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Table of Contents 2008 ASME International Conference on MSEC Manufacturing Science and Engineering 3rd JSME/ASME International Conference on Materials and Processing ICM&P Evanston, IL, USA ٠ October 7-10, 2008 Program and Abstracts Table of Contents APPRECIATIONS TO SPONSORS............................................................................................................ 2 WELCOME FROM THE HOSTS ............................................................................................................... 3 GREETINGS FROM THE ASME/MED CHAIR ........................................................................................... 4 GREETING FROM THE JSME/ICM&PCHAIR............................................................................................ 5 FOREWORD FROM MSEC/ICM&P PROGRAM CHAIRS........................................................................... 6 COMMITTEES....................................................................................................................................... 7 CONFERENCE VENUE MAP ................................................................................................................... 8 PROGRAM‐AT‐A‐GLANCE ..................................................................................................................... 9 PROGRAM OVERVIEW ....................................................................................................................... 10 TECHNICAL PROGRAM ....................................................................................................................... 17 POST‐CONFERENCE SHORT COURSES ................................................................................................. 73 ABSTRACTS OF PLENARY PRESENTATIONS ......................................................................................... 75 ABSTRACTS ........................................................................................................................................ 81 MESSAGES FROM SPONSORS........................................................................................................... 195 MESSAGE FROM MSEC 2009 HOST................................................................................................... 200 ASME MSEC 2008 and JSME ICM&P 2008 Oct. 7‐10, 2008 Northwestern University 1 Our Sincere Appreciations go to Illinois Tool Works Inc. Los Alamos National Laboratory Cummins Inc. Ford Motor Company General Electric Company General Motors Corporation JTEKT Corporation Meidoh Company TechSolve Toyota Motor Corporation Chiyoda Montrow Die Manufacturing, Inc. Sugino Corp. for their Financial Sponsorships 2 ASME MSEC 2008 and JSME ICM&P 2008 Oct. 7‐10, 2008 Northwestern University Welcome from the Hosts On behalf of the MSEC/ICM&P Organizing Committee and Northwestern University, we would like to extend our warm welcome to you to the Chicago area for the 2008 ASME International Manufacturing Science and Engineering Conference (MSEC) and the 3rd JSME/ASME International Conference on Materials and Processing (ICM&P). Northwestern University was established in Evanston in 1851 to benefit the residents of the former Northwest Territory. Since then, Northwestern has expanded to lakefront campuses in both Evanston and Chicago and consists of a total of nine schools: Weinberg College of Arts and Sciences, McCormick School of Engineering and Applied Science, Kellogg School of Management, School of Communication, Feinberg School of Medicine, Medill School of Journalism, School of Law, Bienen School of Music, School of Education and Social Policy. The McCormick School of Engineering will celebrate its 100th anniversary in 2009. Today, McCormick has 180 faculty, 1382 undergraduate students and 726 graduate students. The engineering school has a long standing tradition of diverse and innovative research programs, just one of which is manufacturing. The spirit of collaboration between departments as well as internationally is strong and is an important factor in the commitment to excellence. With this spirit and through the diligent efforts of the organizing committee, guidance from both MED and JSME executive committees, and many nights of hard work from our Program Chairs, we are here to welcome you to the co‐located MSEC 2008 and ICM&P 2008 conferences. Thanks are due to Ms. Mariela Huber and the Student Organizing Committee co‐chaired by Ms. Tiffany Davis and Mr. Numpon Mahayotsanun for their critical assistance, creative thoughts and hard work that have made this event possible. Our sincere appreciations also go to the sponsorship from Illinois Tool Works Inc., Los Alamos National Laboratory, Cummins Inc., Ford Motor Company, General Electric Company, General Motors Corporation, JTEKT Corporation, Meidoh