Herbert Reichl • Ernst Obermeier (Editors) ICRO SYSTEM Technologies 98
6th International Conference on Micro Electro, Opto, Mechanical Systems and Components
Potsdam, December 1 - 3, 1998
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INFORMATIONSBiBLIOTHEK
VDE-VERLAG GMBH • Berlin • Offenbach Table of Contents
Opening Plenary Talks
Chairmen: Herbert Reichl, FhG-IZM, Berlin, Germany Ernst Obermeier, TU Berlin, Germany
Strategies for LIGA Implementation 25 V. Saile, Forschungszentrum Karlsruhe GmbH, Germany
Micromachining in Mechatronics 31 Y. Mizugaki, Kyushu Institute of Technology, Kitakyushu, Japan
New Trends in Micro System Technologies 37 N. F. de Rooij, University of Neuchatel, Switzerland
Microsystems in Automotive Applications 43 J. Marek, Robert Bosch GmbH, Reutlingen, Germany
MEMS Activities in the US 51 K. W. Markus, MCNC MEMS Technology Applications Center, USA
Plenary Session
Chairmen: Wen H. Ko, Case Western University, Cleveland, USA Antonio Paoletti, University of Rome, Italy
Optical Sensors and Devices for Telecommunications Based on Free-Space Micro-Optical Systems - An Overview 57 J. Mohr, Forschungszentrum Karlsruhe, Germany
The Manufacture of a-Si:H Thin Film Transistors for Hat Liquid Crystal Displays 59 E. Liider, University of Stuttgart, Germany Microoptical Devices I
Chairmen: Wolfgang Karthe, FhG-IOF, Jena, Germany Jean-Michel Karam, MEMSCAP S.A., Grenoble, France
Design Optimization Considering Tolerance Effects of Microoptical Benches 65 I. Sieber, H. Eggert, H. Guth, W. Jakob, K.-P. Scherer, P. Ziegler, Forschungszentrum Karlsruhe, Germany
Low-Loss Polymer Waveguide with High Thermal Stability 71 W. Wirges, N. Keil, H. Yao, C. Zawadzki, S. Yilmaz, Heinrich-Hertz-lnstitut fur Nachrichtentechnik, Berlin, Germany; M. Bauer, J. Bauer, C. Dreyer, Fraunhofer-Einrichtung fur Zuverlassigkeit und Mikrointegration, Teltow, Germany
Polymer Waveguide Components for Optical Backplane Interconnects Fabricated by LIGA Technique 77 T. Paatzsch, H.-D. Bauer, M. Popp, I. Smaglinski, W. Ehrfeld, Institute of Microtechnology, Mainz, Germany
Low-Cost Branching Devices Based on Multi-Mode Interference (MMI) Waveguide Structures in BCB 83 T. Augustsson, J. Hammar, G. Palmskog, Ericsson Components AB, Stockholm, Sweden; J. Haglund, Industrial Microelectronic Center, Linkoping, Sweden
Components for Parallel Optical Networks Based on LIGA Technology .... 89 J. HoBfeld, W. Ehrfeld, M. Neumeier, A. Picard, J. Schulze, L. Weber, Institute of Microtechnology, Mainz, Germany
Design and Simulation of Polymer Thermo-optic Waveguide Switches .... 95 H. Yao, N. Keil, Heinrich-Hertz-lnstitut fur Nachrichtentechnik, Berlin, Germany
Sensors I
Chairmen: Walter Kroy, Daimler Benz AG, Miinchen, Germany Franco A. Mori, Magnei Marelli Spa, Pavia, Italy
A Differential-Type Capacitive Sensor for Non-Contact Measurement of Torque 101 H. Acker, W. Langheinrich, Darmstadt University of Technology, Germany Magnetostrictive LC-Circuits for Thin Film Torque Sensors 107 A. Ludwig, J. Betz, E. Quandt, Forschungszentrum Karlsruhe, Germany
Model-Based Signal Processing in a CMOS Hall Sensor Row Microsystem 109 U. Marschner, W.-J. Fischer, Dresden University of Technology, Germany; R. Gottfried-Gottfried, W. Pufe, Fraunhofer-lnstitute IMS II, Dresden, Germany
A New Bulk Micromachined Gyroscope with Vibration Enhancement by Coupled Resonators 115 K. Hiller, M. Wiemer, D. Billep, A. Huhnerfurst, T. Gessner, Technical University of Chemnitz, Germany; B. Ryrko, U. Breng, St. Zimmermann, W. Gutmann, LITEF GmbH, Freiburg, Germany; M. Wetzel, Electronicburo M. Wetzel, Stollberg, Germany
Silicon Vibrating Gyroscopes with a Large Reference Motion Using a Parallelogram Amplifier 121 A. Sayah, Y. Ansel, P. Renaud, M.A.M. Gijs, Swiss Federal Institute of Technology, Lausanne, Switzerland
Micro Sensors for the Application in Gesture Recognition 127 P. Krause, Th. Velten, D. Stefan, E. Obermeier, F. G. Hofmann, G. Hommel, Technical University of Berlin, Germany
Advanced Packaging and Interconnections
Chairmen: Karel Kurzweil, Bull SA, Les Clais-sous-Bois, France Jean Roggen, IVEC vzw, Leufen, Belgium
Multilayer Polyimide Film Substrates for Interconnections in Micro Systems 133 A. Fach, B. Ketterer, U. Brunner, D. Hablutzel, J. Link, Hightec MC AG, Lenzburg, Switzerland
Waferlevel CSP-Packaging and Reliability 139 J. Simon, Fraunhofer-lnstitut fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
Modularization of Microsystems and Standardization of Interfaces 141 M. Schunemann, G. Bauer, W. Schaefer, Fraunhofer Institute for Manufacturing Engineering and Automation IPA, Stuttgart, Germany; R. Leutenbauer, V. Grosser, H. Reichl, Fraunhofer Institute for Mechanical Reliability and Microintegration IZM, Berlin, Germany Flip-Chip Mounting of Hybrid FET Gas Sensors with Airgap 147 A. Fuchs, T. Doll, I. Eisele, Universitat der Bundeswehr Munchen, Neubiberg, Germany
Thermal management of VCSEL diode arrays in integrated planar free-space optical system 153 C. Gimkiewicz, J. Jahns, Fernuniversitat Hagen, Germany
Laser Joining of Dissimilar Materials 159 M. J. Wild, F. Legewie, A. Gillner, R. Poprawe, Fraunhofer Institute for Lasertechnology, Aachen, Germany
Microoptical Devices II
Chairmen: Wolfgang Menz, Universitat Freiburg, Germany Helmut F. Schlaak, Siemens AG, Berlin, Germany
Image Sensors in TFA (Thin Film on ASIC) Technology with Analog Image Pre-Processing 165 A. Eckhardt, F. Blecher, B. Schneider, J. Sterzel, Universitat-GH Siegen, Germany; S. Benthien, H. Keller, I Lule, P. Rieve, M. Sommer, K. Seibel, F. Miitze, M. Bohm, Silicon Vision GmbH, Siegen, Germany
Technological Approaches to Micromirror Fabrication for High Frequency Scanning Applications 171 K. Kehr, R. Hahn, S. Kurth, Ch. Kaufmann, K. Schmidt, I. Schubert, U. Wollmann, W. Dotzel, T. Gessner, Chemnitz University of Technology, Germany
A new Principle for Micro-Opto-Mechanical Scanners 177 T. Frank, H. Wurmus, Technical University of llmenau, Germany
Production Possibilities of Microoptics with Excimer-Laser Radiation ... 183 M. Rinke, H. K. Tonshoff, C. Graumann, H. Hesener, J. Wais, Laser Zentrum Hannover e.V., Germany
Micro-Optical Fluidic Analysis System for Environmental and Quality Control 189 A. Ehlert, S. Dauer, S. Biittgenbach, Technical University of Braunschweig, Germany
Design, fabrication and clinical test of a foldable microstructured intraocular lens 195 W. Stork, K. D. Muller-Glaser, A. Wagner, University of Karlsruhe, Germany; C. F. Kreiner, Acritec GmbH, Glienicke, Germany
10 Sensors II
Chairmen: Jiri Marek, Robert Bosch GmbH, Reutlingen, Germany Nico F. de Rooij, Universite de Neuchatel, Switzerland
A Millimeter Wave Doppler Sensor in Microsystem Technology 201 H. Thim, C. Diskus, G. Haider, K. Liibke, A. Springer, A. Stelzer, H. Weinfurter, Johannes Kepler University Linz, Austria
CMOS-based cellular biosensor in process and application 207 M. Lehmann, W. Baumann, R. Ehret, M. Brischwein, B. Wolf, Institute for Immunobiology, Freiburg, Germany; H.-J. Gahle, G. Igel, U. Sieben, Micronas Intermetall GmbH, Freiburg, Germany
Micromachined gas sensors operated by fast pulsed temperature mode for environmental pollutants 213 G. Faglia, E. Comini, A. Cristalli, G. Sberveglieri, A. Taroni, University of Brescia, Italy; G. Cardinali, L. Dori, CNR-LAMEL Institute, Bologna, Italy
Environmental monitoring using microoptical sensors 219 G. Marowsky, U. Bunting, P. Karlitschek, F. Lewitzka, M. Niederkriiger, Laser-Laboratorium Gottingen e. V., Germany
