcomputer • ARM CC*2 • ARM CC*2 • KPIT GNU tool*1 • KPIT GNU tool,*1 etc. • IAR C/C++ compiler*3 eSOL Co., Ltd. Middleware (file system, USB, network, graphics) compilers • ARM CC*2 • KPIT GNU tool,*1 etc. Express Logic, Inc GUIX embedded GUI development environment, USBX, FileX (filesystem/SD), and NetX middleware • IAR C/C++ compiler,*3 etc. Grape Systems Inc. UI Brain GUI development environments for embedded devices GR-QR, GR-BARCODE, GR-USB, GR-SD, and IVT BlueLet middleware International Laboratory Corporation GENWARE3 and GENWARE4 GUI development environments for embedded devices, INTALOGIC control engine for embedded devices *1. GNU tools for RZ/A1 and technical support are provided by KPIT Technologies Ltd. (http://www.kpitgnutools.com/index.php). IS2T S.A. MicroEJ GUI development environment for embedded devices *2. ARM CC is included in DS-5 Starter Kit for RZ, which is available free of charge, and in the popularly priced DS-5 RZ Edition. There is also a IT Access Corporation Geal GUI development environment for embedded devices free evaluation version that provides full functionality but is limited to 30 days of use. Contact a DS-5 sales agent for details. Kyoto Software Research, Inc. Fugue-NAND and eco-Fugue high-reliability flash file system, Galba high-reliability file system *3. The IAR C/C++ compiler is available in two free versions: one is limited to a code size of 32KB but has no time limit, and the other provides full MCCI Corporation TrueTask USB middleware functionality but is limited to 30 days of use. Micrium, Inc. µC/GUI embedded GUI development environment, µC/USB, µC/FS (filesystem/SD), and µC/TCP-IP middleware Micro Digital Inc. smxUSBH/USBD, smxFS (filesystem/SD), and smxNS TCP/IP stack middleware PUX Corporation FaceU® face recognition software, human detection software, Rakuhira® handwriting recognition software SEGGER Microcontroller GmbH & Co. KG emWin GUI development environment for embedded devices, emUSB middleware Serious Integrated, Inc. SHIPTide GUI development environment for embedded devices Techno Mathematical Co., Ltd. H.264 BP SD encoder/decoder and hands-free video middleware Tera Probe, Inc. TeraFaces™ facial verification software TES Electronic Solutions GmbH Guiliani GUI development environment for embedded devices Ubiquitous Corporation Ubiquitous Network Framework,DeviceSQL, QuickBoot, DTCP-IP,WPA/WPS/Wi-Fi Direct, ECHONET Litev embedded middleware Uquest, Ltd. MatrixQuestUSB series middleware Zuken Elmic, Inc. MirrorLink, Ethernet AVB, ONVIF, RTP, and TCP/IP (IPv4, IPv6) middleware RZ/G Series: Roadmap Scalability among products in the series

RZ/G-next Using the same architecture maintains compatibility with other product versions and software. RZ/G1M (TBD) Cortex®-A15 × 2 (1.5GHz) RZ/G series W/ SGX544MP2 3D Graphics RZ/G1E Cortex®-A15 HMI MPU ® Cortex -A7 × 2 (1GHz) CPU W/ SGX540 Cortex®-A7

Graphics SGX544MP2 SGX540 2014 2015 2016 2017 2018 CY Compatible Video Codec VCP3

RZ/G Series Features Network Ethernet MAC, CAN Standard I/F UART, SPI, Timer, PWM, I2C High processing capacity High Speed IF PCIe, USB3.0, SATA Support for 3D graphics and Full HD video Memory bus DDR3-1600 × 32(2channels) Compatible DDR3-1333 × 32 Scalability among products in the series OS Linux Collaboration with partner companies RZ/G1M RZ/G1E

High processing capacity

Gigahertz-class dual-core CPU for high-performance operation processing Collaboration with partner companies RZ/G1E RZ/G1M R8A77450 R8A77430 Core Cortex®-A7 Dual Cortex®-A15 Dual Support from partner companies for complex system development Operating frequency 1.0GHz 1.5GHz Processing performance 3800DMIPS 10500DMIPS More than ten partner companies provide support in the form of hardware, software, development tools, and services. Cache L1cache I/32KB L1cache I/32KB D/32KB D/32KB Customers can concentrate on upstream L2cache 512KB L2cache 1MB development that adds value MMU Supported Supported NEON/VFP NEON supported(SIMDv2) NEON supported(SIMDv2) to their products. Application Collaboration VFP supported(VFPv4) VFP supported(VFPv4) development through services

