May IBM z15 Technical Introduction Bill White Octavian Lascu John Troy Jannie Houlbjerg Frank Packheiser Paul Schouten Kazuhiro Nakajima Anna Shugol Hervey Kamga Redbooks IBM Redbooks IBM z15 Technical Introduction May 2021 SG24-8850-02 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. Third Edition (May 2021) This edition applies to the IBM z15 (machine type 8561 and 8562). © Copyright International Business Machines Corporation 2020, 2021. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix Authors. ix Now you can become a published author, too! . .x Comments welcome. xi Stay connected to IBM Redbooks . xi Chapter 1. Designed to take on today’s IT demands. 1 1.1 The IBM z15: The platform for the digital economy . 2 1.1.1 Using hybrid cloud integration services. 3 1.1.2 Securing and protecting data with encryption everywhere . 5 1.1.3 Providing resilience: The key to zero downtime . 6 1.1.4 Transforming a transactional platform into a data powerhouse . 7 1.1.5 Getting more out of the platform with operational analytics . 7 1.1.6 Accelerating digital transformation with agile service delivery . 8 1.1.7 Revolutionizing business processes . 9 1.1.8 Blending open source and IBM Z technologies. 9 1.2 z15 technical description. 10 1.2.1 Technical highlights . 10 1.2.2 IBM z15 features and functions . 12 1.2.3 Storage connectivity . 15 1.2.4 Network connectivity . 16 1.2.5 Cryptography . 17 1.2.6 Clustering connectivity . 18 1.2.7 Special-purpose features and functions . 18 1.2.8 Capacity on Demand and performance . 19 1.2.9 Reliability, availability, and serviceability. 20 1.3 z15 software support. 20 1.3.1 IBM compilers . 21 Chapter 2. IBM z15 Model T01 hardware overview . 23 2.1 Models and upgrade paths . 24 2.2 Frames and cabling. 26 2.3 CPC drawers. 28 2.3.1 Single-chip modules . 29 2.3.2 Processor unit . 29 2.3.3 Memory . 32 2.3.4 Hardware system area . 34 2.4 I/O system structure . 34 2.5 Power and cooling. 37 2.5.1 Power options . 37 2.5.2 Cooling options . 38 2.5.3 Power considerations . 38 Chapter 3. IBM z15 Model T02 hardware overview . 41 3.1 Models and upgrade paths . 42 3.2 Frames and cabling. 44 © Copyright IBM Corp. 2020, 2021. iii 3.3 CPC drawers. 46 3.3.1 Single-chip modules . 47 3.3.2 Processor unit . 47 3.3.3 Memory . 50 3.3.4 Hardware system area . 52 3.4 I/O system structure . 52 3.5 Power and cooling. 55 3.5.1 Power options . 55 3.5.2 Cooling options . 55 3.5.3 Power considerations . 55 Chapter 4. Supported features and functions . 57 4.1 z15 I/O connectivity overview . 58 4.2 Storage connectivity . 59 4.2.1 zHyperLink Express . 59 4.2.2 FICON Express features. 59 4.2.3 IBM Fibre Channel Endpoint Security. 61 4.3 Network connectivity . 61 4.4 Clustering connectivity . 64 4.5 Server Time Protocol . 65 4.6 Compression options . 66 4.6.1 On-core Compression coprocessor . 66 4.6.2 On-chip IBM Integrated Accelerator for zEnterprise Data Compression. 66 4.7 Cryptographic features . 67 4.7.1 Central Processor Assist for Cryptographic Functions . 67 4.7.2 Crypto Express7S . 67 4.7.3 Crypto Express6S and Crypto Express5S (carry forward only) . 69 4.8 IBM Virtual Flash Memory. 69 4.9 Hardware Management.