Realization of Low Cost Micro Coils and Usage in Different Media 225 U. Marschner, Dresden University of Technology, Germany W.-J. Fischer, IHM & FhG-IMS II, Dresden, Germany; R. Jurisch, P. Peitsch, MICRO-SENSYS GmbH, Erfurt, Germany; J. Oswald, ETD Elektronik-Technologie GmbH, Dresden, Germany
Assembly and Microintegration
Chairmen: Yotaro Hatamura, University of Tokyo, Japan Cees van Kessel, Philips Bedrijven B. V. Eindhoven, Netherlands
Sensitive and Adaptive Manipulators for Automation of Micro Assembly 231 J. Staud, W. GroB, A. Menschig, Deutsches Zentrum fur Luft- und Raumfahrt e.V., Stuttgart, Germany
Downscaling of Adhesiv and Capillary Grippers for Micro Assembly 237 H. Grutzeck, L. Kiesewetter, BTU Cottbus, Germany
11 Holistic Concept of Sensitive Gripping and Magazining of Microcomponents 243 K.-D. Miiller, K. Pollak, W. Bacher, M. Heckele, U. Gengenbach, Forschungszentrum Karlsruhe, Germany
Automated assembly of microcomponents supported by a 3D-inspection system 249 R. Eberhardt, T. Scheller, Fraunhofer Institut fur Angewandte Optik und Feinmechanik, Jena, Germany; E.-M. Menzel, Carl Zeiss Jena GmbH, Germany; M. Doring, microdrop GmbH, Norderstedt, Germany; K. Lenhardt, Jos. Schneider GmbH, Bad Kreuznach, Germany; H. Kopp, Computer Gesellschaft fur wissenschaftliche Anwendungen, Aachen, Germany
Subsystems and interfaces for modular micro assembly systems 257 U. Gengenbach, F. Engelhardt, R. Scharnowell, Forschungszentrum Kalrsruhe, Germany
Flexible Microgrippers for Manipulation of Microstructures 263 R. Salim, H. Wurmus, Technical University of llmenau, Germany
Industrial Product Visions
Chairmen Helmut Sturm, VDI/VDE Technologiezentrum, Teltow, Germany Takaharu Idogaki, Nippondenso CO. Ltd. Aichi-ken, Japan
Medical Applications of Microsystems: Barriers and Incentives for Growth 269 J. M. Wilkinson, Technology for Industry Ltd., Cambridgeshire, England
"Market Analysis for Microsystems" - an Interim Report from the NEXUS TASK FORCE . 275 R. Wechsung, N. Unal, microParts GmbH, Dortmund, Germany; J.-C. Eloy, Yole Developpement, Lyon, France; H. Wicht, CEA-LETI, Grenoble, France
Smart domestic appliances through innovations 283 A. Lahrmann, Bosch-Siemens Hausgerate GmbH, Berlin, Germany
Future Scenarios of Microsystem Applications 289 W. GeBner, M. Werner, VDI/VDE-IT, Teltow, Germany
12 Actuators
Chairmen Hiroyuki Fujita, University of Tokyo, Tokyo, Japan Karen W. Markus, MEM Technologies Applications Centre, North Carolina, USA
Electric Field Breakdown at Micrometre Separations in Air and Vacuum 295 R. S. Dhariwal, J.-M. Torres, Heriot-Watt University, Edinburgh, United Kingdom
Electrostatic Comb-Drive Actuators made of Polyimide for Actuating Micromotion Convert Mechanisms 301 D. Kamiya, T. Hayama, M. Horie, Tokyo Institute of Technology, Yokohama, Japan
Miniaturization of electromagnetic actuators 307 E. Kallenbach, K. Feindt, M. Kallenbach, T. Strohla, V. Zoppig, Technical University of llmenau, Germany
Achieving low driving voltages for micro-motors and fluid pumps by electronic resonance 313 J. Gimsa, T. Muller, G. Fuhr, Humboldt Universitat zu Berlin, Germany
An Electro-Thermally Driven Micro Membrane Actuator with Two-way Deflection 319 W. Hsu, Z.-P. Xu, National Chiao Tung University, Hsinchu, Taiwan
Design and Fabrication of a Microvalve with an Anti-leakage Membrane 325 H.-Y. Lin, W. Fang, National Tsing Hua University, Hsinchu, Taiwan
Process Technologies I
Chairmen: Masayoshi Esashi, Tohoku University, Sendai, Japan Thomas GeBner, TU Chemnitz, Germany
Process Analysis of the Injection Moulding of Microstructures 331 A. Spennemann, W. Michaeli, A. Rogalla, Institut fur Kunststoffverarbeitung, RWTH Aachen, Germany
Manufacturing of Micro Parts by Micro Injection Moulding 337 C. G. Kukla, H. Loibl, FH Wiener Neustadt, Austria; W. Hannenheim, TU Wien, Austria