Linux support Support for 3D graphics and Full HD video Middleware Capable of handling of Full HD video or 3D graphics with power to spare Support from partner RZ/G series Support from partner companies companies RZ/G1E RZ/G1M Multimedia Board design support R8A77450 R8A77430 3D graphics 3D graphics SGX540 520Mpx/s SGX544MP2 2080Mpx/s Board sales Video functions • Video display interface × 2 channels • Video display interface × 2 channels (RGB888 × 2 channels) (LVDS × 1ch/RGB888 × 1 channels) • Video input interface × 2 channels • Video input interface × 3 channels • Video codec: VCP3 • Video codec: VCP3 • IP converter module • IP converter module • Video image processing functions • Video image processing functions (color conversion, image enlargement/reduction, ltering) (color conversion, image enlargement/reduction, ltering) HMI Solutions RZ/G1E Group RZ/G1E block diagram CPU core • SD host interface × 3 channels • ARM® Cortex®-A7, dual-core (SDXC and UHS-I support) System Package FC-BGA2121-501 Interfaces Max. operating frequency: 1.0GHz • Multimedia card interface × 1 channel ARM®Debugger CPU LBSC (CoreSight) Ex-BUS interface(max 16bit) RZ/G Series Cache memory Other peripheral functions Cortex®-A7 Cortex®-A7 Full HD support DMAC 1.0GHz 1.0GHz DBSC MMU DDR3-SDRAM BSC/32bit • L1 instruction cache: 32KB • 32-bit timer × 12 channels L1 1$ L1 D$ L1 1$ L1 D$ • L1 data cache: 32KB • PWM timer × 7 channels Interrupt Controller 32KB 32KB 32KB 32KB 1ch USB2.0 host EHCI/OHCI 2 3ch PLL/Module Full HD • L2 cache: 512MB • I C bus interface × 8 channels -standby L2 cache:512KB NEON/VFPv4 1ch USB2.0 host/function Linux RZ/G1M High-speed module (1920×1080 External memory • Serial communication interface ) Timers Memory 3ch SDHI • Ability to connect DDR3-SDRAM (SCIF) × 15 channels Support SDXC Easy HMI development Watchdog Timer RAM0 RAM1 RAM2 via DDR dedicated bus • Quad serial peripheral interface 72KB 4KB 256KB 1ch MMCIF Timer pulse Unit 8ch I2C utilizing OpenOS 4ch/output PWM • Max. operating frequency: (QSPI) × 1 channel (boot support) 15ch SCIF RZ/G1E Graphic IPs resources 533MHz • Clock-synchronous serial interface Compare match Timer0 3ch MSIOF 2ch/16/32bit selectable 3DGE FDP1 QSPI • Data bus width: 32 bits (MSIOF) × 3 channels (SPI/IIS (PowerVR SGX540) De-interiacing module Compare match Timer1 Single/Dual/Quad-SPI External expansion support) 8ch/16/32/48bit selectable VSP1 2D-DMAC 3ch HSCIF Input Format Converter Image extraction GPIO • Ability to connect ash ROM or • Ethernet controller with AVB Timer Unit Image Processor Image rotation/inversion 4sets of 3ch 32bit timer Output Format Converter SRAM directly support (support for IEEE VIN Audio IPs • Data bus width: 8/16 bits 802.1BA, IEEE 802.1AS, IEEE 7ch PWM timer VCP3 2ch Video inputs 3D graphics Multi-codec module 10ch SSI 1920×1080@60×1ch DU Serial Sound Interface 3D graphics 802.1Qav, and IEEE 1722, Network Digital RGB 2ch outputs & video support 6ch SRC • PowerVR™ SGX540 GMII/MII interface, PHY device 2ch CAN Sampling Rate Converter Video functions connection support) Ethernet AVB 100 and 1000Mbps ADG • Video display interface × 2 • Ethernet controller Audio clock generator WXGA and Ethernet MAC RZ/A Series channels( RGB888) (IEEE 802.3u–compliant MAC 10 and 100Mbps below • Video input interface × 2 channels on-chip, RMII interface, ability to (1280×768) Power supply voltage (typ.) • Video codec module: VCP3 connect to PHY device) 1.8 V:(ETM, SD, LVCMOS I/F, Xtal, JTAG, Trace and RST) 1.03 V:(core) • IP converter module • Controller area network (CAN) 1.5 V:(DDR3-I/O SSTL Mode:DDR3) • Video image processing functions interface × 2 channels 3.3 V:(Others) (color conversion, image • Interrupt controller (INTC) Note: This information is subject to change without notice. enlargement/reduction, ltering) • Clock generator (CPG): on-chip Image display functions only Image display functions Image display functions Audio functions PLL + 2D graphics + 3D graphics + video support • Sampling rate converter × 6 channels • On-chip debug function • Serial sound interface × 10 channels Storage interfaces •HMI solutions optimized to match the image resolution, functions, and OS • USB 2.0 host interface × 2 ports (wPHY) •RZ/G series: Full HD, functions: 3D Gfx, vide, OS: Linux (RichOS) •RZ/A series: WXGA and below, functions: 2D Gfx, camera input processing, OS: RTOS

RZ/G Series: Applications RZ/G1M Group The HMI can be made more expressive by making full use of the 3D graphics and video capabilities. RZ/G1M block diagram CPU core • USB 2.0 host interface × 2 ports • ARM® Cortex®-A15, dual-core (PHY) System Package FC-BGA2727-831 Interfaces ARM®Debugger CPU LBSC Max. operating frequency: 1.5GHz • SD host interface × 3 channels (CoreSight) Ex-BUS interface(max 16bit) Cache memory (SDXC and UHS-I support) Cortex®-A15 Cortex®-A15 DMAC 1.5GHz 1.5GHz DBSC • L1 instruction cache: 32KB • Multimedia card interface × 1 channel MMU DDR3L-SDRAM BSC/64bit L1 1$ L1 D$ L1 1$ L1 D$ Intercoms Digital signage Kiosk terminals Vending machines Industrial panels POS Multifunction machines Monitoring cameras Diagnostic panels Monitors in elevators • L1 data cache: 32KB • Serial ATA interface × 2 channels Interrupt Controller 32KB 32KB 32KB 32KB 1ch USB2.0 host 3ch PLL/Module EHCI/OHCI • L2 cache: 1MB Other peripheral functions -standby L2 cache:1024KB NEON/VFPv4 1ch USB2.0 host/function External memory • 32-bit timer × 12 channels High-speed module Timers Memory 3ch SDHI • Ability to connect DDR3L-SDRAM • PWM timer × 7 channels Support SDXC Watchdog Timer RAM0 RAM1 RAM2 RZ/G Series: Solutions from Partner Companies via DDR dedicated bus • I2C bus interface × 9 channels 72KB 4KB 256KB 1ch MMCIF Timer pulse Unit 9ch I2C 4ch/output PWM Partner companies provide a variety of services to support developers using the RZ/G series, including GUI frameworks, • Max. operating frequency: • Serial communication interface 15ch SCIF Graphic IPs 800MHz (SCIF) × 15 channels Compare match Timer0 3ch MSIOF middleware, OS support, board design support, and sales of evaluation and mass production boards. 2ch/16/32bit selectable 3DGE FDP1 QSPI • Data bus width: 32 bits × 2 channels • Quad serial peripheral interface (PowerVR SGX544MP2) De-interiacing module Single/Dual/Quad-SPI Compare match Timer1 External expansion (QSPI) × 1 channel (boot support) 8ch/16/32/48bit selectable VSP1 2D-DMAC 3ch HSCIF Input Format Converter Image extraction GPIO Image Processor Development environments, emulators • Ability to connect ash ROM or • Clock-synchronous serial interface Timer Unit image rotation/inversion *1 4sets of 3ch 32bit timer Output Format Converter 1ch USB3.0 host SRAM directly (MSIOF) × 3 channels (SPI/IIS VIN Serial-ATA*1 *2 ARM Ltd. DS-5 (development studio 5) development environment, ARM CC DSTREAM™ JTAG emulator 7ch PWM timer VCP3 3ch Video inputs *2 1lane PCI-Express • Data bus width: 8/16 bits support) Multi-codec module Computex Co., Ltd. PALMiCE3 JTAG emulator 1920×1080@60×1ch DU LVDS • PCI Express 2.0 (1 lane) • Ethernet controller with AVB Network Digital RGB 2ch outputs dot clock~148.5MHz TSIF Kyoto Microcomputer Co., Ltd. PARTNER-Jet2 JTAG emulator, internal bus load, Linux debugging and dynamic analysis tool 3D graphics support (support for IEEE 2ch CAN THS/TSC Ethernet AVB*3 Themal Sensor Yokogawa Digital Computer Corporation adviceLUNA II JTAG emulator, dynamic text/analysis tool, CAN logger, ash programmer • PowerVR™ SGX544MP2 802.1BA, IEEE 802.1AS, IEEE 100 and 1000Mbps Video functions 802.1Qav, and IEEE 1722, Ethernet MAC*3 Audio IPs Starter kits, evaluation boards, platforms, etc. 10 and 100Mbps • Video display interface × 2 channels GMII/MII interface, PHY device 10ch SSI Atmark Techno, Inc. Armadillo-EVA 1500 RZ/G1M evaluation board (1 channel: LVDS, 1 channel: RGB888) connection support) Serial Sound Interface Power supply voltage (typ.) 10ch SRC Hitachi ULSI Systems Co., Ltd. Solution Engine G1, T-Kernel support, middleware • Video input interface × 3 channels • Ethernet controller 1.8 V:(ETM, SD, LVCMOS I/F, Xtal, JTAG, Trace and RST) Sampling Rate Converter 1.03 V:(core, SATA, PCI Express, USB3.0) OS, middleware, tools • Video codec module: VCP3 (IEEE 802.3u–compliant MAC 1.35 V:(DDR3-I/O SSTL Mode:DDR3L) ADG 3.3 V:(Others) Audio clock generator Access Co., Ltd. ACCESS Connect and HTML browser for IoT • IP converter module on-chip, RMII interface, ability to 1. Since the PHY is used by both, the user must select either the USB 3.0 or SATA0 function. eSOL Co., Ltd. TRON real-time OS, tools, and middleware with functional safety support • Video image processing functions connect to PHY device) 2. Since the PHY is used by both, the user must select either the (color conversion, image • Controller area network (CAN) PCI-e or SATA1 function. Lineo Solutions, Inc. “Ultra" high-speed activation and Linux support 3. Due to pin matching, the user must select one or the other. enlargement/reduction, ltering) interface × 2 channels Miracle Linux Corporation Custom Linux distributions and support Audio functions • Interrupt controller (INTC) Note: This information is subject to change without notice. Software Research Associates, Inc. “Qt" GUI framework support, development support • Sampling rate converter × 10 channels • Clock generator (CPG): on-chip • Serial sound interface × 10 channels PLL Storage interfaces • On-chip debug function • USB 3.0 host interface × 1 port (PHY) RZ/T Series: Roadmap R-IN engine