Company, TechSolve, Toyota Motor Corporation, Chiyoda Montrow Die Manufacturing, Inc., and Sugino Corp., without which the conference could not succeed. Finally, we would like to thank all of you for showing your support by attending the conference. We sincerely wish all of you a very enjoyable stay at Northwestern and hope you find inspiration and excitement in this stimulating manufacturing environment. Jian Cao Kuniaki Dohda Kornel Ehmann Fellow, ASME Professor Fellow, ASME Professor Nagoya Institute of Technology James N. and Nancy J. Farley Northwestern University Organizing Co‐Chair Professor in Manufacturing and Organizing Chair Entrepreneurship Northwestern University Organizing Co‐Chair ASME MSEC 2008 and JSME ICM&P 2008 Oct. 7‐10, 2008 Northwestern University 3 Greetings from the ASME/MED Chair On behalf of the ASME Manufacturing Engineering Division (MED) Executive Committee whose members include Dr. Bin Wei from General Electric, Prof. Lawrence Yao from Columbia University, Dr. Matt Berment from Los Alamos National Lab, Dr. Cedric Xia from Ford and myself from Northwestern University, I would like to extend our sincere welcome to you to the ASME International Manufacturing Science and Engineering Conference (MSEC) co‐located with the 3rd JSME/ASME International Conference of Materials and Processing. Manufacturing as the means to generate products is essential to the accumulation of wealth and to the enhancement of living standards. By working together, we can advance the science and technology of manufacturing at a much faster pace. This conference has a unique position in the history of MED as it is the first division conference that is co‐located with another major international society. As a result of this joint effort, we have grown more than double the size of our past conferences, with attendees from 19 countries. Manufacturing fosters innovations and has an undisputable link to energy, environment, stability and economy. The advance of manufacturing science and technology requires fundamental research in many basic domains, technology innovation and the intrinsic partnership between industry, academia and government labs. This division will continue to offer technical leadership and partnership opportunities to the manufacturing community. Currently, we have seven technical committees: Manufacturing Processes, Manufacturing Equipment, Manufacturing Systems, Quality & Reliability, Life Cycle Engineering, Nano/Micro/Meso Manufacturing and Biomanufacturing. We are looking forward to partnerships from our international counterparts or from other societies or ASME divisions. We hope you will take advantage of this international conference setting to meet old friends, make new acquaintances, find talents for your firm, and establish new collaborations. None of this technical‐stimulating and social rich gathering would be possible without the hard work of our Program Chairs, Prof. John Roth of Penn State, Prof. Naoto Ohtake of Nagoya University and Prof. Brad Kinsey of the University of New Hampshire at Durham, the kind financial sponsorships of more than 12 corporations and a government lab, and the contribution of the local organizing committee. Last, but most importantly, I would like to thank all of you, who contribute to the success of this conference via paper/poster submissions, reviewers, panelists, symposium organizers, session chairs and registrants. Enjoy the conference and I look forward to your continuous active involvement with the division. See you at MSEC 2009 at Purdue University if not before. With my best wishes, Jian Cao, Ph.D., FASME Northwestern University Chair – ASME Manufacturing Engineering Division, 2008‐2009 4 ASME MSEC 2008 and JSME ICM&P 2008 Oct. 7‐10, 2008 Northwestern University Greetings from the JSME/ICM&P Chair On behalf of the steering committee of MPD (Materials and Processing Division) of JSME (Japan Society of Mechanical Engineers), I am very pleased to introduce ICM&P2008 (International Conference on Materials and Processing 2008) held in Norris University Center at Northwestern University, Evanston, IL, USA, on October 7‐10, 2008, in collaboration with MSEC2008 (Manufacturing Science and Engineering Conference 2008). MPD, founded in 1991, has contributed to the development of engineering materials and processing technology in Japan and organizes the Materials and Processing Conference annually. This conference has been recognized as the premier meeting on current topics in materials and processing technology in Japan. ICM&P2008 is also held as the sixteenth annual JSME Materials and Processing Conference. ICM&P2008 is the third international conference sponsored by MPD along with the Manufacturing Engineering Division of ASME (The American Society of Mechanical
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