13 Manufacturing of Microstructures by Micro Injection Molding 343 V. Piotter, T. Benzler, I Hanemann, R. Ruprecht, J. Hausselt, Forschungszentrum Karlsruhe, Germany
u-EDM Potentials in Fabrication of Microcomponents and Mold Inserts .. 349 G. Popovic, D. Petrovic, W. Brenner, A. Vujanic, P. Herbst, Institute for Recision Engineering, Vienna University of Technology, Vienna, Austria; A. Wolf, Institut fur Mikrotechnik GmbH, Mainz, Germany
Laser Beam Welding of Plastic Microparts 355 H. Klein, E. Haberstroh, W. Michaeli, RWTH, Inst. fur Kunststoffverarbeitung, Aachen, Germany
Three Dimensional Micro Forming using Metal Jet 361 K. Yamaguchi, K. Sakai, T. Yamanaka, T. Hirayama, Nagoya University, Japan
Plenary Session
Chairmen: Volker Saile, FZK, Karlsruhe, Germany Ernst Obermeier, TU Berlin, Germany
CMOS-based transducers 367 K. Baert, D. Maes, L. Haspeslagh, W. Laureyn, S. Sedky, S. van der Groen, P. Van Gerwen, F. Van Steenkiste, IMEC, Belgium
Characterization and Testing
Chairmen: Robert Mertens, IMEC vzw, Leuven, Belgium Bernd Michel, FhG-IZM, Berlin, Germany
A Study of Effect of Fabrication Process on Diffusion in Layered Thin Film 373 T. Hirasawa, H. Kotera, I Yamamoto, S. Shima, Kyoto University, Japan
Mechanical Reliability of Silicon Wafer-Bonded Components 379 J. Bagdahn, D. Katzer, M. Petzold, Fraunhofer Institut fur Werkstoffmechanik, Halle, Germany
Silicon micromachined torsion spring for measurements of small moments 385 A. Vujanic, N. Delic, M. Jakovljevic, W. Brenner, G. Popovic, Technical University of Vienna, Austria
14 Micro torque measurements for prototype motors in MEMS 391 Y. Wu, H. Jia, T. Wang, L. Wang, Changchun Institute of Optics & Fine Mechanics, China
Material Properties and Crack Propagation Behavior of 63Sn37Pb Flip Chip Solder Joints 397 S. Wiese, F. Feustel, S. Rzepka, E. Meusel, Technical University of Dresden, Germany
Crack Avoidance and Crack Evaluation in Microsystems 403 B. Michel, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
Process Technologies II
Chairmen: Elisabeth Reese, W. C. Heraeus GmbH, Hanau, Germany Felix Rudolf, CSEM Neuchatel, Switzerland
The Effects of Impurities in Silicon on Anisotropic Etching in KOH-Solutions 409 A. Hein, G. Findler, S. Finkbeiner, H. Muenzel, Robert Bosch GmbH Reutlingen, Germany; E. Obermeier, Technical University of Berlin, Germany
Unconventional Bulk-micromachining using Underetching of *100* Silicon Planes, its Fabrication Tolerances and Application to some MEMS and MOEMS 415 G. Schropfer, M. de Labachelerie, LPMO-CNRS, Besancon, France; C. R. Tellier, LCEP, Besancon, France
The Laser Controlled Anisotropic Etching to Form Vertical Sidewalls on *100* Silicon Wafers 421 Y.-H. Chang, Y.-C. Huang, W.-S. Chang, National Chiao Tung University, Hsinchu, Taiwan
Novel Microstructuring Technologies in Silicon 427 B. Hillerich, H. Pradel, U. Schaber, Fraunhofer-lnstitute for Solid State Technology (IFT), Miinchen, Germany; S. Vogel, IFT (PosiNom), Miinchen (Potsdam), Germany
Investigations into the Microgrinding Technique for the Production of Microstructures in Silicon and Glass 433 H.-W. Hoffmeister, A. Wenda, Technical University of Braunschweig, Germany
15 Rapid Prototyping of Microfluidic Structures with Nd: YAG-Laser-Ablation 439 J. M. Grasegger, Technical University of Munich, Germany
Biological Based Approaches
Chairmen: Gunter Fuhr, Humboldt Universitat Berlin, Germany Frieder Scheller, Universitat Potsdam, Germany
Measurement of optical induced forces on trapped particles by use of micro field cages 445 G. Fuhr, Th. Schnelle, T. Miiller, H. Hitzler-Alimoradian, Humboldt-Universitat zu Berlin, Germany; S. Monajembashi, K.-O. Greulich, Institut fur Molekulare Biotechnologie, Jena, Germany
Chemical and Biochemical synthesis and screening in silicon 451 A. Schober, G. Schlingloff, D. Tomandl, J. M. Kohler, G. Mayer, A. GroB, S. Wuchty, Institute of Physical High Technology, Jena, Germany; H. Deppe, B. Diefenbach, H. Wurziger, Medicinal Chemistry Research, Merck KGaA, Darmstadt, Germany
Applications of Bioactive Films in Microsystems 457 A. Hengerer, J. Decker, E. Prohaska, H. Wolf, University of Regensburg, Germany; S. Hauck, C. KoBlinger, Fraunhofer-lnstitute for Solid-State Technology, Munich, Germany
Screening of Herbicides in Water Using an Automated, Computer-Controlled Immunochemical Detection System 463 A. Franke, P. M. Kramer, National Research Center for Environment and Health, Neuherberg, Germany; S. Bannierink, Juke MeBtechnische Systeme, Altenberge, Germany
Micro Scanner Based Fluorescence Measurements on Nano Titer Plates for Environmental Analysis 469 M. Hessling, J. Ihlemann, D. Ebbecke, G. Marowsky, Laser-Laboratorium Gottingen e.V., Germany
Application of Microstructures in Biosensors 475 U. Bilitewski, Gesellschaft fur Biotechnologische Forschung mbH, Braunschweig, Germany
16 Design
Chairmen: Klaus D. Muller-Glaser, Universitat Karlsruhe, Germany Kay Krupka, Siemens AG, Berlin, Germany
MEMS Process/Design and Optimization using Economical Constraints 479 K. Hahn, R. Bruck, University of Siegen, Germany
Development of Methods for Application of the Finite-Element Method in System Optimization of Microsystem Components 485 A. Quinte, S. Halstenberg, W. SiiR, H. Eggert, Forschungszentrum Karlsruhe, Germany
Dynamic Simulation Method of MEMS Coupling Electrostatic Field, Fluid Dynamics and Membrane Deflection 491 H. Kotera, Y. Sakamoto, T. Hirasawa, S. Shima, Kyoto University, Japan; R. W. Dutton, Stanford University, California, USA
Development of Methods for Building Adapted Macromodels for the Application in the Design Optimization of Microsystems 497 S. Halstenberg, H. Eggert, M. Gorges-Schleuter, W. Jakob, A. Quinte, W. SuB, Forschungszentrum Karlsruhe, Germany
Simulation of fluid-structure interaction using domain-specific finite-element solvers 503 A. Klein, G. Gerlach, Technical University of Dresden, Germany
Analysis of Integrated Optical Devices under Thermal and Mechanical Loads 509 M. Bludszuweit, M. Kasper, Technical University of Hamburg-Harburg, Germany
Process Technologies III
Chairmen: Eckhard Wolfgang, SNI Siemens Nixdorf Informationssysteme AG, Miinchen, Germany Heinz Lehr, Technical University Berlin, Germany
Local Laser supported cleaning of microelectromechanical systems and components 515 G. Schwaab, R. Grimme, M. Rockowicz, W. Schafer, Fraunhofer Institute for Manufacturing Engineering and Automation, Stuttgart, Germany
17 lonising-radiation sensors based on CVD diamond: correlation among growth conditions, film texturing and detector performance 521 G. Messina, G. Faggio, S. Santangelo, University of Reggio Calabria, Italy; G. Verona-Rinati, University of Rome ,,Tor Vergata", Italy
Pulsed Laser Deposition and Patterning of Diamond-like Carbon Films . . 527 A. Tebano, A. Paoletti, A. Tucciarone, M. A. Scarselli, University of Rome ,,Tor Vergata", Italy; G. Messina, S. Santangelo, University of Reggio Calabria, Italy
Lead Zirconate Titanate (PZT) Thin Film for Microsystems Synthesised by Hydrothermal Method 533 P. A. Ndiaye, P. Pernod, Ecole Centrale de Lille, France; B. Loiseau, S. Minaud, Ecole Nationale Superieure de Chimie de Lille, France
Micro Powder Metallurgy for Micropart Production 539 T. Hartwig, A. Rota, V. Duong, Fraunhofer Institute for Applied Materials Research (IFAM), Bremen, Germany
Precision embossing of grooves in metallic substrates for self-aligned positioning of microoptical components 545 B. Hillerich, Fraunhofer Institute for Solid State Technology, Munich, Germany; M. Rode, Daimler-Benz Research Centre, Ulm, Germany
Microfluidic Devices
Chairmen: Peter Bley, Forschungszentrum Karlsruhe, Germany Richard S. Muller, University of California, Berkeley, USA