RZ/T1 Cortex®-R4(600/450MHz) RZ/T-next 32-bit (TBD) Protocol Memory Header RTOS R-IN Engine general-purpose Checksum MCU processing coping sorting processing RZ/T1 Cortex®-R4(600/450MHz) RZ/T series 512K TCM + 1MB RAM for Real-time Ctrl. RZ/T1 RTOS accelerator Cortex®-R4(450MHz) 512K TCM R-IN Protocol Ethernet accelerator that performs standard engine processing Ethernet processing in hardware 2014 2015 2016 2017 2018 CY

Easy to change the protocol because processing is done in software

High-speed, energy-efﬁcient communication Flexible support for multiple protocols RZ/T Series Features

• R-IN engine industrial Ethernet communication accelerator performs standard Ethernet processing in hardware. High-performance, high-speed real-time control • Network processing is up to four times as fast. R-IN engine Integrated peripheral functions

Integrated peripheral functions High-performance, high-speed real-time control

Factory Factory Automation ASSP (EtherCAT, etc) Automation ASSP (EtherCAT, etc) Unnecessary Cortex®-R4 Processor with FPU Network Network Interrupt IRQ Tightly Coupled Memory (ATCM) CPU Core Conventional MCU RZ/T1 VIC 512KB (w/ ECC) 450MHz/600MHz IRQADDR R-IN PWM Timers PWM Timers IGBT IGBT 64 engine (MTU3a, GPT) Single-precision/ Tightly Coupled Memory (BTCM) double-precision 32KB (w/ ECC) FPU Address for Interrupt 64 Service Routine Incorporation CPU Motor of peripheral CPU Motor functions Instruction cache Data cache (w/ ECC) (w/ ECC) Multi- Bus interface Absolute protocol Absolute Cache Encoder TCM encoder Encoder GPIO or SIO interface

Bus master interface Bus slave interface FPGA FPGA Unnecessary (encoder interface) (encoder interface) • High-speed RAM directly connected to the CPU for high-speed processing and dependable real-time responsiveness without caching • The encoder interface was external with conventional FPGA or ASIC approaches but is now integrated on-chip. • ECC for enhanced reliability • This one-chip AC servo solution helps reduce the component count and save space. • Vectored Interrupt Controller (VIC) to assure interrupt responsiveness suitable for embedded control RZ/T Series Application Fields RZ/T1 (Products without R-IN Engine) RZ/T1 (Products without R-IN Engine) block diagram

