REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Orbbec’s Front 3D Depth Sensing System in the Oppo Find X The first introduction of Orbbec’s 3D front depth sensing system in a mobile application featuring a global shutter, a dot projector and a custom system-on- chip. Last year, ahead of its competitors, Apple The camera and dot projector module introduced front 3D depth sensing in its assembly uses standard wire bonding to flagship model, the iPhone X. Following connect the sensor or the VCSEL dies, this trend, Chinese players like Vivo, along with an optical module comprising Xiaomi, Huawei and Oppo also decided to four lenses for both modules. integrate such modules, providing new features for security or entertainment in This report analyzes the complete 3D their flagships. For the first Oppo depth sensing system, including a smartphone sold in Europe, the Find X, complete analysis of the NIR camera Orbbec has been chosen to provide the module, the dot projector and the SoC, complete 3D solution. Working together along with cost analysis and price with a custom system-on-chip (SoC) and a estimation for the system. It also includes global shutter (GS) near infrared (NIR) a physical and technical comparison with camera module, the dot projector is the the 3D sensing systems from Apple in the first to use a camera module assembly iPhone X. The comparison looks at system configuration for structured light integration, the NIR camera module and illumination. the dot projector architecture. Located in the Find X’s front side, around Title: Orbbec’s COMPLETE TEARDOWN WITH Front 3D Depth the speaker, the 3D system is packaged in Sensing System in one metal enclosure. The system features • Detailed photos a dot projector, a flood illuminator, a the Oppo Find X • Precise measurements red/green/blue camera and a NIR camera Pages: 170 sensor. An additional SoC component is • Materials analysis soldered on the main board to process Date: November • Manufacturing process flow 2018 the signal from the latter devices. • Supply chain evaluation Format: The system uses standard components PDF & Excel file found on the market. That includes a GS • Manufacturing cost analysis image sensor featuring 3µm size pixels Price: • Estimated sales price EUR 3,990 and standard resolution of 1 megapixel and a vertical cavity surface emitting laser • Comparison with Apple iPhone X 3D (VCSEL). The system is therefore very cost sensing solution efficient compared to other solutions. IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY ORBECC’S FRONT 3D DEPTH SENSING SYSTEM IN THE OPPO FIND X TABLE OF CONTENTS Overview/Introduction Manufacturing Process Flow Company Profile • Die Fabrication Unit : NIR Image Sensor, NIR Oppo Find X – Teardown VCSEL, Orbbec SoC Market Analysis • NIR VCSEL Process Flow Physical Analysis Cost Analysis • Physical Analysis Methodology • Cost Analysis Overview • NIR Camera Module Disassembly and Cross- Section • Supply Chain Description and Yield Hypotheses • Sensor Die • NIR Image Camera Module Cost o View, dimensions, pixels, pads, markings, die process and cross- o Front-end (FE), microlens and total section FE cost • DOT Projector Module Disassembly and o Wafer and die cost Cross-Section o Lens module and assembly cost • NIR VCSEL Die • NIR VCSEL Die Cost o View, dimensions, die process and o Front-end (FE), wafer and die cost cross-section o Front-end cost per process steps • Orbbec MX6300B – Component Analysis o Lens module and assembly cost o Package/die view and dimensions • SoC Die Cost o Die delayering, main block IDs and structural blocks o Front-end (FE), wafer and die cost o Die process and cross-section o Packaging and component cost • Physical Data Summary Estimated Price Analysis: NIR Camera Module, Physical Comparison: Apple iPhone X DOT Projector Module, SoC and Optical Hub • System Integration • NIR Camera Module and Sensor • Dot Projector Module and VCSEL AUTHORS Dr. Stéphane Elisabeth has joined Nicolas Radufe is in charge of physical System Plus Consulting's team in 2016. analysis at System Plus Consulting. He He has a deep knowledge of Materials has a deep knowledge in chemical and characterizations and Electronics physical analyses. He previously systems. He holds an Engineering worked in microelectronics R&D for Degree in Electronics and Numerical CEA/LETI in Grenoble and for Technology, and a PhD in Materials for STMicroelectronics in Crolles. Micro-electronics. RELATED REPORTS STMicroelectronics’ Near IR Apple iPhone X –Infrared Dot Lenovo Phab2Pro 3D ToFCamera Camera Sensor in the Apple Projector World’s first 3D tri-camera bundle including Infineon/pmd The world’s most advanced dot iPhone X REAL3TM ToF image sensor The 1st NIR camera sensor with projector for 3D sensing with integrated into a consumer multiple innovations based on four innovative parts: Its smartphone. imager-SOI substrates from package; a dedicated VCSEL; a January 2017 - EUR 3,990* SOITEC… folded optic; and the active DOE. 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