Optimal Design of a Microfluidic System with Piezoactuator for Droplets Generation 551 R. Keoshkeryan, L. Dressier, N. Schwesinger, Technical University of llmenau, Germany
Finite-Element Investigation into Proposed Bearing Mechanism for a Fluid Driven Micro Actuator 557 R. S. Dhariwal, S. M. Flockhart, Heriot-Watt University, Edinburgh, United Kingdom
Multiphase Dispersion processes in integrated micromixing and multichannel systems 563 V. Haverkamp, Institute of Microtechnology, Mainz, Germany
18 Modular Silicon Micro Reactors for Organic Chemistry 565 N. Schwesinger, 0. Marufke, M. Stubenrauch, Technical University of llmenau, Germany; M. Hohmann, H. Wurziger, MERCK KGaA Darmstadt, Germany
Microanalytical System for Water Control 571 S. Drost, W. Wbrmann, M. Richter, Fraunhofer-lnstitut fur Festkorpertechnologie (IFT), Munchen, Germany; B. Ross, G. Chemnitius, Institut fur Chemo- und Biosensorik e.V. (ICB), Munster, Germany; 0. Koster, Fraunhofer-lnstitut fiir Mikroelektronische Schaltungen und Systeme (IMS), Duisburg, Germany; W. Konz, Fraunhofer-lnstitut fur Physikalische MeBtechnik (IPM), Freiburg, Germany; F. H. Frimmel, University of Karlsruhe, Germany; W. Schuhmann, L. Meixner, Technical University of Munich, Germany; R. Ferretti, University of Hannover, Germany
Microfluidic System for the Integration of Gassensors 577 A. Meckes, W. Benecke, Universitat Bremen, Germany
Modular 3D MST
Chairmen: Wolfgang Benecke, Universitat Bremen, Germany
The Development of a Top-Bottom-BGA (TB-BGA) 583 R. Leutenbauer, V. Grosser, H. Reichl, FhG-IZM Berlin, Germany; M. Schunemann, FhG-lPA, Stuttgart, Germany
Design and Application of Modular Microsystems 589 M. Schuenemann, G. Bauer, W. Schaefer, Fraunhofer Institute for Manufacturing Engineering and Automation IPA, Stuttgart, Germany; R. Leutenbauer, V. Grosser, Fraunhofer Institute for Mechanical Reliability and Microintegration IZM, Berlin, Germany; V. Zoeppig, Institute for Microsystems Technology, Mechatronics and Mechanics, Technical University of llmenau, Germany
The Design Methodology of 3D-HDI 595 K. Amiri Jam, R. Leutenbauer, V. Grosser, A. Simsek, H. Reichl, Fraunhofer Institute FhG-IZM, Berlin, Germany
Reliability and Testability of Stacked 3D Modules 601 V. GroBer, J.-P. Sommer, R. Leutenbauer, B. Michel, H. Reichl, Fraunhofer Institute Reliability and Microintegration, Berlin, Germany
19 The LTCC-Technique for 3D Packaging 607 F. Bechtold, VIA electronic GmbH, Hermsdorf, Germany
A Modular Housing Concept for Pneumatic Microsystems 615 J. Schaible, S. Messner, M. Miiller, R. Zengerle, Hahn-Schickard-Gesellschaft, Villingen-Schwenningen, Germany
Poster Session
Observation of the Microassembly Process with a Confocal Laser-Scanning-Microsope 621 G. Dussler, B. Brocher, T. Pfeifer, RWTH Aachen, Germany
Analysis of Micromechanical Motion 624 V. Lange, FH Furtwangen, Germany; G. Higelin, School of Applied Science, Nanyang Technological University, Singapore
Geometrical Measurements on Film Structures Using a Scanning Elelctron Microscope 627 T. Ahbe, N. Haft, K. Hasche, K.-P. Hoffmann, Physikalisch-Technische Bundesanstalt, Braunschweig/Berlin, Germany
The Role of Water on the Micro-Tribology of MEMS 630 M. Scherge, J. A. Schaefer, Technical University of llmenau, Germany; 0. Mollenhauer, TETRA GmbH llmenau, Germany
Long-Solenoid-Type SMT Coil Batchprocessing in Simple MEMS Technology 633 T. Doll, California Inst. of Technology, Pasadena, USA; F. Kaesen, H. Geiger, Universitat der Bundeswehr, Neubiberg, Germany; F. Bartels, Bartels Mikrotechnik GmbH, Dortmund, Germany
A Micromachined Pyroelectric Infrared Detector for Application in a Co2 Controlled Ventilation System 636 A.-C. De Vries, K. Baert, IMEC Leuven, Belgium