High-speed operation at 450MHz or 600MHz provides higher performance and improved functionality for industrial High performance CPU (ARM® Cortex®-R4) equipment such as industrial motors or AC servo drivers. Products incorporating the R-IN engine accelerator for industrial • Operating frequency: 450MHz/600MHz • High-performance, high-speed real-time control Ethernet communication can also handle a variety of industrial Ethernet processing tasks without sacricing real-time • Single-precision/double-precision oating-point unit performance. On-chip memory • Tightly Coupled Memory: 512KB (w/ ECC) + 32KB (w/ ECC) • Expanded RAM: 1MB, w/ ECC (option) Package 176-pin QFP 20mm×20mm/0.4mm pitch Features 320-pin BGA 17mm×17mm/0.8mm pitch • EtherCAT slave controller (option) CPU • PWM timers: MTU3a, GPT Cortex®-R4 Processor with FPU 450MHz/600MHz • Encoder interface (Endat 2.2/BiSS-B/BiSS-C/Nikon A-Format)(option) 1.2V (Core), 3.3V (I/O) • High Speed USB FPU MPU Debug VIC • Secure boot (option) Memory • Safety functions Industrial motors Industrial controllers Robots Actuators AC servo drivers ATCM : 512KB with ECC – ECC memory BTCM : 32KB with ECC – CRC (32-bit) I Cache : 8KB w/ ECC D Cache : 8KB w/ ECC – Independent WDT: Operating on dedicated on-chip oscillator • ∆∑ interface Extended RAM : 1MB w/ ECC(option) • 100Mbps EtherMAC (with Ethernet switch) System Interfaces • Ethernet accelerator 2 × 16ch DMAC 5 × SCIF • Power supply voltage: 1.2V, 3.3V JTAG w/disable function 2 × I2C 2 × CAN Package CGC 1 × EthernetMAC • FBGA 320pin(17mm¨,0.8mm pitch) (100Mbps) Timers With switch+IEEE1588* RZ/T1 (Products with R-IN Engine) block diagram • QFP 176pin(20mm¨,0.4mm pitch) 8 × 16-bit + 1 × 32-bit USB2.0 HS(Host/Func) RZ/T1 (Products with R-IN Engine) MTU3a GPIO 4 × 16-bit CMT ∆∑ I/F High performance CPU (ARM® Cortex®-R4 Processor with FPU) 2 × 32-bit CMT2 EtherCAT Slave Controller (option) Memory Interfaces • Operating frequency: 450MHz/600MHz 4 × 16-bit GPT 1 × WDT 4 × SPI • High-performance, high-speed real-time control 1 × iWDT QSPI(Flash I/F) with Direct Access from CPU • Single-precision/double-precision oating-point unit 12 × 16-bit TPU* SRAM I/F(32-bit bus) 2 × 4gr × 4-bit PPG* On-chip memory SDRAM I/F(32-bit bus) • Tightly Coupled Memory: 512KB (w/ ECC) + 32KB (w/ ECC) Burst ROM I/F(32-bit bus) Safety • R-IN engine instruction memory: 512KB (w/ ECC) + data memory: 512KB (w/ ECC) Package 320-pin BGA 17mm×17mm/0.8mm pitch Safety feature Analog Features CPU Secure boot(option) (8 + 16) × 12bit ADC* • Industrial Ethernet communication accelerator with multi-protocol support (R-IN engine) Cortex®-R4 Processor with FPU 450MHz/600MHz Interfaces • EtherCAT slave controller 1.2V(Core), 3.3V(I/O) Encoder interfaces(option) • PWM timers: MTU3a, GPT FPU MPU Debug VIC

• Encoder interface (Endat 2.2/BiSS-B/BiSS-C/Nikon A-Format)(option) * 176-pin QFP: 12-bit ADC × 8 channels, TPU × 6 channels, PPG × 1 • High Speed USB Memory unit, Ethernet × 1 port ATCM : 512KB with ECC • Secure boot (option) BTCM : 32KB with ECC • Safety functions I Cache : 8KB w/ ECC D Cache : 8KB w/ ECC – ECC memory

– CRC (32-bit) R-IN Engine CPU – Independent WDT: Operating on dedicated on-chip oscillator Cortex®-M3 • ∆∑ interface 150MHz 1.2V(Core), 3.3V(I/O) • 100Mbps EtherMAC (with Ethernet switch) MPU Debug NVIC • Ethernet accelerator HW-RTOS Accelerator • Power supply voltage: 1.2V, 3.3V Package Memory • FBGA 320pin(17mm¨,0.8mm pitch) Instruction RAM : 512KB with ECC Data RAM : 512KB with ECC

System Interfaces 2 × 16ch DMAC 5 × SCIF 2 JTAG w/disable function 2 × I C CGC 2 × CAN 1 × EthernetMAC (100Mbps) Timers With switch+IEEE1588 8 × 16-bit+1×32-bit USB 2.0 HS (Host/Func) MTU3a GPIO 4 × 16-bit CMT ∆∑ I/F EtherCAT Slave Controller 2 × 32-bit CMT2 4 × 16-bit GPT Memory Interfaces 1 × WDT 4 × SPI QSPI(Flash I/F)with 1 × iWDT Direct Access fromCPU 12 × 16-bit TPU SRAM I/F(32-bit bus) 2 × 4gr× 4-bit PPG SDRAM I/F(32-bit bus) Burst ROM I/F(32-bit bus) Safety Safety Feature Analog Secure boot(option) (8 + 16) × 12bit ADC

Interfaces Encoder interfaces (option) Utilizing the ARM® Ecosystem e2 studio: Integrated Development Environment Based on Eclipse

2 Utilizing Renesas’ Experience and the ARM® Ecosystem e studio is an integrated development environment based on the Eclipse open source integrated development environment and CDT plug-ins supporting development in C/C++. The version of e2 studio that is compatible with the RZ/T series provides support for a code generation plug-in.

C/C++ perspective: code generation plug-in A code generation plug-in is available that enables the user to generate device driver programs for peripheral functions of Renesas microcontrollers (timers, UART, A/D converter, etc.) by entering settings in a graphical user interface. It is possible to Customers can benefit from solutions combining Renesas’ accumulated experience in the microcontroller industry and the specify the processing of multiplexed pins in a pin table and view a pin assignment global ecosystem of ARM® partners. Products such as development environments, OS, and middleware are available from diagram to confirm the settings. partner companies supporting the RZ/T series. AP4: Code Generation Support Tool RZ/T Series: Development Environments (Integrated Development Environments) AP4 is a standalone tool that automatically generates peripheral function control programs (device driver programs) based on settings entered by the user. The build tool (compiler) is selectable. This makes it possible to Development • IAR Embedded • DS-5 • e2studio*1 Workbench generate peripheral function control program code to match a specific build environments for ARM tool and enables interoperation with integrated development environments. The version of AP4 that is compatible with the RZ/T series can generate Compilers • IAR C/C++ compiler*2 • ARM CC*3 • KPIT GNU tool*4 compatible source code for IAR Embedded Workbench from IAR Systems, Other tools • AP4 code generation tool • AP4 code generation tool • Code generation function from Renesas is compatible. from Renesas is compatible. available as a plug-in. Development Studio (DS-5™) from ARM®, and e2 studio (KPIT GNU Tools).

