www.osram-os.com Produktdatenblatt | Version 1.1 GH CS8PM1.24 GH CS8PM1.24 OSLON® SSL 80 New, higher performing OSLON SSL family LED with well known superior robustness, high reliability, long lifetime, low thermal resistance. Perfectly addressing applications demanding for high efficiency and long lifetime requirement. Applications — Architecture — Horticulture Lighting Features: — Package: SMT ceramic package with silicone lens — Typ. Radiation: 80° — ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) — Radiant Flux: typ. 463 mW — Radiant Efficiency: typ. 63 % — μ Photosynthetic Photon Flux: typ. 2.52 mol/s 1 Version 1.15 | 2021-08-01 GH CS8PM1.24 Ordering Information Type Total radiant flux 1) Ordering Code IF = 350 mA ΦE GH CS8PM1.24-4T2U-1-L 400 ... 560 mW Q65112A5230 2 Version 1.15 | 2021-08-01 GH CS8PM1.24 Maximum Ratings Parameter Symbol Values Operating Temperature Top min. -40 °C max. 125 °C Storage Temperature Tstg min. -40 °C max. 125 °C Junction Temperature Tj max. 135 °C Forward current IF min. 100 mA max. 1000 mA Surge Current IFS max. 2000 mA t ≤ 10 µs; D = 0.005 ; TJ = 25 °C 2) Reverse current IR max. 200 mA ESD withstand voltage VESD 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 3 Version 1.15 | 2021-08-01 GH CS8PM1.24 Characteristics IF = 350 mA; TJ = 25 °C Parameter Symbol Values Peak Wavelength λpeak typ. 660 nm 3) Centroid Wavelength λcentroid min. 646 nm IF = 350 mA typ. 657 nm max. 666 nm 3) Dominant Wavelength λdom typ. 640 nm IF = 350 mA Spectral Bandwidth at 50% Irel,max ∆λ typ. 25 nm Viewing angle at 50% IV 2φ typ. 80 ° 4) Forward Voltage VF min. 1.80 V IF = 350 mA typ. 2.07 V max. 2.60 V 2) Reverse voltage VR max. 1.2 V IR = 20 mA Electrical thermal resistance junction/solderpoint RthJS elec. typ. 2.4 K / W with efficiency ηe = 55 % 4 Version 1.15 | 2021-08-01 GH CS8PM1.24 Brightness Groups Group Total radiant Total radiant PPF * PPF * PPF/W * PF ** PF ** PF/W ** flux 1) flux 1) IF = 350 mA IF = 350 mA min. max. min. max. typ. min. max. typ. ΦE ΦE Φp Φp Φp,b Φp,b 4T 400 mW 450 mW 2.17 2.44 3.14 2.18 2.45 3.14 µmol/s µmol/s µmol/J µmol/s µmol/s µmol/J 1U 450 mW 500 mW 2.44 2.71 3.50 2.45 2.72 3.51 µmol/s µmol/s µmol/J µmol/s µmol/s µmol/J 2U 500 mW 560 mW 2.71 3.04 3.91 2.72 3.05 3.92 µmol/s µmol/s µmol/J µmol/s µmol/s µmol/J Note: [*] Photosynthetic Photon Flux includes wavelengths between 400 and 700 nm Note: [**] Photon Flux includes wavelengths between 280 and 800 nm Note: PPF and PF values are for reference only Centroid Wavelength Group Centroid Wavelength 3) Centroid Wavelength 3) IF = 350 mA IF = 350 mA min. max. λcentroid λcentroid 1 646 nm 666 nm 5 Version 1.15 | 2021-08-01 GH CS8PM1.24 Group Name on Label Example: 1U-1 Brightness Wavelength 1U 1 6 Version 1.15 | 2021-08-01 GH CS8PM1.24 Relative Spectral Emission 5) Irel = f (λ); IF = 350 mA; TJ = 25 °C GH CS8PM1.24 1,0 Irel :Vλ :hyper red 0,8 0,6 0,4 0,2 0,0 350 400 450 500 550 600 650 700 750 800 λ [nm] Radiation Characteristics 5) Irel = f (ϕ); TJ = 25 °C GH CS8PM1.24 ϕ [°] -10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90° -20° 1,0 Irel -30° -40° 0,8 -50° 0,6 -60° 0,4 -70° -80° 0,2 -90° 0,0 -100° 7 Version 1.15 | 2021-08-01 GH CS8PM1.24 Forward current 5) Relative Radiant Power 5), 6) IF = f(VF); TJ = 25 °C ΦE/ΦE(350 mA) = f(IF); TJ = 25 °C GH CS8PM1.24 GH CS8PM1.24 1000 Φe IF [mA] Φe(350mA) 2,5 800 2,0 600 1,5 400 1,0 200 0,5 100 0 0 0 00 0 00 0 00 1,822,02,2 2,4 ,65 1 2 4 6 80 0 1 VF [V] IF [mA] 8 Version 1.15 | 2021-08-01 GH CS8PM1.24 Forward Voltage 5) Relative Radiant Power 5) ΔVF = VF - VF(25 °C) = f(Tj); IF = 350 mA ΦE/ΦE(25 °C) = f(Tj); IF = 350 mA GH CS8PM1.24 GH CS8PM1.24 0,20 ΦE 1,2 ∆VF [V] ΦE (25°C) 0,15 1,1 0,10 1,0 0,05 0,9 0,00 0,8 -0,05 0,7 -0,10 -0,15 0,6 -40-20 020406080 100 120 -40-20 020406080 100 120 Tj [°C] Tj [°C] Centroid Wavelength 5) Δλcentr = λcentr - λcentr(25 °C) = f(Tj); IF = 350 mA GH CS8PM1.24 20 ∆λ centr [nm] 10 0 -10 -20 -40-20 020406080 100 120 Tj [°C] 9 Version 1.15 | 2021-08-01 GH CS8PM1.24 Max. Permissible Forward Current IF = f(T) 10 Version 1.15 | 2021-08-01 GH CS8PM1.24 Dimensional Drawing 7) Further Information: Approximate Weight: 29.0 mg Package marking: Anode ESD advice: The device is protected by ESD device which is connected in parallel to the Chip. 11 Version 1.15 | 2021-08-01 GH CS8PM1.24 Recommended Solder Pad 7) IRRWSULQW &XDUHD VROGHUUHVLVW VROGHUVWHQFLO For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Further informa- tion can be found in our Application Note: “Handling and Processing Details for Ceramic LEDs”. 12 Version 1.15 | 2021-08-01 GH CS8PM1.24 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250 240 ˚C Tp 245 ˚C 217 ˚C tP 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 2 3 K/s 25 °C to 150 °C Time tS tS 60 100 120 s TSmin to TSmax Ramp-up rate to peak*) 2 3 K/s TSmax to TP Liquidus temperature T 217 °C L Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak tP 10 20 30 s temperature TP - 5 K Ramp-down rate* 3 6 K/s TP to 100 °C Time 480 s 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version 1.15 | 2021-08-01 GH CS8PM1.24 Taping 7) 14 Version 1.15 | 2021-08-01 GH CS8PM1.24 Tape and Reel 8) Reel Dimensions A W Nmin W1 W2 max Pieces per PU 330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 3000 15 Version 1.15 | 2021-08-01 GH CS8PM1.24 Barcode-Product-Label (BPL) Dry Packing Process and Materials CAUTION LEVEL This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS If blank, see bar code label 1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. ˚C). If blank, see bar code label a) Mounted within at factory conditions of <_ 30 ˚C/60% RH. Floor time see below b) Stored at <_ 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or b) 2a or 2b is not met. 7) 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture-sensitive label or print Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Barcode label Desiccant Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. r Do not eat not Do . Avoid metal contact. metal Avoid Humidity indicator bag opening bag Discard if circles overrun. circles if Discard t Please check the HIC immidiately afte immidiately HIC the check Please check do check Comparator y T WE 16 s bake unit bake examine units, if necessar if units, examine y If wet, If % 15 s bake unit bake examine units, if necessar if units, examine If wet, If % 10 change desiccant change Version 1.15 | 2021-08-01 dry. adequately still parts If wet, If 5% MIL-I-8835 Humidity Indicator Humidity OSRAM Barcode label OHA00539 GH CS8PM1.24 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices.