DOCSLIB.ORG

SCSI Interface Hard Disk Drive RS Stock No

Total Page：16

File Type：pdf, Size：1020Kb

Download full-text PDF Read full-text

Load more

SCSI Interface Hard Disk Drive RS Stock No. 213-7384 and 213-7407 Installation Orientation Figure 1. The drive may be installed in one of five orientations; Inclination from vertical or horizontal should not exceed 5¡. Mounting screw fixing Figure 2. When the mounting screw holes on the side of the drive are used, then use only the two pairs of outer holes. Do not use the centre holes in conjunction with only one of the outer holes. The screw must not penetrate the drive by more than 4 millimetres. Grounding User must ensure that the Disk Enclosure casing is NEVER shorted to the computer systemÕs Frame or DC Ground. Magneto-Resistive Read heads are a significant factor in the achievement of very high capacities in small form factor hard disk drives. Hard Disk Drives with Magneto-Resistive (MR) heads require special handling considerations. The MR head must be electrically biased in order to function, and the drives use +5.5V d.c. The voltage is generated by the drive electronics from the normal +5.5V d.c. and +12V d.c. rails, so standard power supplies and connectors may be used. With the MR head biased in this way, it becomes important to avoid the possibility of discharge between the head and the media, so, in order to ensure operational reliability, the disk enclosure (DE) and hence the platters themselves are also biased to +5.5V d.c. resulting in zero potential difference between head and platter. This means the outer casing of the DE is set at +5.5V d.c. rather than DC ground as would be the case on a conventional drive. The drive features protection against accidental shortening by coating the DE with an electrically insulating material and by removing the earthing tag that would normally be present. Also the drive is protected against damage in the event of accidental shorting through the use of a protection circuit in the head IC. This works by quickly shutting off the bias voltage when it detects a volatge drop. Any read or write operation during this time will result in a hard data error. When the short is removed the bias voltage is automatically restored and read/write operations will again work normally. Pay close attention to the mounting specifications of the drive ensuring that no component of the system is likely to abrade the disk enclosure surface. Cooling Allow space above and below the drive to provide for Figure 3. adequate air flow. Fan cooling is recommended. The disk enclosure temperature, measured at top centre, A should never exceed 50¡C. A. Temperature measurement point Switch settings All configurations marked * are default setting Terminal CN7 PIN# Signal name PIN# Single name Plug Notes 01 GND 02 *S-ID 0 Yes - 03 GND 04 *S-ID 1 Yes - 05 GND 06 *S-ID 2 Yes - 07 GND 08 *SYCIN - Sync pulse 09 N.C. 10 *PCMP - DR-RST when 0V 11 GND 12 *WTP Yes For WT protect 13 GND 14 DISCON Yes For termination 15 LED-V5 16 *LEDSG - For outer LED SCSI ID Setting CN7 PIN 01-02 PIN 03-04 PIN 05-06 SCSI ID OPEN OPEN OPEN 0 SHORT OPEN OPEN 1 OPEN SHORT OPEN 2 SHORT SHORT OPEN 3 OPEN OPEN SHORT 4 SHORT OPEN SHORT 5 OPEN SHORT SHORT 6 SHORT SHORT SHORT 7 Terminal CN6 Function Pin Result Spindle motor control A SHORT Auto start on power up OPEN Controlled by STAR/STOP UNIT command SCSI bus parity check P SHORT* Enabled OPEN Disabled Offline self-diagnostics D SHORT Execute diagnostics OPEN* Normal operation SCSI connector (CN1) pin assignment Figure 4. 1 49 50 A B A. 5V d.c. C. 12V Return D C B. 12V d.c. D. 5V Return Signal Pin Pin Signal GROUND 1 2 -DB0 GROUND 3 4 -DB1 GROUND 5 6 -DB2 GROUND 7 8 -DB3 GROUND 9 10 -DB4 GROUND 11 12 -DB5 GROUND 13 14 -DB6 GROUND 15 16 -DB7 GROUND 17 18 -DBP GROUND 19 20 GROUND GROUND 21 22 GROUND Reserved 23 24 Reserved Open 25 26 TERMPWR Reserved 27 28 Reserved GROUND 29 30 GROUND GROUND 29 30 GROUND GROUND 29 30 GROUND GROUND 33 34 GROUND GROUND 35 36 -BSY GROUND 37 38 -ACK GROUND 39 40 -RST GROUND 41 42 -MSG GROUND 45 46 -C/D GROUND 47 48 -REQ GROUND 49 50 -I/O Functional/Environmental specifications Functional specifications Form factor : 3.5 inch x half height Interface : SCSI-2, fast, single-ended maximum cable length = 6 metres Total storage capacity : RS stock no. 213-7384 RS stock no.213-7407 Formatted : 2.4GB 4.35GB Storage capacity/track Unformatted : 77,214 to 109,173 bytes (in 13 zones) Number of disks : 3 5 Number of heads : 5 DATA + 1 SERVO 9 DATA + 1 SERVO Number of cylinders : 5,713 Recording density : 83,603 - 118,737 bpi Track density : 6,438 tpi Recording method : PR4 ML Data transfer rate Disk drive : 11.3 Mb/sec maximum Asynchronous : 8 bit SCSI: 6Mb/s max./16 bit SCSI: 12Mb/s max. Synchronous : 8 bit SCSI: 10Mb/s max./16 bit SCSI:20Mb/s max. Rotational speed : 7200RPM ± 0.5% Average latency time : 4.17 milliseconds Positioning time (read/write): minimum : 0.8/1.0 milliseconds average : 8.0/9.0 milliseconds maximum : 17.0/18.0 milliseconds Power consumption 8 bit SCSI : Single-ended type 15.4 W typ Differential type 15.8 W typ 16 bit SCSI : Single-ended type 15.5 W typ Differential type 20.0 W typ Outer dimensions Width x height x depth : 101.6mm x 25.4mm x 146.0mm(without bezel) : 104.1mm x 25.4mm X 151.3mm (with bezel) Data buffer : 510 KB FIFO ring buffer and multi-segmented : (1 to 32) buffer with read-ahead cache feature Logical data block length : 180 to 4,1606 bytes (fixed length, selectable in 2 byte boundary settings at initialisation) Weight : 0.6kg MTBF : 1,000,000 power-on hours Motor start/stop time: start : 30 seconds typical stop : 30 seconds or less Environmental specifications Operating Temperature : 5¡C to 50¡C Temperature gradient : 15¡C per hour or less Relative humidity : 20% to 80% RH Altitude range : 0 to 3,000 metres Vibration : Less than 1.0G (5Hz to 250Hz) Shock : Less than 5G (max. 10ms) Non-operating Temperature : -40¡C to 60¡C Temperature gradient : 15¡C per hour or less Relative humidity : 5% to 95% RH Maximum wet bulb temp : 29¡C Altitude range : 0 to 12,000 metres Vibration : Less than 5.0G (5Hz to 250Hz) Shock : Less than 50G (max. 10ms) RS Components Issued July 1996 10543.
Recommended publications
  • Rocketraid 2224 SATAII Host Adapter User's Guide

