Front cover IBM zEnterprise 196 Technical Guide Describes the zEnterprise System and related features and functions Discusses hardware and software capabilities Explains virtualizing and managing the infrastructure for complex applications Bill White Erik Bakker Parwez Hamid Octavian Lascu Fernando Nogal Frank Packheiser Vicente Ranieri Jr. Karl-Erik Stenfors Esra Ufacik Chen Zhu ibm.com/redbooks International Technical Support Organization IBM zEnterprise 196 Technical Guide October 2011 SG24-7833-01 Note: Before using this information and the product it supports, read the information in “Notices” on page xiii. Second Edition (October 2011) This edition applies to the IBM zEnterprise 196 System. The changes to this edition are based on the System z hardware announcement dated July 12, 2011. © Copyright International Business Machines Corporation 2010, 2011. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . xiii Trademarks . xiv Preface . .xv The team who wrote this book . .xv Now you can become a published author, too! . xviii Comments welcome. xviii Stay connected to IBM Redbooks publications . xix Chapter 1. Introducing the IBM zEnterprise 196 . 1 1.1 zEnterprise 196 elements . 2 1.2 zEnterprise 196 highlights. 3 1.2.1 Models . 4 1.2.2 Capacity on Demand (CoD) . 5 1.3 zEnterprise 196 models . 5 1.3.1 Model upgrade paths . 6 1.3.2 Concurrent processor unit conversions. 7 1.4 System functions and features . 7 1.4.1 Overview . 7 1.4.2 Processor . 8 1.4.3 Memory subsystem and topology . 8 1.4.4 Processor cage . 9 1.4.5 I/O connectivity, PCIe, and InfiniBand . 9 1.4.6 I/O subsystems . 10 1.4.7 Cryptography . 12 1.4.8 Parallel Sysplex support . 14 1.5 IBM zEnterprise BladeCenter Extension (zBX). 15 1.5.1 Blades . 16 1.5.2 IBM Smart Analytics Optimizer solution . 16 1.5.3 IBM WebSphere DataPower Integration Appliance XI50 for zEnterprise . 17 1.6 Unified Resource Manager . 17 1.7 Hardware Management Consoles and Support Elements . 18 1.8 Reliability, availability, and serviceability. 18 1.9 Performance . 18 1.9.1 LSPR workload suite. 19 1.9.2 Fundamental components of workload capacity performance . 20 1.9.3 Relative nest intensity . 21 1.9.4 LSPR workload categories based on relative nest intensity . 22 1.9.5 Relating production workloads to LSPR workloads . 23 1.9.6 Workload performance variation . 24 1.10 Operating systems and software. 25 Chapter 2. CPC hardware components. 27 2.1 Frames and cage . 28 2.1.1 Frame A . 29 2.1.2 Frame Z . 30 2.1.3 I/O cages, I/O drawers, and PCIe I/O drawers . 30 2.1.4 Top exit I/O cabling . 31 2.2 Book concept . 31 © Copyright IBM Corp. 2010, 2011. All rights reserved. iii 2.2.1 Book interconnect topology. 33 2.2.2 Oscillator . 34 2.2.3 System control . 35 2.2.4 Book power . 36 2.3 Multi-chip module . 36 2.4 Processor units and storage control chips . 37 2.4.1 PU chip . 37 2.4.2 Processor unit (core) . 38 2.4.3 PU characterization. 40 2.4.4 Storage control (SC) chip . 41 2.4.5 Cache level structure . 42 2.5 Memory . 43 2.5.1 Memory subsystem topology . 44 2.5.2 Redundant array of independent memory (RAIM) . 44 2.5.3 Memory configurations . 45 2.5.4 Memory upgrades . 48 2.5.5 Book replacement and memory . 48 2.5.6 Flexible Memory Option . 48 2.5.7 Preplanned Memory . 49 2.6 Reliability, availability, serviceability (RAS). 50 2.7 Connectivity. 51 2.7.1 Redundant I/O interconnect . 53 2.7.2 Enhanced book availability . 54 2.7.3 Book upgrade . ..