REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT The Huawei Mate 20 Pro’s 3D Depth-Sensing System The complete system includes a 3D camera, flood illuminator, and DOT projector featuring a DOE. Following Oppo and Xiaomi, two of its supplier. The camera and DOT projector major competitors in China, Huawei has use a standard camera module assembly introduced 3D depth-sensing hardware in with wire bonding and an optical module one of its latest flagship phones, the Mate featuring lenses. In order to provide the 20 Pro. Unlike Oppo or Xiaomi, which structured light features, a WLO is have made some compromises in the integrated with the DOT projector performance of their 3D systems, structure. Huawei, with its large sensor coupled with patterned wafer-level optics (WLO), is the This report analyzes the complete 3D closest solution to Apple’s (which relies on depth-sensing system, including a full high dynamic range and DOE). Huawei’s analysis of the NIR camera module and 3D system includes a DOT projector in a the dot projector, along with a cost camera module assembly configuration. analysis and price estimate for the On the receiver side, the NIR image is system. Also included is a physical and captured by a global shutter (GS) near- technical comparison with other 3D infrared (IR) camera module. sensing systems, such as those from Apple in the iPhone X; Oppo in the Find X; and The front optical hub packaged in one Xiaomi in its Mi 8 Explorer. This metal enclosure features several cameras comparison examines system integration, Title: Huawei Mate and sensors. The complete system the NIR camera module, and the dot 20 Pro - 3D Depth features an RGB camera module, a projector architecture. Sensing System proximity sensor, and an ambient light sensor. The 3D depth-sensing system Pages: 180 consists of the NIR camera module, the COMPLETE TEARDOWN WITH flood illuminator, and the DOT projector. Date: February • Detailed photos 2019 This report constitutes a thorough analysis • Precise measurements Format: of the Mate 20 Pro’s 3D depth-sensing PDF & Excel file system. All components are standard and • Materials analysis can be found on the market. This includes • Manufacturing process flow Price: a GS image sensor featuring 3 µm-size EUR 3,990 pixels and a standard resolution of 1.5 • Supply chain evaluation megapixels, and two vertical cavity • Manufacturing cost analysis surface-emitting lasers (VCSEL): one for the DOT projector and one for the flood • Estimated sales price illuminator, each coming from a different IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY THE HUAWEI MATE 20 PRO’S 3D DEPTH-SENSING SYSTEM TABLE OF CONTENTS Overview/Introduction Manufacturing Process Flow Huawei - Company Profile • Die Fabrication Unit : NIR Image Sensor, NIR Mate 20 Pro Edition – Teardown and Market VCSEL, WLO Analysis • NIR VCSEL Process Flow Physical Analysis Cost Analysis • Physical Analysis Methodology • Cost Analysis Overview • NIR Camera Module Disassembly and Cross- Section • Supply Chain Description and Yield • Sensor Die Hypotheses o View, dimensions, pixels, pads, • NIR Image Camera Module Cost markings, die process and cross- o Front-end (FE), microlens and total section FE cost • DOT Projector & Flood Illuminator - Module o Wafer and die cost Disassembly and Cross-Section o Lens module and assembly cost • WLO • NIR VCSEL Die Cost o View, dimensions, process and cross- o FE cost section o FE cost, per process step • NIR VCSEL Dies o Wafer and die cost o View, dimensions, die process and cross-section o Lens module and assembly cost • Physical Data Summary • WLO - Die Cost Physical Comparison: Apple iPhone X, Oppo Find o FE cost X, and Xiaomi Mi 8 Explorer o Wafer and die cost • System Integration Estimated Price Analysis: NIR Camera Module, Dot • NIR Camera Module and Sensor Projector Module and Optical Hub • Dot Projector Module and VCSEL AUTHORS Dr. Stéphane Elisabeth has joined Nicolas Radufe is in charge of physical System Plus Consulting's team in 2016. analysis at System Plus Consulting. He He has a deep knowledge of Materials has a deep knowledge in chemical and characterizations and Electronics physical analyses. He previously systems. He holds an Engineering worked in microelectronics R&D for Degree in Electronics and Numerical CEA/LETI in Grenoble and for Technology, and a PhD in Materials for STMicroelectronics in Crolles. Micro-electronics. RELATED REPORTS Orbbec’sFront 3D Depth Sensing Sensing System in the Xiaomi Mi8 STMicroelectronics’ Near Infrared System in the OppoFind X Explorer Edition Camera Sensor in the Apple iPhone X The first introduction of Orbbec’s The first introduction of Mantis The 1st NIR camera sensor with 3D front depth sensing system in Vision’s technology into a mobile multiple innovations based on a mobile application featuring a application, featuring coded imager-SOI substrates from global shutter, a dot projector structured light. SOITEC, supplied and produced and a custom system-on-chip. December 2018 - EUR 3,990* by STMicroelectronics… November 2018 - EUR 3,990* December 2017 - EUR 3,490* REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT COSTING TOOLS Parametric IC MEMS Power Display PCB Costing Tools Price+ Price+ Price+ Price+ Price+ Process-Based MEMS Power LED 3D Package SYSCost+ Costing Tools CoSim+ CoSim+ CoSim+ CoSim+ Our analysis is performed with our costing tools SYSCost+, LED CoSim+ and IC Price+. System Plus Consulting offers powerful costing tools to evaluate the production cost and selling price from single chip to complex structures. IC Price+ SYSCost+ Performs the necessary cost simulation of any Provides all component costs estimation including Integrated Circuit: ASICs, microcontrollers, DSP, PCB, housing and connectors, and a simulation of memories, smartpower… the assembly cost and test process at the board and system level. LED CoSim+ Process-based costing tool to design and evaluate the cost of any LED process flow. 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