    Rocketraid 2224 SATAII Host Adapter User's Guide

    RocketRAID 2224 SATAII Host Adapter User’s Guide Revision: 1.0 Date: August 2005 HighPoint Technologies, Inc. HighPoint Technologies, Inc. Copyright Copyright © 2005 HighPoint Technologies, Inc. This document contains materials protected by International Copyright Laws. All rights reserved. No part of this manual may be reproduced, transmitted or transcribed in any form and for any purpose without the express written permission of HighPoint Technologies, Inc. Trademarks Companies and products mentioned in this manual are for identification purpose only. Product names or brand names appearing in this manual may or may not be registered trademarks or copyrights of their respective owners. Backup your important data before using HighPoint's products and use at your own risk. In no event shall HighPoint be liable for any loss of profits, or for direct, indirect, special, incidental or consequential damages arising from any defect or error in HighPoint's products or manuals. Information in this manual is subject to change without notice and does not represent a commitment on the part of HighPoint. Notice Reasonable effort has been made to ensure that the information in this manual is accurate. HighPoint assumes no liability for technical inaccuracies, typographical, or other errors contained herein. ii HighPoint Technologies, Inc. Table of Contents ABOUT THIS GUIDE ............................................................................................................ 1 INTRODUCING THE ROCKETRAID 2224 HOST ADAPTER...............................
  • OLTP Performance Comparison: Solid-State Drives Vs. Hard Disk Drives 2