ICEs • I-jet • DSTREAM™ • J-Link LITE • JTAGjet-Trace • ULINKpro™ • J-Link series • Automatically generates microcontroller peripheral from Segger *5 AP4 • ULINKproD™ function control programs (device driver programs). • ULINK2™ • Outputs integrated development environment workspace ﬁles and program ﬁles. *1. Eclipse-based development environment from Renesas (http://japan.renesas.com/e2studio) *2. The IAR C/C++ compiler is available in two free versions: one is limited to a code size of 32KB but has no time limit, and the other provides full Code functionality but is limited to 30 days of use. UART Timer CSI Automatic generation of User application *3. ARM CC is available in a free evaluation version that provides full functionality but is limited to 30 days of use. Contact a DS-5 sales agent for details. peripheral settings Generator A/D Port Software *4. GNU tools for RZ/T1 and technical support are provided by KPIT Technologies Ltd. (http://www.kpitgnutools.com/index.php). D/A Middleware

*5. Renesas does not handle ICEs from Segger. Contact a sales agent for details. DMA Clock Device driver RTOS Microcontroller RZ/T Series: Development Tools (Debuggers, ICEs)

Integrated Debuggers • PARTNER-Jet2 • microVIEW-PLUS • Code Stage V3 • CSIDE version 6 Development Environment e² studio Debugger Compiler Note: Compatible source code can be generated for IAR Embedded Workbench from IAR Systems, Development Studio (DS-5™) from ARM®, and e2 studio (KPIT ICEs • adviceLUNA II • DW-A1 • PALMiCE*3 GNU Tools). • DS-A1

Compatible • exeGCC • ARM CC*2 • ARM CC*2 • ARM CC*2 compilers from Kyoto Microcomputer • KPIT GNU tool,*1 etc. • IAR C/C++ compiler*3 • IAR C/C++ compiler*3 • KPIT GNU tool*1 *1 *1 • ARM CC2 • KPIT GNU tool, etc. • KPIT GNU tool, etc. • IAR C/C++ compiler,*3 etc.

*1. GNU tools for RZ/T1 and technical support are provided by KPIT Technologies Ltd. (http://www.kpitgnutools.com/index.php). *2. ARM CC is available in a free evaluation version that provides full functionality but is limited to 30 days of use. Contact a DS-5 sales agent for details. *3. The IAR C/C++ compiler is available in two free versions: one is limited to a code size of 32KB but has no time limit, and the other provides full functionality but is limited to 30 days of use. Memo

RZ/T Series: Solutions from Partner Companies

An extensive selection of solutions is available for the RZ/T series from tool vendors, including compilers, emulators, evaluation boards, and industrial Ethernet protocols. This provides support for a wide range of customer requirements.

Development environments, compilers, code generation and evaluation support ARM Ltd. DS-5 (development studio 5) development environment, ARM CC Atollic AB TrueSTUDIO development environment eSOL Co., Ltd. eBinder development environment IAR Systems EWARM (development environment, compiler, C-SPY debugger) KPIT Technologies Ltd. GNU tools, C compiler Emulators and related products ARM Ltd. DSTREAM™, ULINKpro™, ULINKproD™, and ULINK2™ JTAG emulators Bitran Corporation Code Debugger DS-A1 JTAG emulators, Debug Writer DW-A1 Computex Co., Ltd. PALMiCE3 JTAG emulator, CSIDE, CodeRecoder dynamic text tool IAR Systems I-jet JTAG emulator Kyoto Microcomputer Co., Ltd. Partner-Jet2 JTAG emulator SEGGER Microcontroller GmbH & Co. KG J-Link and J-Link Lite JTAG emulators Yokogawa Digital Computer Corporation adviceLUNA II JTAG emulator, TRQerS dynamic text/analysis tool Starter kits, evaluation boards, platforms, etc. AlphaProject Co., Ltd. AP-RZT-0A (RZ/T1) embedded board Core Corporation Evaluation board and application development Shimafuji Electric Inc. Contract development and mass production: Evaluation board development, middleware OS A.I. Corporation TOPPERS speci cation RTOS eForce Co., Ltd. RTOS μC3 eSOL Co., Ltd. RTOS eT-Kernel Micrium, Inc. RTOS μC/OS-III MiSPO Co., Ltd. RTOS NORTi Professional (RZ/ADS), NORTi Professional(RZ/EW) Middleware, tools acontis technologies GmbH EC-Master EtherCAT master stack Data Technology Inc. Cente series embedded middleware eForce Co., Ltd. μNet3 standard TCP/IP stack eSOL Co., Ltd. Middleware ( le system, USB, network) JSL Technology Co.,Ltd. JS-EtherCAT Professional SDK for RZ/T1 EtherCAT slave stack Molex Inc. Protocol sales (EtherNet/IP, PROFINET RT) Synopsys, Inc. Software veri cation tools and simulation tools RZ Speciﬁcations RZ Speciﬁcations RZ/A1H (256-pin to 324-pin) RZ/A1M (256-pin to 324-pin)

