Senior Design I Final Document G.A.R.V.I.S. Gesture-Controlled Automated Residency Via Intelligent System Group 23 Joshua Illes Jackson Schleich Andres Mujica Sarah Strauss 1 TABLE OF CONTENTS 1 Executive Summary ...................................................................................... 1 2 Project Description ........................................................................................ 3 2.1 Project Motivation ................................................................................... 3 2.2 Goals and Objectives ............................................................................. 4 2.3 Block Diagram ........................................................................................ 5 3 Research Related to Project Definition .......................................................... 8 3.1 Existing Similar Projects and Products ................................................... 8 3.1.1 Automated Residencies .................................................................... 8 3.1.1.1 Lutron Electronics, Quantum ...................................................... 8 3.1.1.2 X10 ............................................................................................. 9 3.1.2 Gesture Control Systems ................................................................ 10 3.1.2.1 Keyglove................................................................................... 10 3.1.2.2 The Sign Language Glove ........................................................ 11 3.2 Relevant Technologies ......................................................................... 11 3.2.1 Communication ............................................................................... 11 3.2.1.1 UART ....................................................................................... 11 3.2.1.2 PWM ........................................................................................ 12 3.2.1.3 PLC .......................................................................................... 12 3.2.1.3.1 Background ......................................................................... 12 3.2.1.3.2 Narrowband PLC................................................................. 13 X10 ............................................................................... 13 CEBus .......................................................................... 13 Lon Works .................................................................... 14 3.2.1.3.3 Modulations ......................................................................... 14 Frequency Shift Keying (FSK) ..................................... 14 Phase Shift Keying (PSK) ............................................ 15 Amplitude Shift Keying (ASK) ....................................... 16 3.2.1.3.4 Broadband PLC .................................................................. 16 HomePlug ..................................................................... 17 3.2.1.3.5 DC PLC ............................................................................... 17 3.2.1.3.6 Difficulties ............................................................................ 17 I 3.2.1.4 I2C ........................................................................................... 17 3.2.1.5 SPI ........................................................................................... 19 3.2.1.6 HVAC Control .......................................................................... 20 3.2.2 AC Mains Control ........................................................................... 21 3.2.2.1 Electromechanical Relay .......................................................... 21 3.2.2.1.1 Pros .................................................................................... 22 3.2.2.1.2 Cons ................................................................................... 22 3.2.2.2 Solid State Relay...................................................................... 22 3.2.2.3 Triac Phase Control ................................................................. 22 3.2.3 Processor ....................................................................................... 23 3.2.3.1 Processor Architecture ............................................................. 24 3.2.3.1.1 ARM Processors ................................................................. 25 3.2.3.2 Memory .................................................................................... 26 3.2.3.3 Processor Power Supply .......................................................... 29 3.2.3.4 Processor Clock ....................................................................... 29 3.2.3.4.1 Types of Clocking Circuits .................................................. 30 3.2.3.5 Embedded Linux ...................................................................... 32 3.2.3.5.1 Distribution Selection .......................................................... 32 3.2.3.6 JTAG ........................................................................................ 32 3.2.3.7 Peripherals ............................................................................... 33 3.2.3.7.1 Serial Ports ......................................................................... 33 SPI ............................................................................... 33 I2C ................................................................................ 33 RS232 .......................................................................... 34 UART ........................................................................... 34 RJ45 ............................................................................. 34 USB .............................................................................. 34 Parallel Ports ................................................................ 35 3.2.4 Sensors .......................................................................................... 35 3.2.4.1 Accelerometers ........................................................................ 35 3.2.4.2 Magnetometer .......................................................................... 36 3.2.4.3 Gyroscopes .............................................................................. 36 II 3.2.4.4 Capacitive Touch ...................................................................... 36 3.2.4.4.1 Capacitive Touch Functionality ....................................... 37 Resistor-Capacitor Method ........................................... 37 Oscillator Method .......................................................... 37 3.2.5 PCB ................................................................................................ 37 3.2.5.1 Multi-Layer................................................................................ 38 3.2.5.2 Through hole packaging ........................................................... 38 3.2.5.3 Surface mount packaging ......................................................... 39 3.2.5.4 PCB Thermal considerations .................................................... 39 3.2.6 Microcontroller ................................................................................ 40 3.2.7 Motor Control .................................................................................. 41 3.2.7.1 DC Motors ................................................................................ 41 3.2.7.2 Servo Motors ............................................................................ 41 3.2.7.3 Stepper Motors ......................................................................... 42 3.2.8 Server/Database Management System .......................................... 42 3.2.9 AI Adaptive Control Algorithms ....................................................... 44 3.2.10 Human Interface Device Control .................................................. 45 3.2.11 Graphic User Interfaces ............................................................... 46 3.2.11.1 Visual Studio ............................................................................ 46 3.2.11.2 ADT Plugin for Eclipse IDE ....................................................... 46 3.2.11.3 Qt Project ................................................................................. 46 4 Project Hardware and Software Design Details ........................................... 47 4.1 Initial Design Architecture and Related Diagrams ................................ 47 4.1.1 Main controller ................................................................................ 47 4.1.2 Smart Switch ................................................................................... 48 4.1.3 Load controller ................................................................................ 49 4.1.4 HVAC airflow controller ................................................................... 49 4.1.5 Gesture Interface ............................................................................ 49 4.1.6 Glove Hardware .............................................................................. 49 4.1.6.1 Microcontroller (ATMEGA328) ................................................. 49 4.1.6.2 Accelerometer .......................................................................... 50 4.1.6.3 Gyroscope ................................................................................ 52 III 4.1.6.4 Magnetometer .......................................................................... 54 4.1.6.5 Flex Sensors ...........................................................................