    OLTP Performance Comparison: Solid-State Drives Vs. Hard Disk Drives 2

    TEST REPORT JANUARY 2009 OLTP performance comparison: Solid-state drives vs. hard disk drives Executive summary KEY FINDINGS Intel Corporation (Intel) commissioned Principled Technologies (PT) to compare performance and power for online transaction Six internal SSDs delivered up to processing (OLTP) of two types of disk drives: 35 percent higher and better performance on our OLTP tests Intel X25-E Extreme SATA solid-state drives (SSDs) thanTEST a full REPORT24-disk enclosure of 15K standard 15K RPM SAS hard disk drives (HDDs) RPM SAS HDDs. FEBRUARY 2006 The SSD configuration, including We focused on a single usage scenario: that of a user needing the server, used nearly 35 percent additional server performance and wanting to know whether six less power when active and SSDs installed in server drive slots would provide better approximately 42 percent less performance and lower power consumption than a full external 24- power when idle than the HDD disk enclosure of HDDs. This is a user who does not need the configuration. additional storage capacity of the HDDs. The SSD configuration delivered higher performance without the We used the DVD Store Version 2 (DS2) test tool. DS2 is an open- need for an additional RAID source simulation of an online e-commerce DVD store. Its main controller or an additional external throughput metric is orders per minute, or OPM. We also measured drive enclosure. power consumption during the test and while the systems were idle. For the HDD tests, we tested a full shelf of 24 Seagate Savvio 15K SAS 73GB hard disk drives in a Newisys NDS-2240 enclosure attached to a server via an LSI Logic MegaRAID SAS 8888ELP RAID Controller.
  • Fibre Channel Interface

    Fibre Channel Interface

    Fibre Channel Interface Fibre Channel Interface ©2006, Seagate Technology LLC All rights reserved Publication number: 100293070, Rev. A March 2006 Seagate and Seagate Technology are registered trademarks of Seagate Technology LLC. SeaTools, SeaFONE, SeaBOARD, SeaTDD, and the Wave logo are either registered trade- marks or trademarks of Seagate Technology LLC. Other product names are registered trade- marks or trademarks of their owners. Seagate reserves the right to change, without notice, product offerings or specifications. No part of this publication may be reproduced in any form without written permission of Seagate Technol- ogy LLC. Revision status summary sheet Revision Date Writer/Engineer Sheets Affected A 03/08/06 C. Chalupa/J. Coomes All iv Fibre Channel Interface Manual, Rev. A Contents 1.0 Contents . i 2.0 Publication overview . 1 2.1 Acknowledgements . 1 2.2 How to use this manual . 1 2.3 General interface description. 2 3.0 Introduction to Fibre Channel . 3 3.1 General information . 3 3.2 Channels vs. networks . 4 3.3 The advantages of Fibre Channel . 4 4.0 Fibre Channel standards . 5 4.1 General information . 6 4.1.1 Description of Fibre Channel levels . 6 4.1.1.1 FC-0 . .6 4.1.1.2 FC-1 . .6 4.1.1.3 FC-1.5 . .6 4.1.1.4 FC-2 . .6 4.1.1.5 FC-3 . .6 4.1.1.6 FC-4 . .7 4.1.2 Relationship between the levels. 7 4.1.3 Topology standards . 7 4.1.4 FC Implementation Guide (FC-IG) . 7 4.1.5 Applicable Documents .
  • AMD Opteron™ Shared Memory MP Systems Ardsher Ahmed Pat Conway Bill Hughes Fred Weber Agenda

    AMD Opteron™ Shared Memory MP Systems Ardsher Ahmed Pat Conway Bill Hughes Fred Weber Agenda

    AMD Opteron™ Shared Memory MP Systems Ardsher Ahmed Pat Conway Bill Hughes Fred Weber Agenda • Glueless MP systems • MP system configurations • Cache coherence protocol • 2-, 4-, and 8-way MP system topologies • Beyond 8-way MP systems September 22, 2002 Hot Chips 14 2 AMD Opteron™ Processor Architecture DRAM 5.3 GB/s 128-bit MCT CPU SRQ XBAR HT HT HT 3.2 GB/s per direction 3.2 GB/s per direction @ 0+]'DWD5DWH @ 0+]'DWD5DWH 3.2 GB/s per direction @ 0+]'DWD5DWH HT = HyperTransport™ technology September 22, 2002 Hot Chips 14 3 Glueless MP System DRAM DRAM MCT CPU MCT CPU SRQ SRQ non-Coherent HyperTransport™ Link XBAR XBAR HT I/O I/O I/O HT cHT cHT cHT cHT Coherent HyperTransport ™ cHT cHT I/O I/O HT HT cHT cHT XBAR XBAR CPU MCT CPU MCT SRQ SRQ HT = HyperTransport™ technology DRAM DRAM September 22, 2002 Hot Chips 14 4 MP Architecture • Programming model of memory is effectively SMP – Physical address space is flat and fully coherent – Far to near memory latency ratio in a 4P system is designed to be < 1.4 – Latency difference between remote and local memory is comparable to the difference between a DRAM page hit and a DRAM page conflict – DRAM locations can be contiguous or interleaved – No processor affinity or NUMA tuning required • MP support designed in from the beginning – Lower overall chip count results in outstanding system reliability – Memory Controller and XBAR operate at the processor frequency – Memory subsystem scale with frequency improvements September 22, 2002 Hot Chips 14 5 MP Architecture (contd.) • Integrated Memory Controller
  • User's Manual

    User's Manual

    User’s Manual USB2.0 OTG 2.5” hard disk enclosure CONTENTS 1. Introduction----------------------------------------------------------------------------------2 2. Package Content--------------------------------------------------------------------------2 3. Product Features--------------------------------------------------------------------------2 4. System Requirements------------------------------------------------------------------2 5. Part Number and Function------------------------------------------------------------3 6. Hard Disk Installation-------------------------------------------------------------------3 7. Replace Battery----------------------------------------------------------------------------4 8. Setting up to back up or exchanging file--------------------------5 8.1 Back up files from DSC, Pen drive, Card Reader, etc---------------------5 8.2 Exchanging files with PC or Mac------------------------------------------------6 8.2.1 Windows® 98 Driver Installation----------------------------------------6 8.2.2 Windows® 98 Un-Installation---------------------------------------------9 8.2.3 Troubleshooting------------------------------------------------------------10 8.2.4 Windows® ME Driver Installation--------------------------------------10 8.2.5 Troubleshooting------------------------------------------------------------10 8.2.6 Windows® 2000 Driver Installation-----------------------------------11 8.2.7 Troubleshooting------------------------------------------------------------11 8.2.8 Windows® XP Driver Installation--------------------------------------12
  • Architecture and Application of Infortrend Infiniband Design

    Architecture and Application of Infortrend Infiniband Design

    Architecture and Application of Infortrend InfiniBand Design Application Note Version: 1.3 Updated: October, 2018 Abstract: Focusing on the architecture and application of InfiniBand technology, this document introduces the architecture, application scenarios and highlights of the Infortrend InfiniBand host module design. Infortrend InfiniBand Host Module Design Contents Contents ............................................................................................................................................. 2 What is InfiniBand .............................................................................................................................. 3 Overview and Background .................................................................................................... 3 Basics of InfiniBand .............................................................................................................. 3 Hardware ....................................................................................................................... 3 Architecture ................................................................................................................... 4 Application Scenarios for HPC ............................................................................................................. 5 Current Limitation .............................................................................................................................. 6 Infortrend InfiniBand Host Board Design ............................................................................................
  • Chapter 6 MIDI, SCSI, and Sample Dumps

    Chapter 6 MIDI, SCSI, and Sample Dumps

    MIDI, SCSI, and Sample Dumps SCSI Guidelines Chapter 6 MIDI, SCSI, and Sample Dumps SCSI Guidelines The following sections contain information on using SCSI with the K2600, as well as speciÞc sections dealing with the Mac and the K2600. Disk Size Restrictions The K2600 accepts hard disks with up to 2 gigabytes of storage capacity. If you attach an unformatted disk that is larger than 2 gigabytes, the K2600 will still be able to format it, but only as a 2 gigabyte disk. If you attach a formatted disk larger than 2 gigabytes, the K2600 will not be able to work with it; you could reformat the disk, but thisÑof courseÑwould erase the disk entirely. Configuring a SCSI Chain Here are some basic guidelines to follow when conÞguring a SCSI chain: 1. According to the SCSI SpeciÞcation, the maximum SCSI cable length is 6 meters (19.69 feet). You should limit the total length of all SCSI cables connecting external SCSI devices with Kurzweil products to 17 feet (5.2 meters). To calculate the total SCSI cable length, add the lengths of all SCSI cables, plus eight inches for every external SCSI device connected. No single cable length in the chain should exceed eight feet. 2. The Þrst and last devices in the chain must be terminated. There is a single exception to this rule, however. A K2600 with an internal hard drive and no external SCSI devices attached should have its termination disabled. If you later add an external device to the K2600Õs SCSI chain, you must enable the K2600Õs termination at that time.
  • Application Note 904 an Introduction to the Differential SCSI Interface