Group name RZ/A1H Group name RZ/A1M Pin count 256-pin 324-pin Pin count 256-pin 324-pin Product name R7S721000VCBG R7S721000VCFP R7S721000VLFP R7S721001VCBG R7S721001VLBG Product name R7S721010VCBG R7S721010VCFP R7S721010VLFP R7S721011VCBG R7S721011VLBG CPU core ARM® Cortex®-A9 CPU core ARM® Cortex®-A9 RAM (bytes) 10M RAM (bytes) 5M Cache memory Primary cache:64KB(instruction32KB/data32KB), Cache memory Primary cache:64KB(instruction32KB/data32KB), TLB128 Secondary cache:128KB(Corelink™ Level 2 Cache Controller L2C-310) TLB128 Secondary cache:128KB(Corelink™ Level 2 Cache Controller L2C-310) Max. operating frequency (MHz) 400 Max. operating frequency (MHz) 400 Subclock (external: 32.768kHz) YES Subclock (external: 32.768kHz) YES PLL YES PLL YES Real-time clock YES Real-time clock YES Power-on reset YES Power-on reset YES Floating-point unit YES Floating-point unit YES DMA DMAC × 16 ch DMA DMAC × 16 ch External memory interfaces Serial ash (eXecute-In-Place(XIP) support), SRAM, SDRAM, burst ROM, NAND ash External memory interfaces Serial ash (eXecute-In-Place(XIP) support), SRAM, SDRAM, burst ROM, NAND ash External interrupt pins 148 180 External interrupt pins 148 180 I/O ports 139 171 I/O ports 139 171 16-/32-bit timer (channels) 5/2 16-/32-bit timer (channels) 5/2 Watchdog timer (channels) 1 Watchdog timer (channels) 1 Other timers Motor Controll PWM Timer × 8 Other timers Motor Controll PWM Timer × 8 PWM output 16 PWM output 16 3-phase PWM output function YES 3-phase PWM output function YES 12-bit A/D converter (channels) 8 12-bit A/D converter (channels) 8 CAN (channels) 5 CAN (channels) 5 Ethernet YES Ethernet YES Ethernet AVB YES Ethernet AVB YES USB host function YES USB host function YES USB peripheral function YES USB peripheral function YES USB (channels) 2 USB (channels) 2 USB High Speed support YES USB High Speed support YES USB endpoints 16 USB endpoints 16 USB isochronous transfer support YES USB isochronous transfer support YES USB additional information Low-speed Support(Host only) USB additional information Low-speed Support(Host only) SD host interface (channels) 2 SD host interface (channels) 2 MMC host interface (channels) 1 MMC host interface (channels) 1 Clock-synchronous serial interface (channels) 17 Clock-synchronous serial interface (channels) 17 SPI (channels) 5 SPI (channels) 5 UART (channels) 8 UART (channels) 8 I2C (channels) 4 I2C (channels) 4 LIN (channels) 2 LIN (channels) 2 IEBus (channels) 1 IEBus (channels) 1 Serial additional information SCIF(CSI:8ch/UART:8ch), SCI(CSI:2ch), RSPI(SPI:5ch), SPI multi(SPI:2ch), SSI(CSI:6ch), SPDIF(CSI:1ch) Serial additional information SCIF(CSI:8ch/UART:8ch), SCI(CSI:2ch), RSPI(SPI:5ch), SPI multi(SPI:2ch), SSI(CSI:6ch), SPDIF(CSI:1ch) Other display functions VDC5: WXGA(1280 × 768), JPEG Engine, OpenVG Accelera to r(2D) Other display functions VDC5: WXGA(1280 × 768), JPEG Engine, OpenVG Accelera to r(2D) Power supply voltage (V) 3.3V/1.18V Power supply voltage (V) 3.3V/1.18V

Power supplies VCC = PLLVCC = LVDSPLLVCC = USBAVCC = USBUVCC = USBDVCC = 1.10 to 1.26 V, Power supplies VCC = PLLVCC = LVDSPLLVCC = USBAVCC = USBUVCC = USBDVCC = 1.10 to 1.26 V, PVCC = AVCC = USBAPVCC = VDAVCC = LVDSAPVCC = USBDPVCC = 3.0 to 3.6 V, PVCC = AVCC = USBAPVCC = VDAVCC = LVDSAPVCC = USBDPVCC = 3.0 to 3.6 V, VSS = AVSS = 0 V VSS = AVSS = 0 V

Operating temperature (°C) TA = -40 to 85°C Operating temperature (°C) TA = -40 to 85°C Package (size [mm]) 256-LFBGA Package (size [mm]) 256-LFBGA 256-LFQFP(28 × 28mm) 324-FBGA(19 × 19mm) 256-LFQFP(28×28mm) 324-FBGA(19×19mm) (11 × 11mm) (11×11mm) RZ Speciﬁcations RZ Speciﬁcations RZ/A1L (176-pin to 208-pin) RZ/A1LU (176-pin to 208-pin)

Group name RZ/A1L Group name RZ/A1LU Pin count 176-pin 208-pin Pin count 176-pin 208-pin Product name R7S721020VCBG R7S721020VCFP R7S721020VLFP R7S721021VCFP R7S721021VLFP Product name R7S721030VCBG R7S721030VCFP R7S721030VLFP R7S721031VCFP R7S721031VLFP CPU core ARM® Cortex®-A9 CPU core ARM® Cortex®-A9 RAM (bytes) 3M RAM (bytes) 3M Cache memory Primary cache:64KB(instruction32KB/data32KB), Cache memory Primary cache:64KB(instruction32KB/data32KB), TLB128 Secondary cache:128KB(Corelink™ Level 2 Cache Controller L2C-310) TLB128 Secondary cache:128KB(Corelink™ Level 2 Cache Controller L2C-310)

Max. operating frequency (MHz) 400 Max. operating frequency (MHz) 400 Subclock (external: 32.768kHz) YES Subclock (external: 32.768kHz) YES PLL YES PLL YES Real-time clock YES Real-time clock YES Power-on reset YES Power-on reset YES Floating-point unit YES Floating-point unit YES DMA DMAC × 16 ch DMA DMAC × 16 ch External memory interfaces Serial ash (eXecute-In-Place(XIP) support), SRAM, SDRAM, burst ROM External memory interfaces Serial ash (eXecute-In-Place(XIP) support), SRAM, SDRAM, burst ROM External interrupt pins 109 131 External interrupt pins 109 131 I/O ports 100 122 I/O ports 100 122 16-/32-bit timer (channels) 5/2 16-/32-bit timer (channels) 5/2 Watchdog timer (channels) - Watchdog timer (channels) 1 Other timers - Other timers - PWM output - PWM output - 3-phase PWM output - 3-phase PWM output - 12-bit A/D converter (channels) 8 12-bit A/D converter (channels) 8 CAN (channels) 2 CAN (channels) 2 Ethernet YES Ethernet YES Ethernet AVB - Ethernet AVB YES USB host function YES USB host function YES USB peripheral function YES USB peripheral function YES USB (channels) 2 USB (channels) 2 USB High Speed support YES USB High Speed support YES USB endpoints 16 USB endpoints 16 USB isochronous transfer support YES USB isochronous transfer support YES USB additional information Low-speed Support(Host only) USB additional information Low-speed Support(Host only) SD host interface (channels) 2 SD host interface (channels) 2 MMC host interface (channels) 1 MMC host interface (channels) 1 Clock-synchronous serial interface (channels) 12 Clock-synchronous serial interface (channels) 12 SPI (channels) 3 SPI (channels) 3 UART (channels) 5 UART (channels) 5 I2C (channels) 4 I2C (channels) 4 LIN (channels) 1 LIN (channels) - IEBus (channels) 1 IEBus (channels) - Serial additional information SCIF(CSI:5ch/UART:5ch), SCI(CSI:2ch), RSPI(SPI:2ch), SPI multi(SPI:1ch), SSI(CSI:4ch), SPDIF(CSI:1ch) Serial additional information SCIF(CSI:5ch/UART:5ch), SCI(CSI:2ch), RSPI(SPI:2ch), SPI multi(SPI:1ch), SSI(CSI:4ch), SPDIF(CSI:1ch) Other display functions VDC5: XGA(1024 × 768) Other display functions VDC5: XGA(1024 × 768), JPEG Engine Power supply voltage (V) 3.3V/1.18V Power supply voltage (V) 3.3V/1.18V

