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Experimental Investigation of Gravity-Driven Two-Phase Cooling for Power Electronics Applications

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Experimental Investigation of Gravity-Driven Two-Phase Cooling for Power Electronics Applications Experimental Investigation of Gravity-Driven Two-Phase Cooling for Power Electronics Applications Devin Pellicone, Advanced Cooling Technologies, Inc., Lancaster, PA USA, [email protected] Abstract Passive cooling approaches are ideal for high Heat is applied to the loop through the reliability systems, like most power electronics evaporator. The evaporator could take on any applications, because they require no moving number of forms to cool the system in question. parts and little maintenance. Two-phase cooling The most common configuration for the systems have offered these benefits to system evaporator is a traditional-looking liquid cold designers for decades through capillary-based plate in which heat generating components are products like heat pipes. The boiling and mounted and the heat is conducted into the condensation process within a two-phase system. An example of such a configuration is system is very effective at moving heat with shown in Figure 2 for a traditional power minimal temperature gradient. However, electronics cooling application. The functionality capillary-based two-phase systems are not able of an LTS is mostly agnostic to the form of the to handle the high demands of current power evaporator, so many variations of an evaporator electronics applications. Some gravity-based are possible. two-phase cooling solutions, like loop thermosyphons, provide a higher performance alternative to current passive cooling solutions. This paper will discuss the recent developments and experimental evaluation of a gravity-driven two-phase cooling solution for medium voltage drive applications. Various performance parameters like fluid charge and working fluid were examined to determine their effect on system flow rate, thermal resistance, local heat transfer coefficient, and maximum power capability. Figure 1. Schematic representation of a (a) traditional 1. Background Thermosyphon and a (b) Loop Thermosyphon A typical LTS consists of an evaporator, a condenser, and plumbing between the two for In the “off state” the loop sits idle with an equal the liquid and vapor to travel. The liquid return height of liquid filling the downcomer (h2) and line (or downcomer) is connected to the evaporator cavity (h1). As heat is applied to the evaporator cavity to facilitate the flow of the evaporator region of the loop, vapor bubbles are working fluid. In a similar fashion, the vapor line generated in the flow as the latent heat of the (or riser) is connected to the condenser working fluid absorbs the applied energy. These completing the loop. The system is hermetically bubbles (or voids) serve to reduce the effective sealed and filled with a particular inventory of density of the liquid column inside of the working fluid. Working fluids are typically evaporator resulting in a net pressure head dielectric refrigerants with high liquid-to-vapor difference between the downcomer and the density ratios and high latent heat. The reason evaporator. As more heat is applied to the for selecting fluids with these properties is system, more of the liquid in the evaporator is because flow in the loop is driven by the density converted into vapor further reducing the difference between the downcomer and riser. effective density and driving more fluid flow. The Larger differences between liquid and vapor maximum amount of fluid flow, and states results in a larger driving force and more corresponding power input, is determined by the fluid flow rate. available height difference between the evaporator and condenser (h2-h1). sends 100% quality vapor to the condenser and only saturated liquid (i.e. quality = 0) is returned to the evaporator. In this case the maximum power that a heat pipe can carry is directly proportional to the latent heat of the working fluid. Since excess liquid is virtually guaranteed in an LTS, the maximum power handing capability can far exceed that of a heat pipe provided that sufficient vertical height is available. The intention of this work is to explore the performance limitations of a loop thermosyphon solution in a power electronics application. The following sections describe the experimental Figure 2. Example of a Loop Thermosyphon for apparatus used to evaluate the effect working power electronics cooling applications fluid and power input have on several performance metrics. It is useful to define a term, void ratio, to refer to the ratio of void space in the evaporator to the volume still occupied by liquid. As more heat is applied to the LTS, the void ratio approaches 1 2. Experimental Apparatus (or 100%). At this point the maximum height A prototype loop thermosyphon and testing gradient between the condenser and evaporator apparatus was developed to investigate the is achieved because there is no more liquid head effect