    Application Note 904 an Introduction to the Differential SCSI Interface

    DS36954 Application Note 904 An Introduction to the Differential SCSI Interface Literature Number: SNLA033 An Introduction to the Differential SCSI Interface AN-904 National Semiconductor An Introduction to the Application Note 904 John Goldie Differential SCSI Interface August 1993 OVERVIEW different devices to be connected to the same daisy chained The scope of this application note is to provide an introduc- cable (SCSI-1 and 2 allows up to eight devices while the pro- tion to the SCSI Parallel Interface and insight into the differ- posed SCSI-3 standard will allow up to 32 devices). A typical ential option specified by the SCSI standards. This applica- SCSI bus configuration is shown in Figure 1. tion covers the following topics: WHY DIFFERENTIAL SCSI? • The SCSI Interface In comparison to single-ended SCSI, differential SCSI costs • Why Differential SCSI? more and has additional power and PC board space require- • The SCSI Bus ments. However, the gained benefits are well worth the addi- • SCSI Bus States tional IC cost, PCB space, and required power in many appli- • SCSI Options: Fast and Wide cations. Differential SCSI provides the following benefits over single-ended SCSI: • The SCSI Termination • Reliable High Transfer Rates — easily capable of operat- • SCSI Controller Requirements ing at 10MT/s (Fast SCSI) without special attention to termi- • Summary of SCSI Standards nations. Even higher data rates are currently being standard- • References/Standards ized (FAST-20 @ 20MT/s). The companion Application Note (AN-905) focuses on the THE SCSI INTERFACE features of National’s new RS-485 hex transceiver. The The Small Computer System Interface is an ANSI (American DS36BC956 specifically designed for use in differential SCSI National Standards Institute) interface standard defining a applications is also optimal for use in other high speed, par- peer to peer generic input/output bus (I/O bus).
  • ICP RAID Controller GDT8500RZ

    ICP RAID Controller GDT8500RZ

    ICP RAID Controller GDT8500RZ Hardware Installation and User’s Guide, Version 1.1.6 April 2003 IMPORTANT NOTICE - READ BEFORE MAKING USE OF THE INFORMATION CONTAINED HEREIN This information is provided “as is.” Information in this document is provided solely to enable use of ICP products. Except as provided in ICP vortex’s Terms and Conditions of sale ICP vortex and/or its suppliers assume no liability whatsoever, and ICP vortex and/or its suppliers disclaim any express or implied warranty, relating to this information including liability or warranties relating to fitness for a particular purpose, merchantability, satisfactory quality or infringement of any patent, copyright or other intellectual property right. ICP vortex and/or its suppliers assume no responsibility for any omissions or any errors which may appear in this document nor does it make a commitment to update the information contained herein. ICP vortex retains the right to make changes to this document and its products at any time, without notice. No License, express or implied, by Estoppel or otherwise, to any intellectual property rights is granted by this document. ICP products are not intended for use in medical, life saving, or life sustaining applications. Any recommended operating or test methods are correct to ICP’s reasonable knowledge at the time of writing. ICP vortex and/or its suppliers accept no liability for the implementation of these methods within the user’s environment. The user is responsible for and must satisfy itself that any use made of this information or ICP products is suitable to its needs. Any named third party suppliers are provided for information only.
  • Serial Attached SCSI (SAS) Interface Manual