Operating temperature (°C) TA = -40 to 85°C Operating temperature (°C) TA = -40 to 85°C Package code 176-LFBGA Package code 176-LFBGA (8×8mm) 176-LFQFP(24×24mm) 208-LFQFP(28×28mm) (8×8mm) 176-LFQFP(24×24mm) 208-LFQFP(28×28mm) RZ Speciﬁcations RZ Speciﬁcations RZ/G1E (501-pin) RZ/G1M (831-pin)

Group name RZ/G1E Group name RZ/G1M Pin count 501-pin Pin count 831-pin Product name R8A77450HA01BG Product name R8A77430HA01BG CPU core ARM® Cortex®-A7 CPU core ARM® Cortex®-A15 RAM (bytes) RAM0 of 72 Kbytes / RAM1 of 4 Kbytes / RAM2 of 256 Kbytes RAM (bytes) RAM0 of 72 Kbytes / RAM1 of 4 Kbytes / RAM2 of 256 Kbytes Cache memory L1 I/D cache 32/32 Kbytes, L2 cache 512 Kbytes Cache memory L1 I/D cache 32/32 KBytes, L2 cache 1024 Kbytes Max. operating frequency (GHz) 1.0 Max. operating frequency (GHz) 1.5 Subclock (external: 32.768kHz) - Subclock (external: 32.768kHz) - PLL YES PLL YES Real-time clock YES Real-time clock YES Power-on reset YES Power-on reset YES Floating-point unit YES Floating-point unit YES DMA LBSC DMAC : 3ch/ DMA LBSC DMAC : 3ch/ SYS-DMAC : 30ch/ SYS-DMAC : 30ch/ Audio-DMAC : 13ch/ Audio-DMAC : 26ch/ Audio(peripheral)-DMAC : 29ch Audio(peripheral)-DMAC : 29ch External bus expansion YES External bus expansion YES External interrupt pins 10 External interrupt pins 10 I/O ports 208 I/O ports 244 16-/32-bit timer (channels) 4/12 16-/32-bit timer (channels) 4/12 Watchdog timer (channels) 1 Watchdog timer (channels) 1 Other timers Compare match timer0(CMT0)× 2 Other timers Compare match timer0(CMT0)× 2 Compare match timer1(CMT1)× 8 Compare match timer1(CMT1)× 8 PWM output 7 PWM output 7 3-phase PWM output - 3-phase PWM output - 12-bit A/D converter (channels) - 12-bit A/D converter (channels) - CAN (channels) 2 CAN (channels) 2 Ethernet YES Ethernet YES USB host function YES USB host function YES USB peripheral function YES USB peripheral function YES USB (channels) USB (channels) USB3.0 Host × 1 USB2.0 Host × 1 / Host/Function × 1 USB2.0 Host × 1 / Host/Function × 1 USB High Speed support YES USB High Speed support YES USB endpoints 16 USB endpoints 16 USB isochronous transfer support YES USB isochronous transfer support YES USB additional information - USB additional information - Clock-synchronous serial interface (channels) 3 Clock-synchronous serial interface (channels) 3 SPI (channels) 1 SPI (channels) 1 UART (channels) 18 UART (channels) 18 I2C (channels) 8 I2C (channels) 9 LIN (channels) - LIN (channels) - IEBus (channels) - IEBus (channels) - Serial additional information SCIF:6ch, SCIFA:6ch, SCIFB:3ch, HSCIF:3ch, MSIOF:3ch, QSPI:1ch Serial additional information SCIF:6ch, SCIFA:6ch, SCIFB:3ch, HSCIF:3ch, MSIOF:3ch, QSPI:1ch Other display functions PowerVR SGX540(3D) Other display functions PowerVR SGX544MP2(3D) Video signal processor1(VSP1) Video signal processor1(VSP1) Video processing unit(VCP3) Video processing unit(VCP3) Power supply voltage (V) 3.3V/1.8V/1.5V/1.03V Power supply voltage (V) 3.3V/1.8V/1.35V/1.03V Power supplies VDD=0.98 to 1.08V, VCCQ=3.0 to 3.6V, VCCQ33_MLBP=3.0 to 3.6V(3.3V-I/O), Power supplies VDD=0.98 to 1.08V, VCCQ=3.0 to 3.6V, VCCQ33_MLBP=3.0 to 3.6V,VCCQ_SD0 to VCCQ_SD3,VCCQ_MMC_SD=3.0 to 3.6V, VCCQ_SD0 to VCCQ_SD3,VCCQ_MMC_SD=3.0 to 3.6V(3.3V-I/O), VCCQ_ISO=1.7 to 1.9V, VCCQ18=1.7 to 1.9V, VCCQ_SD0 to VCCQ_SD3,VCCQ_MMC_SD=1.7 to 1.9V, VCCQ18=1.7 to 1.9V, VCCQ_SD0 to VCCQ_SD3,VCCQ_MMC_SD=1.7 to 1.9V(1.8V-I/O), VDDQ_LVDS=1.7 to 1.9V, VDDQ_M0,VDDQ_M1,VDDQ_M1A=1.283 to 1.450V, VDDA_SATA0=1.7 to 1.9V, VDDD_SATA0=0.98 to 1.08V, VDDA_SATA1=1.7 to 1.9V, VDDD_SATA1=0.98 to 1.08V, VDDQ_M0,VDDQ_M1,VDDQ_M1A=1.425 to 1.575V, VDD_CPGPLL=1.7 to 1.9V, VDDA_SATA0,VDDA_SATA1=1.7 to 1.9V, VDDD_SATA0,VDDD_SATA1=0.98 to 1.08V, VDD_CPGPLL=1.7 to 1.9V, VDDQ_M0DPLL,VDDQ_M1DPLL,VDDQ_M1MPLL,VDDQ_M0APLL,VDDQ_M1APLL=1.7 to 1.9V, VDDQ_M0DPLL,VDDQ_M1DPLL,VDDQ_M1MPLL,VDDQ_M0APLL,VDDQ_M1APLL=1.7 to 1.9V, AVDD=1.7 to 1.9V, VD331=3.0 to 3.6V, VD181=1.7 to 1.9V DU/DU0_LVDS0/LVDS_PLL1_VCC=1.7 to 1.9V, AVDD=1.7 to 1.9V, VD331=3.0 to 3.6V, VD181=1.7 to 1.9V

