Intel® Xeon® Processor E5 v4 Product Family Thermal Mechanical Specification and Design Guide June 2016 Document Number: 333812-002 IntelLegal Lines and Disclaimerstechnologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppal or otherwise) to any intellectual property rights is granted by this document. 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All Rights Reserved. 2 Intel® Xeon® Processor E5-2600 v4 Product Family Thermal Mechanical Specification and Design Guide June 2016 Contents 1Introduction..............................................................................................................7 1.1 Definition of Terms ..............................................................................................7 1.2 Reference Documents ..........................................................................................9 2 Processor Thermal Specifications and Features ....................................................... 11 2.1 Margin to Thermal Specification (M)..................................................................... 11 2.2 Embedded Server Thermal Profiles ...................................................................... 13 2.2.1 NEBS TCASE Thermal Profile ..................................................................... 13 2.2.2 NEBS TDTS Thermal Profile....................................................................... 14 2.3 Processor Thermal Features................................................................................ 15 2.3.1 Absolute Processor Temperature .............................................................. 15 2.3.2 Short Duration TCC Activation.................................................................. 16 2.3.3 Thermal Design Guidelines ...................................................................... 16 3 Processor Thermal Specifications ............................................................................ 19 3.1 Thermal Specifications ....................................................................................... 19 3.2 TCASE and DTS Based Thermal Specifications ....................................................... 20 3.3 Thermal Metrology ............................................................................................ 20 3.4 Server Processor Thermal Profiles and Form Factors............................................... 21 3.5 Embedded Server Processor Thermal Profiles ........................................................ 25 4 Processor Mechanical Specifications........................................................................ 27 4.1 Package Size .................................................................................................... 27 4.2 Package Loading Specifications ........................................................................... 28 4.3 Processor Mass Specification............................................................................... 29 4.4 Processor Materials............................................................................................ 29 4.5 Processor Markings............................................................................................ 29 4.6 Package Handling Guidelines............................................................................... 29 5 Quality, Reliability and Ecological Requirements...................................................... 31 5.1 Use Conditions.................................................................................................. 31 5.2 Intel Reference Component Validation.................................................................. 32 5.2.1 Board Functional Test Sequence ............................................................... 32 5.2.2 Post-Test Pass Criteria Examples .............................................................. 32 5.2.3 Recommended BIOS/Processor/Memory Test Procedures ............................. 33 5.3 Material and Recycling Requirements ................................................................... 33 A Mechanical Drawings............................................................................................... 35 B Embedded Thermal Solutions .................................................................................. 39 B.1 Performance Targets.......................................................................................... 39 B.2 Mechanical Drawings and Supplier Information...................................................... 40 Intel® Xeon® Processor E5-2600 v4 Product Family 3 Thermal Mechanical Specification and Design Guide June 2016 Figures 2-1 Margin to Thermal Spec (M) ................................................................................12 2-2 NEBS TCASE Thermal Profile Example...................................................................14 2-3 NEBS DTS Thermal Profile Example ......................................................................15 2-4 Thermal Characterization Parameters ...................................................................18 3-1 Typical Thermal Profile Graph (Illustration Only) ....................................................20 3-2 TCASE Measurement Location .............................................................................21 4-1 Processor Package Assembly Sketch.....................................................................27 4-2 Intel® Xeon® Processor E5-2600 v4 Processor Substrate Size ................................28 4-3 Processor Markings ............................................................................................29 A-1 Package Mechanical Drawing (Sheet 1 of 2)...........................................................36 A-2 Package Mechanical Drawing (Sheet 2 of 2)...........................................................37 B-1 ATCA Heatsink Performance Curves......................................................................40 B-2 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2).............................................41 B-3 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2).............................................42 Tables 1-1 Terms and Descriptions ....................................................................................... 7 1-2 Reference Documents.......................................................................................... 9 2-1 DTS 2.0 Margin From PECI..................................................................................12 2-2 DTS 2.0 Margin From Processor Register: CSR for PACKAGE_THERM_MARGIN ...........13 3-1 Intel Xeon Processor E5-2600 v4 Processor Family Thermal Profiles..........................21 3-2 Intel Xeon Processor E5-4600 v4 Product Family TCASE and DTS Thermal Profiles, and Correction Factors ...............................................................24 3-3 Intel Xeon Processor E5-1600 v4 Product Family TCASE and DTS Thermal Profiles, and Correction Factors ...............................................................25 3-4 Embedded Server Processor Thermal Profiles.........................................................26 4-1 Processor Loading Specifications ..........................................................................28 4-2 Processor Materials ............................................................................................29 4-3 Load Limits for Package Handling.........................................................................30 A-1 List of Mechanical Drawings.................................................................................35 B-1 Reference Thermal Solution Boundary Conditions ...................................................39 B-2 High Case Temperature Thermal Profile ................................................................40