AN ABSTRACT OF THE DISSERTATION OF Patrick Scot McNeff for the degree of Doctor of Philosophy in Industrial Engineering presented on July 15, 2019 Title: Manufacturing Process Design and Electrically-Assisted Embossing of a Microchannel Solar Receiver Abstract approved: ______________________________________________________ Brian K. Paul Manufacturing process design (MPD) represents a design-oriented approach to manufacturing engineering. In this dissertation, Haynes 230 (H230), a solid solution- strengthened Ni-based superalloy, was chosen to meet the material requirements of a microchannel solar receiver (MSR) needed to increase the efficiency and reduce the cost of solar thermal power generation. An MPD was developed to enable the cost-effective production of the MSR revealing the need to increase the height-to-diameter aspect ratio of posts using electrically-assisted (EA) forming in order to reduce the mass and cost of MSR fluidic interconnects. Efforts to validate the MPD through fabrication of sub-scale MSR test articles resulted in several process failures that were used to refine the MPD. Among them, the EA forming and diffusion bonding of MSR micropost arrays was investigated. Electroplastic effects in the EA forming of H230 show a decrease in yield strength accompanied by a reduction in elongation, contrary to precipitation-hardened Ni- based alloys. These differences are attributed to reductions in grain size brought on by the rapid precipitation of carbide precipitates, which possess higher electrical conductivity and, thus, produce lower processing temperatures. Results suggest the need to perform solutionizing heat treatments of H230 after EA forming, prior to diffusion bonding, in order to meet the requirements of the MSR. ©Copyright by Patrick Scot McNeff July 15, 2019 All Rights Reserved Manufacturing Process Design and Electrically-Assisted Embossing of a Microchannel Solar Receiver by Patrick Scot McNeff A DISSERTATION submitted to Oregon State University in partial fulfillment of the requirements for the degree of Doctor of Philosophy Presented July 15, 2019 Commencement June 2020 Doctor of Philosophy dissertation of Patrick Scot McNeff presented on July 15, 2019 APPROVED: Major Professor, representing Industrial Engineering Head of the School of Mechanical, Industrial, and Manufacturing Engineering Dean of the Graduate School I understand that my dissertation will become part of the permanent collection of Oregon State University libraries. My signature below authorizes release of my dissertation to any reader upon request. Patrick Scot McNeff, Author ACKNOWLEDGEMENTS The author expresses sincere appreciation to my advisor, committee, research group, family, friends and fiancée. CONTRIBUTION OF AUTHORS Chapter 1 has been modified and expanded from: Paul, B.K., McNeff, P.S, Brannon, S., O’Halloran, M., The Role of Manufacturing Process Design in Technology Commercialization, in Emerging Frontiers in Industrial and Systems Engineering H.B. Nembhard, E.A. Cudney, and K.M. Coperich, Editors. 2019, CRC Press: Boca Raton, FL. p. 257-286. This was written by Brian Paul and myself. Sam Brannon contributed via revisions to the chapter as well as input and assistance in developing the methodogy described in this chapter. Michael O’Halloran was instrumental in the development of this mythology over the past several years working with Brian Paul. Chapter 2’s author contributions are as follows: Dogan and Rozman conducted materials analysis and failure analysis of the microchannel solar receiver. Sean Kissick and Hailei Wang conducted mechanical experiments of the prototype including pressure failure tests. Authors Kevin Drost, Brian Fronk and I were responsible for the failure mode effects analysis and writing of this paper. TABLE OF CONTENTS Page 1. General Introduction ................................................................................................ 1 2.1. Introduction .................................................................................................................. 5 2.2. Motivation .................................................................................................................... 9 2.3. Microchannel Process Technology ............................................................................ 11 2.4. Manufacturing Process Design .................................................................................. 14 2.4.1 Development of Manufacturing Processes as a Design Activity ..........................15 2.4.2 Process Requirements ............................................................................................16 Engineering Specifications ......................................................................................... 17 2.4.3 Production Cost Targets ........................................................................................19 Example 1: Process Requirements for the Microchannel Solar Receiver (MSR) ...... 20 2.4.4 Conceptual Design .................................................................................................21 2.4.5 Manufacturing Process Sequence Diagram ...........................................................21 Example 2: Process sequence diagram of the microchannel solar receiver ............... 22 Manufacturing Process Selection ............................................................................... 23 Example 3: Mechanical Machining vs Green Sand Casting of the MSR .................. 26 2.4.6 Detailed Design .....................................................................................................29 Capability Analysis .................................................................................................... 30 Example 4: Strain rate of microchannel flow insert requires servo press versus a 4 post press. ........................................................................................................................... 31 Grouping Process Steps for Tool Sharing .................................................................. 33 Capacity Analysis ....................................................................................................... 34 Example 7: Metal Additive Manufacturing ............................................................... 40 Machine Tool Block Diagram .................................................................................... 43 Example 8: Machine Tool Block Diagram ................................................................ 43 2.4.7 Design Evaluation..................................................................................................45 2.4.8 Processing Cost Elements ......................................................................................46 2.4.9 Raw Material Cost .................................................................................................49 TABLE OF CONTENTS (Continued) Page 2.4.10 Cumulative Yield .................................................................................................49 2.4.11. Process Validation ..............................................................................................52 2.5 Case Study: Microchannel Solar Receiver ................................................................. 53 2.5.1 Product and Process Requirements........................................................................54 2.5.2 Conceptual Design .................................................................................................54 2.5.3 Initial Evaluation ...................................................................................................56 2.5.4 Detailed Design .....................................................................................................56 2.5.6 Final Evaluation .....................................................................................................59 2.6. References .................................................................................................................. 61 3.1. Abstract ...................................................................................................................... 67 3.2 Introduction ................................................................................................................. 68 3.3 Receiver Material and Design ..................................................................................... 72 3.4 Receiver Fabrication Approach .................................................................................. 77 3.5 Proof Testing and Failure Analysis ............................................................................. 80 3.5.1 Failures Related to TLP Bond ...............................................................................81 3.5.2 Failure Related to Manufacturing Defects .............................................................86 3.5.3 Failures Related to Design .....................................................................................89 3.6 Lessons Learned and Conclusions .............................................................................. 91 3.7 Nomenclature .............................................................................................................. 93 3.8 Acknowledgements ..................................................................................................... 94 3.9 References ................................................................................................................... 95 4.1. Introduction .............................................................................................................