X16, X32 Automotive LPDDR SDRAM Features Automotive LPDDR SDRAM MT46H128M16LF – 32 Meg X 16 X 4 Banks MT46H64M32LF – 16 Meg X 32 X 4 Banks

X16, X32 Automotive LPDDR SDRAM Features Automotive LPDDR SDRAM MT46H128M16LF – 32 Meg X 16 X 4 Banks MT46H64M32LF – 16 Meg X 32 X 4 Banks

2Gb: x16, x32 Automotive LPDDR SDRAM Features Automotive LPDDR SDRAM MT46H128M16LF – 32 Meg x 16 x 4 Banks MT46H64M32LF – 16 Meg x 32 x 4 Banks Features Options Mark •VDD/VDDQ •VDD/VDDQ = 1.70–1.95V – 1.8V/1.8V H • Bidirectional data strobe per byte of data (DQS) • Configuration • Internal, pipelined double data rate (DDR) – 128 Meg x 16 (32 Meg x 16 x 4 banks) 128M16 architecture; two data accesses per clock cycle – 64 Meg x 32 (16 Meg x 32 x 4 banks) 64M32 • Differential clock inputs (CK and CK#) • Addressing • Commands entered on each positive CK edge – JEDEC-standard LF • Plastic "green" package • DQS edge-aligned with data for READs; center- – 60-ball VFBGA (8mm x 9mm) DD aligned with data for WRITEs – 90-ball VFBGA (8mm x 13mm) BQ • 4 internal banks for concurrent operation • Timing – cycle time • Data masks (DM) for masking write data; one mask – 4.8ns @ CL = 3 (208 MHz) -48 per byte • Special Options • Programmable burst lengths (BL): 2, 4, 8, or 16 – Automotive (package-level burn-in) A • Concurrent auto precharge option is supported • Operating temperature range • Auto refresh and self refresh modes – From –40˚C to +85˚C IT – From –40˚C to +105˚C1 AT • 1.8V LVCMOS-compatible inputs • Design revision :C • Temperature-compensated self refresh (TCSR)2 • Partial-array self refresh (PASR) Notes: 1. Contact factory for availability. • Deep power-down (DPD) 2. Self refresh supported up to 85 ºC. • Status read register (SRR) • Selectable output drive strength (DS) • Clock stop capability • 64ms refresh; 32ms for the automotive temperature range Table 1: Key Timing Parameters (CL = 3) Speed Grade Clock Rate Access Time -48 208 MHz 4.8ns Table 2: Configuration Addressing – 2Gb Architecture 128 Meg x 16 64 Meg x 32 Configuration 32 Meg x 16 x 4 banks 16 Meg x 32 x 4 banks Refresh count 8K 8K Row addressing 16K A[13:0] 16K A[13:0] Column addressing 2K A11, A[9:0] 1K A[9:0] 09005aef8541eee0 Micron Technology, Inc. reserves the right to change products or specifications without notice. t89m_auto_lpddr.pdf - Rev. I 05/18 EN 1 © 2013 Micron Technology, Inc. All rights reserved. Products and specifications discussed herein are subject to change by Micron without notice. 2Gb: x16, x32 Automotive LPDDR SDRAM Features See Package Block Diagrams for descriptions of signal connections and die configurations for each respective ar- chitecture. Figure 1: 2Gb Mobile LPDDR Part Numbering MT 46 H 64M32 LF KQ -6 A IT :C Micron Technology Design Revision :C = Design generation Product Family 46 = Mobile LPDDR Operating Temperature IT = Industrial (–40°C to +85°C) Operating Voltage AT = Automotive (–40°C to +105°C) H = 1.8/1.8V WT = Wireless (–25°C to +85°C) HC = 1.8/1.2V Special Options (Multiple processing codes are separated Configuration (depth, width) by a space and are listed in hierarchical order.) 128 Meg x 16 Blank = None 64 Meg x 32 A = Automotive 128 Meg x 32 256 Meg x 32 Speed Grade -48 = 4.8ns tCK Addressing -5 = 5ns tCK LF = JEDEC-standard addressing L2 = 2-die stack standard addressing Package Codes L4 = 4-die stack standard addressing DD = 60-ball (8mm x 9mm) VFBGA, “green” BQ = 90-ball (8mm x 13mm) VFBGA, “green” KQ = 168-ball (12mm x 12mm) WFBGA, “green” LE = 168-ball (12mm x 12mm) TFBGA, “green” FBGA Part Marking Decoder Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder. 09005aef8541eee0 Micron Technology, Inc. reserves the right to change products or specifications without notice. t89m_auto_lpddr.pdf - Rev. I 05/18 EN 2 © 2013 Micron Technology, Inc. All rights reserved. 2Gb: x16, x32 Automotive LPDDR SDRAM Features Contents Important Notes and Warnings ......................................................................................................................... 8 General Description ......................................................................................................................................... 8 Functional Block Diagrams ............................................................................................................................. 10 Ball Assignments ............................................................................................................................................ 12 Ball Descriptions ............................................................................................................................................ 14 Package Block Diagrams ................................................................................................................................. 16 Package Dimensions ....................................................................................................................................... 17 Electrical Specifications .................................................................................................................................. 19 Electrical Specifications – IDD Parameters ........................................................................................................ 22 Electrical Specifications – AC Operating Conditions ......................................................................................... 28 Output Drive Characteristics ........................................................................................................................... 32 Functional Description ................................................................................................................................... 35 Commands .................................................................................................................................................... 36 DESELECT ................................................................................................................................................. 37 NO OPERATION ......................................................................................................................................... 37 LOAD MODE REGISTER ............................................................................................................................. 37 ACTIVE ...................................................................................................................................................... 37 READ ......................................................................................................................................................... 38 WRITE ....................................................................................................................................................... 39 PRECHARGE .............................................................................................................................................. 40 BURST TERMINATE ................................................................................................................................... 41 AUTO REFRESH ......................................................................................................................................... 41 SELF REFRESH ........................................................................................................................................... 42 DEEP POWER-DOWN ................................................................................................................................. 42 Truth Tables ................................................................................................................................................... 43 State Diagram ................................................................................................................................................ 48 Initialization .................................................................................................................................................. 49 Standard Mode Register .................................................................................................................................. 52 Burst Length .............................................................................................................................................. 53 Burst Type .................................................................................................................................................. 53 CAS Latency ............................................................................................................................................... 54 Operating Mode ......................................................................................................................................... 55 Extended Mode Register ................................................................................................................................. 56 Temperature-Compensated Self Refresh ...................................................................................................... 56 Partial-Array Self Refresh ............................................................................................................................ 57 Output Drive Strength ................................................................................................................................ 57 Status Read Register ....................................................................................................................................... 58 Bank/Row Activation .....................................................................................................................................

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