Product Manual COM EXPRESS® CEQM77 June 2012 007-03494-0000 Revision history Version Date Description -0000 June 2012 First edition. © 2010 ‐ 2012 by RadiSys Corporation. All rights reserved. Radisys is a registered trademark of RadiSys Corporation. PICMG and COM Express are registered trademarks of the PCI Industrial Computer Manufacturers Group. All other trademarks, registered trademarks, service marks, and trade names are the property of their respective owners. Table of Contents Preface .....................................................................................................................................................7 About this manual.............................................................................................................................................7 What’s new in this release................................................................................................................................7 Electrostatic discharge .....................................................................................................................................8 Where to get more product information ............................................................................................................8 Chapter 1: Product Overview .................................................................................................................9 COM Express product codes..........................................................................................................................10 COM Express modules..............................................................................................................................10 Thermal solutions ......................................................................................................................................10 Module layout .................................................................................................................................................11 CEQM67 and CEQM67HD ........................................................................................................................11 Chapter 2: Product Specifications.......................................................................................................13 Mechanical specifications...............................................................................................................................13 Module interconnectors .............................................................................................................................15 Stack-up heights........................................................................................................................................15 Electrical specifications ..................................................................................................................................17 Module power consumption.......................................................................................................................17 General Purpose I/O (GPIO) power consumption .....................................................................................20 Thermal specifications....................................................................................................................................21 Environmental specifications..........................................................................................................................22 Regulatory compliance...................................................................................................................................23 EMC compliance........................................................................................................................................23 Safety compliance .....................................................................................................................................23 Industry compliance...................................................................................................................................24 MTBF reliability prediction ..............................................................................................................................25 Chapter 3: Hardware Reference...........................................................................................................26 General specifications ....................................................................................................................................26 Block diagram.................................................................................................................................................29 Power supply..................................................................................................................................................30 Power options............................................................................................................................................30 Inrush current.............................................................................................................................................30 3 Table of Contents CPU................................................................................................................................................................34 Specifying the number of active processor cores ......................................................................................35 Platform Controller Hub (PCH) .......................................................................................................................35 System memory..............................................................................................................................................36 DDR3 SDRAM...........................................................................................................................................36 Video ..............................................................................................................................................................36 PCI Express Graphics ...............................................................................................................................36 VGA ...........................................................................................................................................................37 LVDS .........................................................................................................................................................38 Digital display interfaces............................................................................................................................39 Configuring the primary display .................................................................................................................40 Configuring the boot display ......................................................................................................................41 Specifying the graphics source for your LFP .............................................................................................41 Configuring the video memory...................................................................................................................42 Video display options.................................................................................................................................42 Audio ..............................................................................................................................................................43 Configuring the HDA..................................................................................................................................43 Storage I/O .....................................................................................................................................................43 SATA .........................................................................................................................................................43 General I/O.....................................................................................................................................................44 General Purpose I/O (GPIO) .....................................................................................................................44 I2C and SMBus ..........................................................................................................................................44 Low Pin Count (LPC).................................................................................................................................44 PCI Express...............................................................................................................................................45 Serial port ..................................................................................................................................................46 SPI flash ....................................................................................................................................................46 USB ...........................................................................................................................................................47 Legacy support ..........................................................................................................................................48 Ethernet..........................................................................................................................................................49