Approaches to System-level Modeling and Simulation of Laser Projection Systems using Micromirror Arrays and Rotation-symmetric Reflectors 639 J. Albrecht, L. Melzer, D. Muller, R. Seidel, Chemnitz University of Technology, Germany
20 New Conductive Adhesives for Microelectronic Applications 642 A. Battermann, Panacol-Elosol GmbH, Oberursel, Germany; B. Giinther, H. Schafer, FhG IFAM, Bremen, Germany
Doping Analysis of Polysilicon Layers for the Achievement of the Capacitive Sensors by Surface Micromachining Technology 646 F. Gaiseanu, National Institute of Research-Development for Microtechnology, Bucharest, Romania; J. Esteve Tinto, Centre National de Microelectronica Barcelona, Bellaterra, Spain; A. Perez-Rodriguez, J. R. Morante, University of Barcelona, Spain
Self-lubricating thin films for MEMS 649 Z. Rymuza, M. Misiak, Z. Kusznierewicz, W. Fabianowski, M. Gutkowski, Z. Rzanek-Boroch, J. Sentek, K. Schmidt-Szalowski, Warsaw University of Technology, Poland
Stress Optimization of Reflective Coatings for Micro Mirrors 652 J. Krujatz, Ch. Kaufmann, T. Gessner, Technical University of Chemnitz, Germany
Thin Film Poly-Si70%Ge30% for Thermopiles 655 P. Van Gerwen, K. Baert, R. P. Mertens, IMEC, Leuven, Belgium
A new method to find <1OO> crystral orientation on a (100) silicon wafer by pre-etching process 658 W.-S. Chang, Y.-H. Chang, Y.-C. Huang, J.-M. Lai, W.-H. Chieng, National Chiao Tung University, Hsinchu, Taiwan
Advanced Mask Technology for High Precision LIGA Patterning 661 R. Luttge, G. Reuter, M. Schmidt, A. Schmidt, Institut fur Mikrotechnik Mainz GmbH, Germany; D. Adam, F. Hoke, H. Schacke, Leica Microsystems Lithography GmbH, Jena, Germany; F. Burkhardt, H. Wolf, Photronics MZD GmbH, Dresden, Germany; I. Bubel, H. Hartmann, aiss GmbH, Miinchen, Germany
Mechanically Cut Microstructure Grooves less than 50 urn Wide with Reduced Burr 664 T. Schaller, L. Bohn, J. Mayer, D. Scherhaufer, K. Schubert, Karlsruhe Research Center (FZK), Germany
Characterization of Surface Metallization for Printed Circuit Boards .... 667 E. Auerswald, M. Hannemann, B. Kampfe, R. Schmidt, Fraunhofer Institute for Reliability and Microintegration, Berlin, Germany
21 A Digital Image Processing System to automate the production of microstructures with hot stamping technology 670 B. Kohler, F. Eberle, Forschungszentrum Karlsruhe, Germany
Mask-defined abrasive-jet micromachining 673 A. Kruusing, S. Leppavuori, A. Uusimaki, University of Oulu, Finland; M. Uusimaki, Kemi-Tornio Polytechnic, Kemi, Finland
Preadjusted Assembly Magazines 676 M. Begemann, W. Ehrfeld, F. Michel, L. Weber, U. Berg, Institute of Microtechnology, Mainz, Germany
Injection Moulding of Microstructures with Inductive Heating 679 C. Schaumburg, W. Ehrfeld, L. Weber, Institute of Microtechnology, Mainz, Germany; W. Schinkothe, T. Walther, University of Stuttgart, Germany
Possibilities to realize Low Cost Flip Chip Soldering 682 P. Gratz, F. Feustel, B. Lauterwald, E. Meusel, Technical University of Dresden, Germany
A new Type of Optical Photorefractive Interconnects 685 I. G. Voitenko, Institute of Applied Optics, Mogilev, Belarus
Optical Interconnects Formation on the Base of 2-D Gradient Waveguides and Substrate Wave Propagation 688 I. G. Voitenko, Institute of Applied Optics, Mogilev, Belarus; V. E. Samsonov, Institute of Engineering Cybernethics, Minsk, Belarus
Simulation of the propagation of optical waves in space and in microoptical elements 691 W. Stork, K. D. Miiller-Glaser, A. Wagner, University of Karlsruhe, Germany
Three-dimensional micro-electrode configurations for cell manipulation in optical detection systems 694 T. Muller, Th. Schnelle, G. Furh, Humboldt University of Berlin, Germany; G. Gradl, EVOTEC BioSystems GmbH, Hamburg, Germany; S. Howitz, GeSiM mbM, GroBerkmannsdorf, Germany
