SKiiP® 4 Proven Intelligent Power Module FORMS.1014 / Rev. 07 Presenter Biography Senior Manager Product Management IPM and Electronics Background: − R&D of frequency converters and power electronics from 30W to 1.5MW − Power Electronics, circuit design and PWM and control software for drives − 18 years managing application engineering activities for: − Industrial IGBT Modules − IPM Modules − High Voltage IHM traction modules 3 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Agenda SEMIKRON SKiiP®4 core technologies Market, Supply and SKiiP®4 Growth SKiiP®4 Features Terminology construction Interface Functionality Safety Isolated Digital Gate Driver and CAN Bus Product Range Overview Reliability Sintering and Environmental Robustness High Performance Cooling (HPC) Advantage of baseplate-less interface to HPC Cooler Performance comparison SKiiP®4 Generator- and Grid side optimized chip sizing Availability of SKiiP®4 on (double sided) HPC and SemiSel V Summary 4 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Product Range Components: Market Standards and Specifics Bipolar Applications Rectifiers, soft starters, power modules Diodes & Thyristors Chips Diode / thyristor modules Applications Rectifiers, soft starters SEMITOP SEMIPONT SEMIPACK SEMiX IGBT / MOSFET modules Applications Drives, power supply, welding, solar, traction SEMITOP MiniSKiiP SEMiX SEMITRANS SKiM SEMITRANS 20 IGBT Plug & Play und driver cores Applications Drives, power supply, SKYPER 12 press-fit SKYPER Prime SKYPER 12 SKYPER 32/32PRO SKYPER 42/42LJ energy storage, solar, traction High-power intelligent power modules Applications Renewable energy, transportation, SKiiP®3 drives SKiiP®4 5 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 Integrated solution SKiiP4 − High power half bridge − Integrated Gate drive − Safety isolated current and voltage sensor − Protection functions − CAN Bus monitoring − Optional custom functionalities. 6 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 Innovative Integration − Sintered Technology Pressure part Pressure foam − Baseplate-less highly efficient direct thermal contact to heatsink Multi finger low Insulation sheet inductive busbar (DC connection) − High Performance Thermal Interface Insulation sheet material Multi finger low inductive busbar (DC-connection) AC busbar with − Minimized stray inductance by Insulation sheet insulation integrated laminar busbar construction Half bridge housing Precision Substrate (DCB) compensated with (sintered) current sensor IGBT and diode chips 7 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Interfaces: Electrical and optical interface solutions Electrically isolated interface for control and error messages CAN Bus connection with further enhanced functionality (see Technical Explanation) Optional fiber optical interface converter SKiiP4 isolated electrical interface (DB25 connector) and optional fiber optical interface 8 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Gate driver: SEMIKRON ASICs make it reliable and intelligent 9 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 CAN Bus connectivity Configuration and parameter monitoring is possible through the CAN Bus interface online and off-line. The function allows further customization to tailor the SKiiP4 for applications. Please get in touch with our expert team to explore the possibilities of the Multiple options to configure and read out the SKiiP4 through CAN Bus enhanced configuration options of the SKiiP4 10 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 available portfolio (standard water/air cooled)) 3-fold (1800A) 4-fold (2400A) 6-fold (3600A) 1200V: 1700V: 1200V: 1700V: 1200V: 1700V: SKiiP SKiiP SKiiP SKiiP SKiiP SKiiP 1814GB12E4- 1814GB17E4- 2414GB12E4- 2414GB17E4- 3614GB12E4- 3614GB17E4- 3DUW 3DUW 3DUW 3DUW 3DUW 3DUW 1200V: 1700V: 1200V: 1700V: 1200V: 1700V: SKiiP SKiiP SKiiP SKiiP SKiiP SKiiP 1814GB12E4- 1814GB17E4- 2414GB12E4- 2414GB17E4- 3614GB12E4- 3614GB17E4- 3DUL 3DUL 3DUL 3DUL 3DUL 3DUL 11 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Agenda SEMIKRON SKiiP®4 core technologies Market, Supply and SKiiP®4 Growth SKiiP®4 Features Terminology construction Interface Functionality Safety Isolated Digital Gate Driver and CAN Bus Product Range Overview Reliability Sintering and Environmental