Operating temperature (°C) TA = -40 to 85°C Operating temperature (°C) TA = -40 to 85°C Package (size [mm]) 501-FBGA(21×21mm) Package (size [mm]) 831-FBGA(27×27mm) RZ Speciﬁcations RZ Speciﬁcations RZ/T1 (176-pin to 320-pin) RZ/T1 (320-pin)

Group name RZ/T1 Group name RZ/T1 Pin count 176-pin 320-pin Pin count 320-pin Product name R7S910001CFP R7S910002CBG R7S910006CBG R7S910007CBG R7S910011CBG R7S910013CBG Product name R7S910015CBG R7S910016CBG R7S910017CBG R7S910018CBG R7S910025CBG R7S910026CBG R7S910027CBG R7S910028CBG CPU core ARM® Cortex®-R4 Processor with FPU CPU core ARM® Cortex®-R4 Processor with FPU RAM (KB) 544 1568 544 1568 RAM (KB) 1568 Cache memory Primary cache:16KB(instruction8KB/data8KB) Cache memory Primary cache:16KB(instruction8KB/data8KB) Max. operating frequency (MHz) 450 600 450 600 Max. operating frequency (MHz) 450 600 450 600 On-chip oscillator frequency (MHz) 0.24 On-chip oscillator frequency (MHz) 0.24 PLL YES PLL YES Power-on reset YES Power-on reset YES Floating-point unit YES Floating-point unit YES DMA DMAC × 2Unit(16ch × 2) DMA DMAC × 2Unit(16ch × 2) External memory interfaces Serial ash (eXecute-In-Place(XIP) support), SRAM, SDRAM, burst ROM External memory interfaces Serial ash (eXecute-In-Place(XIP) support), SRAM, SDRAM, burst ROM External interrupt pins 20 External interrupt pins 20 I/O ports 97 209 I/O ports 209 16-/32-bit timer (channels) 24/1 16-/32-bit timer (channels) 24/1 Watchdog timer (channels) 2 Watchdog timer (channels) 2 Other timers General PWM Timer × 4 Other timers General PWM Timer × 4 PWM output 4 PWM output 4 3-phase PWM output YES 3-phase PWM output YES 12-bit A/D converter (channels) 1 Unit : 8ch 2 Unit(Unit 0 : 8ch,Unit 1 : 16ch) 12-bit A/D converter (channels) 2 Unit(Unit 0 : 8ch,Unit 1 : 16ch) CAN (channels) 2 CAN (channels) 2 Ethernet 10/100Mbps Ethernet 10/100Mbps R-IN engine - R-IN engine YES - Industrial network - Industrial network Multi Protocol EtherCAT Encoder I/F - YES Encoder I/F ----YES YES YES YES USB host function YES USB host function YES USB peripheral function YES USB peripheral function YES USB (channels) 1 USB (channels) 1 USB High Speed support YES USB High Speed support YES USB endpoints 10 USB endpoints 10 USB isochronous transfer support YES USB isochronous transfer support YES Clock-synchronous serial interface (channels) 9 Clock-synchronous serial interface (channels) 9 SPI (channels) 4 SPI (channels) 4 UART (channels) 9 UART (channels) 9 I2C (channels) 2 I2C (channels) 2 Power supply voltage (V) 3.3V (I/O block), 1.2V (internal) Power supply voltage (V) 3.3V (I/O block), 1.2V (internal)

Power supplies VDD = PLLVDD0 = PLLVDD1 = DVDD_USB = 1.14 to 1.26 V, Power supplies VDD = PLLVDD0 = PLLVDD1 = DVDD_USB = 1.14 to 1.26 V, VCCQ33 = AVCC0 = AVCC1 = VREFH0 = VREFH1 = VDD33_USB = 3.0 to 3.6 V VCCQ33 = AVCC0 = AVCC1 = VREFH0 = VREFH1 = VDD33_USB = 3.0 to 3.6 V

Operating temperature (°C) Tj = -40 to 125°C Operating temperature (°C) Tj = -40 to 125°C

Package (size [mm]) 176-HLQFP Package (size [mm]) 320-FBGA(17×17mm) 320-FBGA(17×17mm) (20×20mm) Package Lineup RenesasPresents, the ofﬁcial Renesas YouTube channel

HLQFP LFQFP https://www.youtube.com/user/RenesasPresents

176 PIN 176 208 256 PIN PIN PIN

176-HLQFP (20×20mm) Pitch 0.40mm 176-LFQFP (24×24mm) 208-LFQFP (28×28mm) 256-LFQFP (28×28mm) Thickness (max.) 1.70mm Pitch 0.50mm Pitch 0.50mm Pitch 0.40mm Mounted product RZ/T1 Thickness (max.) 1.70mm Thickness (max.) 1.70mm Thickness (max.) 1.70mm Mounted product RZ/A1L,A1LU Mounted product RZ/A1L,A1LU Mounted product RZ/A1H,A1M

FBGA

320 PIN 324 501 PIN PIN 320-FBGA (17×17mm) 324-FBGA (19×19mm) 501-FBGA (21×21mm) Pitch 0.80mm Pitch 0.80mm Pitch 0.80mm Thickness (max.) 2.30mm Thickness (max.) 2.10mm Thickness (max.) 2.40mm Mounted product RZ/T1 Mounted product RZ/A1H,A1M Mounted product RZ/G1E

LFBGA

176 256 PIN PIN

176-LFBGA (8×8mm) 256-LFBGA (11×11mm) Pitch 0.50mm Pitch 0.50mm Thickness (max.) 1.40mm Thickness (max.) 1.40mm 831 Mounted product RZ/A1L,A1LU Mounted product RZ/A1H,A1M 831-FBGA PIN (27×27mm) Pitch 0.80mm Thickness (max.) 2.40mm Mounted product RZ/G1M Renesas Microprocessor RZ Family Catalog