    Serial Attached SCSI (SAS) Interface Manual

    Users Guide Serial Attached SCSI (SAS) Interface Manual Users Guide Serial Attached SCSI (SAS) Interface Manual ©2003, 2004, 2005, 2006 Seagate Technology LLC All rights reserved Publication number: 100293071, Rev. B May 2006 Seagate, Seagate Technology, and the Seagate logo are registered trademarks of Seagate Technology LLC. SeaTools, SeaFAX, SeaFONE, SeaBOARD, and SeaTDD are either registered trademarks or trade- marks of Seagate Technology LLC. Other product names are registered trademarks or trademarks of their owners. Seagate reserves the right to change, without notice, product offerings or specifications. No part of this publication may be reproduced in any form without written permission of Seagate Technology LLC. Revision status summary sheet Revision Date Writers/Engineers Notes Rev. A 11/11/04 J. Coomes Initial release. Rev. B 05/07/06 C. Chalupa, J. Coomes, G. Houlder All. Contents 1.0 Interface requirements. 1 1.1 Acknowledgements . 1 1.2 How to use this interface manual . 1 1.2.1 Scope . 2 1.2.2 Applicable specifications . 2 1.2.3 Other references . 3 1.3 General interface description. 3 1.3.1 Introduction to Serial Attached SCSI Interface (SAS) . 3 1.3.2 The SAS interface . 3 1.3.3 Glossary . 5 1.3.4 Keywords . 16 1.4 Physical interface characteristics. 17 1.5 Bit and byte ordering . 17 2.0 General . 19 2.1 Architecture . 19 2.1.1 Architecture overview . 19 2.1.2 Physical links and phys . 19 2.1.3 Ports (narrow ports and wide ports) . 20 2.1.4 SAS devices . 21 2.1.5 Expander devices (edge expander devices and fanout expander devices) .
  • EMC’S Perspective: a Look Forward

    EMC’S Perspective: a Look Forward

    The Performance Impact of NVM Express and NVM Express over Fabrics PRESENTATION TITLE GOES HERE Live: November 13, 2014 Presented by experts from Cisco, EMC and Intel Webcast Presenters J Metz, R&D Engineer for the Office of the CTO, Cisco Amber Huffman, Senior Principal Engineer, Intel Steve Sardella , Distinguished Engineer, EMC Dave Minturn, Storage Architect, Intel SNIA Legal Notice The material contained in this tutorial is copyrighted by the SNIA unless otherwise noted. Member companies and individual members may use this material in presentations and literature under the following conditions: Any slide or slides used must be reproduced in their entirety without modification The SNIA must be acknowledged as the source of any material used in the body of any document containing material from these presentations. This presentation is a project of the SNIA Education Committee. Neither the author nor the presenter is an attorney and nothing in this presentation is intended to be, or should be construed as legal advice or an opinion of counsel. If you need legal advice or a legal opinion please contact your attorney. The information presented herein represents the author's personal opinion and current understanding of the relevant issues involved. The author, the presenter, and the SNIA do not assume any responsibility or liability for damages arising out of any reliance on or use of this information. NO WARRANTIES, EXPRESS OR IMPLIED. USE AT YOUR OWN RISK. 3 What This Presentation Is A discussion of a new way of talking to Non-Volatile
  • HP Storageworks D2000 Disk Enclosure Family Data Sheet (US

    HP Storageworks D2000 Disk Enclosure Family Data Sheet (US

    HP StorageWorks D2000 Disk Enclosures Family Data sheet Manage your small to midrange business’s growing storage needs by deploying the next-generation 6 Gb SAS external storage enclosures with up to 192 TB SATA or 30 TB SAS. Is your storage growing by leaps The new 6 Gb SAS enclosures—Large Form Factor (LFF) D2600 with 12 drive bays and Small Form and bounds, exceeding your current Factor (SFF) D2700 with 25 drive bays—offer system capacity? modular solutions to simplify the capacity expansion of HP ProLiant and Integrity server environments, and Manage your small and midrange business’s growing MSA Arrays (SFF only) to external storage without storage needs by deploying the HP StorageWorks having to make the full move to SAN or NAS. D2000 Disk Enclosures, the next-generation 6 Gb This allows you to buy what is needed today, and SAS low-cost, flexible, tiered external storage purchase additional capacity as your data storage system. HP D2000 Disk Enclosures are ideal for needs grow. Total support can grow up to 96 LFF or small application environments in small and medium 100 SFF drives as needed. businesses, remote offices, and departmental locations. Key features and benefits Affordable • Add crucial bandwidth as HP StorageWorks D2000 Disk Enclosures double the transfer rate of current 3 Gb solutions • No hidden management charges as the modular platform allows customers to purchase based on current need and future growth • Support for enterprise-class dual-port SAS drives as the need and budget dictates • Higher levels of redundancy and reliability— by eliminating single points of failure within a storage network Flexible and scalable • The D2600 provides flexibility to mix and match SAS and SATA drives in the same enclosure.