Robustness High Performance Cooling (HPC) Advantage of baseplate-less interface to HPC Cooler Performance comparison SKiiP®4 Generator- and Grid side optimized chip sizing Availability of SKiiP®4 on (double sided) HPC and SemiSel V Summary 12 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 Reliability and Module Technology Die Attach Die Connection Terminal Connection Heatsink to Interface Sintering provides Several chip top Solderless and bond wire Baseplate-less design exceptional reliability connections are possible less connection for provides exceptional for demanding exceptional reliability thermal performance applications. - Aluminum especially in water cooled Multi finger contacts for solutions. Sintering improves the - Cladded Aluminum life time of wind Copper bonding to - lowest stray inductance High Performance converter application for optimize the power cooler (HPC) further cycling capabilities and - very balanced current generator side sharing among chips boost SKiiP performances converters. further enhance the over performing base reliability. - SOA and thermal loss plate modules. distribution. 13 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON The SKiiP®4 and the new High Performance Cooler (HPC) 14 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4: Advantage of Baseplate-less on HPC Best Performance! SKiiP (baseplate-less) on standard water SKiiP (baseplate-less) on Commodity IGBT module with Cu baseplate on cooler High Performance water Cooler (HPC) High Performance water Cooler Advantage: Advantage: Advantage: − Pressure system controlled − Pressure system controlled − Small Rth(Al) contact of DCB to heatsink contact of DCB to heatsink − Large surface to cooling fluid through High Performance through High Performance Disadvantages: Thermal Paste (HPTP) Thermal Paste (HPTP) − Comparatively small R (Al) − Additional Rth(Cu) Disadvantage: th − Large surface for cooling − Additional solder layer (DBC- − Comparatively large Rth(Al) fluid baseplate) = Additional Rth! 15 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 4-fold: standard NHC-300 vs. High Performance Cooler Tj,max [°C] incl. ripple High performance cooler optimized structure for low 170 pressure drop and low NHC300 HPC thermal resistance 150 = increase performance 130 without negative impact on existing systems. 110 +25% 90 70 Conditions: 50 500 700 900 1100 1300 1500 1700 1900 2100 VDC=1150V, m=0.85 Irms [A] cos(ϕ)=0.85 SKiiP2414GB17E4-4DUHP „HPC“ simulation versus SKiiP2414GB17E4-4DUW fc=2.5kHz standard „NHC300“ water cooler: Tw = 55°C (16l/min) Maximum output performance increase: 25% 50% Ethylene glycol Simulation data extracted from SemiSel V (08.10.2020). Limitations may apply. 16 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Agenda SEMIKRON SKiiP®4 core technologies Market, Supply and SKiiP®4 Growth SKiiP®4 Features Terminology construction Interface Functionality Safety Isolated Digital Gate Driver and CAN Bus Product Range Overview Reliability Sintering and Environmental Robustness High Performance Cooling (HPC) Advantage of baseplate-less interface to HPC Cooler Performance comparison SKiiP®4 Generator- and Grid side optimized chip sizing Availability of SKiiP®4 on (double sided) HPC and SemiSel V Summary 17 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON Wind converter: Big or standard size Diode? Generator side converter Grid side converter Diode size: Tailor made inhouse design 0Hz…10Hz, cos(ϕ) < 0 50Hz/ 60Hz, cos(ϕ) > 0 Line frequency Low rotor frequency High switching frequency High input voltage More Diode High output voltage Negative power factor performance Less Diode Positive power factor requirement High temperature ripple performance High Junction High stress on diode requirement temperature High stress on IGBT Big diode is required Big IGBT is required Q: What is the best size for a diode? A: It depends on real conditions Diode size grading needed 18 31.01.2020 FORMS.1014 / Rev. 07 SKiiP®4 on High Performance Cooler (HPC) product presentation || PUBLIC SEMIKRON SKiiP®4 Flexibility: It is possible to optimize each application in IGBT and Diode size fc~1,75kHz fc~3kHz mains ~6Hz grid 50Hz Wind Generator: Grid side: „Big” diode „Big” IGBT The SKiiP4 power stage can be customized to provide gradually up to 50% increased