2nd Generation Intel® Core™ Processor Family Mobile with ECC Datasheet Addendum May 2012 Revision 002 Document Number: 324855-002 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR. A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS, OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The information here is subject to change without notice. Do not finalize a design with this information. The products described in this document may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. Sandy Bridge may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Intel, the Intel Core family of processors, the Mobile Intel Series Chipset, Intel Fast Memory Access, and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. *Other names and brands may be claimed as the property of others. Copyright © 2012, Intel Corporation. All rights reserved. 2 2nd Generation Intel® Core™ Processor Family Mobile with ECC Datasheet Addendum Doc #324855-002 Contents2B 1 Specification Addenda ........................................................................................ 5 1.1 Related Documents ................................................................................. 5 1.2 Terminology ........................................................................................... 6 1.3 Introduction ........................................................................................... 8 1.4 Interfaces ............................................................................................. 10 1.4.1 System Memory Support ........................................................... 10 1.4.2 PCI Express*............................................................................ 11 1.5 Signal Information ................................................................................. 11 1.6 Thermal and Power Specifications ............................................................ 12 1.6.1 TDP specifications ..................................................................... 12 1.6.2 Package Turbo Parameters ........................................................ 13 1.7 DC Specifications ................................................................................... 14 1.7.1 Voltage and Current Specifications .............................................. 14 1.8 Package ................................................................................................ 18 Figures0B Figure 1. Huron River Platform with Sandy Bridge-Mbl + ECC Processor ................... 9 Figure 2. Top Left Side ...................................................................................... 34 Figure 3. Top Right Side .................................................................................... 35 Figure 4. Bottom Ride Side ................................................................................ 36 Figure 5. Bottom Left Side ................................................................................. 37 Figure 6. Sandy Bridge-Mbl +ECC Four-Core-Die 1023 Ball BGA Package Drawing 1 . 39 Figure 7. Sandy Bridge-Mbl +ECC Four-Core-Die 1023 Ball BGA Package Drawing 2 . 40 Figure 8. Sandy Bridge-Mbl Two-Core-Die 1023 Ball BGA Package Drawing 1 .......... 41 Figure 9. Sandy Bridge- Mbl BGA Two-Core-Die 1023 Ball Package Drawing 2 .......... 42 Tables1B Table 1. Processor Documents ............................................................................. 5 Table 2. PCH Documents .................................................................................... 5 Table 3. Public Specifications............................................................................... 6 Table 4. Memory Bus Signals for the Sandy Bridge-Mbl+ECC Processor ................... 11 Table 5. TDP specifications ................................................................................. 13 Table 6. Package Turbo Parameters Information ................................................... 13 Table 7. Processor Core (VCC) Active and Idle Mode DC Voltage and Current Specifications ............................................................................................. 14 Table 8. Processor Uncore (VCCIO) Supply DC Voltage and Current Specifications ..... 16 Table 9. Memory Controller (VDDQ) Supply DC Voltage and Current Specifications .... 16 Table 10. System Agent (VCCSA) Supply DC Voltage and Current Specifications ......... 16 Table 11. Processor PLL (VCCPLL) Supply DC Voltage and Current Specifications ......... 17 Table 12. Processor Graphics (VAXG) Supply DC Voltage and Current Specifications ... 17 Table 13. Processor Package Information ............................................................ 19 Table 14. Sandy Bridge-Mbl+ECC Processor Pin Listing for the BGA1023 Package .... 19 Table 15. Sandy Bridge-Mbl+ECC BGA processor Sku Listing/Die type ..................... 38 Doc #324855-002 2nd Generation Intel® Core™ Processor Family (With ECC) Datasheet Addendum 3 Revi3B sion History Document Revision Description Revision Date Number Number 324855 002 Added notes for Memory and PCIe bus features of the April 2012 Celeron 807UE (10 Watt) SKU Added Section 1.7 DC Specifications to include DC electrical specs for the Celeron 807UE (10 Watt) SKU 324855 001 Initial release January 2011 § 4 2nd Generation Intel® Core™ Processor Family Mobile with ECC Datasheet Addendum Doc #324855-002 Specification Addenda 1 Specification Addenda 1.1 Related5B Documents Refer to the documents in the tables below for additional information. Table 1. Processor Documents Document Document No./Location Huron River Platform Power Delivery Design Guide edc.intel.com 2nd Generation Intel® Core™ Processor Family Mobile Datasheet Volume 1 Supporting Intel® Core™ i7 Mobile Extreme Edition Processor Series and www.intel.com Intel® Core™ i5 and i7 Mobile Processor Series 2nd Generation Intel® Core™ Processor Family Mobile Datasheet Volume 2 Supporting Intel® Core™ i7 Mobile Extreme Edition Processor Series and www.intel.com Intel® Core™ i5 and i7 Mobile Processor Series Intel® Core™ i7-600, i5-500 and i3-300 Mobile Processor Series Datasheet 416056 Addendum 436735 [Huron River] Platform – Design Guide edc.intel.com Huron River Platform for Embedded Computing - Platform Design Guide 439096 (PDG) Addendum edc.intel.com 440737 PCIe* Bifurcation in Sandy Bridge Application Note Rev 0.7 edc.intel.com Intel® MVP-7.0 Mobile Processor and Mobile Chipset Voltage Regulation TBD Specification RS - Platform Environment Control Interface (PECI) Specification 25891 Table 2. PCH Documents Document Document No./Location 324645 Intel® 6 Series Chipset and Intel®