of various design parameters on the inside of the evaporator (i.e. h = 0). As shown in 1 performance of the system. Figure 4 illustrates Figure 3, this point near maximum void fraction is not necessarily a point of dryout (or maximum the testing apparatus that was used during the vapor quality) like would be seen in other study. An evaporator assembly was fabricated passive two-phase systems. Since void fraction is a density-driven term, fluids with low vapor densities and relatively high latent heat will reach a state near maximum voiding before all of the latent heat is consumed (i.e. quality = 1). In practical terms what this means is that an LTS will always operate in an excess liquid flow regime. As shown in Figure 3, the flow rate around the loop could approach its maximum level at a vapor quality of around 0.5. In contrast, heat pipes operate in a binary boiling and condensation process where the evaporator Figure 4. 3D rendering of the experimental Figure 3. (left) void fraction can be highly non-linear apparatus illustrating instrumentation locations with increasing power while quality remains mostly linear. (right) flow rate in the system is mostly tied to from aluminum and instrumented with a turbine void fraction and behaves similarly with respect to flowmeter, temperature and pressure sensors. increasing power The evaporator was attached to a standard copper tube and aluminum fin condenser which 2.1 Data Reduction was instrumented with a pressure and Thermal resistance, for the purposes of this temperature sensor as well. Three copper work, was determined by subtracting the heating blocks were used to simulate power ambient air temperature from the maximum heat electronics modules and the heaters were source temperature from all of the zones and instrumented with three temperature sensors, as dividing it by the total power input, as defined by shown in Figure 5. Finally a fan was installed and Eq. 1. controlled with an external power supply. The air temperature was also monitored by a 푇퐻푒푎푡푒푟,푚푎푥 − 푇퐴푟 푅 Eq. 1 temperature probe located at the condenser 푡ℎ 푃표푤푒푟 inlet. The heat transfer coefficient was estimated locally at each zone by utilizing the local heater block temperature and subtracting off the conduction resistances to the evaporator internal surface. The temperature sensors were located on evaporator external surface so conduction through the thermal interface material and aluminum block were subtracted to obtain the internal surface temperature for convection. The heat transfer coefficient could then be determined by Eq. 2. 푄푍표푛푒 ℎ = Eq. 2 푍표푛푒 퐴 (푇 − 푇 ) 푍표푛푒 푆푢푟푓푎푐푒 퐹푙푢푑 3. Results and Discussion Liquid flow rate is an important factor in Figure 5. An illustration indicating the determining the performance of any LTS locations of heater temperature because it has a major impact on how much heat measurements. can be dissipated. Figure 6 shows the fluid flow rate for both R134a and R245fa as a function of The total power into the system ranged from 0 to power into the evaporator. It can be seen that 6000W for this study. The power was split evenly both fluids exhibit an asymptotic trend of fluid between the heaters in Zone A and Zone B but flow with increasing power. This is to be reduced in Zone C to match the heat flux of expected from a loop thermosyphon. Zones A and B. The heat source for Zone A and Zone B was 190mm x 140mm and the heat source for Zone C was 130mm x 140mm. The As detailed in a previous section, fluid flow in an flow direction of the refrigerant during normal LTS is determined by the density difference operation is from Zone A towards Zone C. between the downcomer and the riser. As more heat is applied to the evaporator the amount of vapor generated increases. The more vapor Two different working fluids were examined; present in the evaporator the higher the void R134a and R245fa. R134a is a standard fraction becomes and the larger the density refrigerant used in the automotive and HVAC difference between the liquid column and the industries and exhibits a relatively high vapor evaporator becomes. The trend is asymptotic pressure relative to R245fa. R245fa has a higher because there is a point where riser becomes latent heat, higher liquid density, and a lower mostly vapor (by volume) and the density vapor density across the entire temperature difference is maximized. The flow rate is range of these fluids. Various fluid inventories maximized at this point and is maintained as were also examined for both fluids, but the long as the density difference is present. results of just the optimal fluid charge are shared here. vapor density. A higher liquid to vapor density ratio would result in a larger possible net density difference to drive the flow. However, in the context of two-phase flow a lower vapor density results in significantly higher vapor velocities and higher pressure drop in the evaporator. The increased pressure drop experienced with R245fa hinders the maximum flow rate achievable in a gravity-driven system like a loop thermosyphon.
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