Senior Design II Fall 2019 Keyless Entry Group 11 Don Vo, CpE Ethan Ahrens EE Justin Couch, EE Kevin Rhu, EE 08/02/2019 Robotics Club at UCF Table of Contents 1 Executive Summary ................................................................................................................................ 1 2 Project Description .................................................................................................................................. 2 2.1 Motivation .......................................................................................................................................... 3 2.2 Goals & Objectives .......................................................................................................................... 4 2.3 Extended Goals ............................................................................................................................... 5 2.3.1 Tier 1 Goals ................................................................................................................................... 5 2.3.2 Tier 2 Goals ................................................................................................................................... 6 2.3.3 Tier 3 Goals ................................................................................................................................... 7 2.4 Feature Design................................................................................................................................. 7 2.4.1 RFID Sensor: ............................................................................................................................ 7 2.4.2 Bluetooth & Beagleboard: ....................................................................................................... 8 2.4.3 Fingerprint Sensor: ................................................................................................................... 8 2.4.4 Switch Between Types of Entry: ............................................................................................ 8 2.4.5 Android/ iPhone Application: .................................................................................................. 9 2.4.6 Power: ........................................................................................................................................ 9 2.5 Project Requirements and Specifications .................................................................................... 9 2.5.1 Engineering Requirement Specifications .............................................................................. 9 2.5.2 Technical Specifications ........................................................................................................ 10 2.5.2a Size and Power Constraints ........................................................................................... 11 2.5.2b Budget ................................................................................................................................ 11 2.5.2c House of Quality Diagram ............................................................................................... 12 2.5.2d Block Diagram .................................................................................................................. 14 2.5.2e Milestones ......................................................................................................................... 15 2.5.3 User Constraints ..................................................................................................................... 15 3 Research ................................................................................................................................................ 16 3.1 Industrial Products ......................................................................................................................... 16 3.1.1 August Lock ............................................................................................................................. 16 3.1.2 Schlage .................................................................................................................................... 18 3.1.3 Kwikset Kevo ........................................................................................................................... 19 3.2 Similar Projects .............................................................................................................................. 20 3.2.1 TI Battery Powered Smart Lock with Cloud Connectivity ................................................. 20 3.2.2 TI Smart Lock Reference Design on 4x AA Batteries ....................................................... 21 i | P a g e 3.3 User Interface ................................................................................................................................. 22 3.3.1 Fingerprint Sensor: ................................................................................................................. 22 3.3.1a Fingerprint Sensor Comparison ..................................................................................... 23 3.3.2 RFID Sensor: .......................................................................................................................... 24 3.3.2a RFID Sensor Comparison ............................................................................................... 24 3.3.3 Keypad: .................................................................................................................................... 26 3.3.3a Keypad Comparison ........................................................................................................ 26 3.3.4 Bluetooth .................................................................................................................................. 28 3.3.5 Android/iOS Application: ....................................................................................................... 30 3.3.6 Alexa Interface: ....................................................................................................................... 31 3.4 Internal Components ..................................................................................................................... 32 3.4.1 Motors ...................................................................................................................................... 32 3.4.1a DC Motor ........................................................................................................................... 32 3.4.1b Servo Motor ....................................................................................................................... 33 3.4.1c Stepper Motor ................................................................................................................... 34 3.4.2 Motor Driver ............................................................................................................................. 34 3.4.3 Accelerometer ......................................................................................................................... 36 3.4.4 Transistors and Diodes.......................................................................................................... 37 3.4.5 LED Display ............................................................................................................................. 39 3.5 Power .............................................................................................................................................. 39 3.5.1 Batteries ................................................................................................................................... 39 3.5.2 Power Supply .......................................................................................................................... 41 3.5.3 Voltage Regulation ................................................................................................................. 42 3.5.4 Power Monitoring ................................................................................................................... 43 3.5.5 Power Protection .................................................................................................................... 44 3.6 Microcontroller ................................................................................................................................ 45 3.6.1 Arduino ..................................................................................................................................... 45 3.6.2 Raspberry Pi ........................................................................................................................... 47 3.6.3 Beaglebone ............................................................................................................................. 48 3.6.4 Texas Instruments .................................................................................................................. 49 3.8 Circuitry Housing ........................................................................................................................... 52 3.8.2 Repurposing a Casing ........................................................................................................... 52 3.8.3 3D Printing ............................................................................................................................... 53 ii | P a g e 4 Standards & Constraints .....................................................................................................................