A Low Temperature Cofiring Ceramic Chamber for Characterization of Internal Electric Particle Properties by a Laseroptical Method 697 J. Gimsa, Humboldt-Universitat zu Berlin, Germany; S. Howitz, GeSiM - Gesellschaft fur Silizium-Mikrosysteme mbH, GroBerkmannsdorf, Germany; L. Rebenklau, Technical University of Dresdan, Germany
22 Micromachined ultrasonic transducer array for applications in liquids . .. 700 L. Thieme, E. Ahl, H. DaBler, W. Manthey, Technical University of Chemnitz, Germany
C0/N02 gas mixture analysis using geometric modulated SnO2 gas sensors for improved selectivity 703 J. Wb'llenstein, H. Bottner, M. Jaegle, F. Volz, FhG - IPM, Freiburg, Germany; W. J. Becker, University of Kassel, Germany
A sensor array for the recognition of grape juice and fermented white wine 706 M. C. Horrillo, I. Sayago, J. Getino, L. Ares, J.I. Robla, M.J. Fernandez, J. Rodrigo, J. Gutierrez, Institute de Fisica Aplicada (IFA), Madrid, Spain
Poly Silicon Germanium Alloys, a Suitable Material for Surface Micromachined Devices 709 S. Sedky, C. Baert, M. Caymax, IMEC, Leuven, Belgium; P. Fiorini, III University of Rome, Italy
Ultraminiaturized thermal analysis sensor and its new heating-rate measuring method 712 M. Kimura, J. Hayasaka, C. Sawai, Tohoku-Gakuin University, Japan
Optical torque generated on star-type rotators based on the single beam gradient force optical trap 715 Y. Ohmachi, M. Hashimoto, T. Yashiro, A. Kanai, Ashikaga Institute of Technology, Tochigi, Japan
A force sensing system detecting the adhesive thickness during microassembly processes 718 T. Scheller, J. Juhasz, R. Eberhardt, Fraunhofer Institut fur Angewandte Optik und Feinmechanik, Jena, Germany
New optoelectronic chips for position control and colour sensing 721 R. Roeder et al., MAZeT GmbH, Jena, Germany
Handling and Assembly of Functionally Adapted Microcomponents - HAFAM, A European Approach in the Field of Training and Research .... 725 W. Brenner, G. Popovic, H. Detter, Institute for Precision Engineering Vienna, Austria R. Duffait, Centre Technique de I'lndustrie Horlogere CETEHOR, Besancon, France; G. Kiriakidis, Foundation for Research and Technology - Hellas, Heraklion, Crete; M. Nienhaus, Institut fur Mikrotechnik Mainz GmbH, Germany; N. F. de Rooij, University of Neuchatel, Switzerland; F. De Bona, Sincrotrone Trieste, Basovizza-Trieste and University of Udine, Italy; R. Martins, E. Fortunato, UNINOVA, Quinta da Torre, Portugal
23 A new Micromanipulation System for Use under SEM Observation 728 W. Brenner, D. Petrovic, E. Chatzitheodoridis, G. Popovic, G. Haddad, C. G. Kukla, A. Vujanic, Technical University of Vienna, Austria
Detection of low reductor gas concentrations with tin oxide microsensors 731 I. Sayago, M.C. Horrillo, J. Getino, M.J. Fernandez, J. Gutierrez, Institute de Fisica Aplicada (IFA), Madrid, Spain; A. Gotz, I. Gracia, L. Fonseca, C. Cane, E. Lora-Tamayo, IMB-CSIC, Bellaterra, Spain
Investigation of a Rigid Carrier CSP with the microDAC Method 734 J. Simon, D. Vogel, W. Faust, A. Gollhardt, B. Michel, Fraunhofer-lnstitut fur Zuverlassigkeit und Mikrointegration, Berlin, Germany
Electroplating of copper in silicon wafers 737 V. Kutchoukov, Ph. Philippov, Technical University of Sofia, Bulgaria; C. Schmidt, Technical University of llmenau, Germany
Trimming of thick film resistors for HIC by high voltage pulses 740 Ph. Philippov, T. Ivantchev, Technical University of Sofia, Bulgaria; H. Thust, Technical University of llmenau, Germany
Untersuchungen zur Kombination nafi- und trockenchemischer Atzverfahren fur die Herstellung von 3D Si-Mikrostrukturen 743 N. Schwesinger, V. lanev, Technical University of llmenau, Germany; Ph. Philippov, Technical University of Sofia, Bulgaria
MESAGO Exhibition Preview / Messeprogramm 747
Author's Index 751
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