page 1/70 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center MO200 RoHS - MODULE SPECIFICATION page 2/70 Direction des Recherches et des Développements Etablissement de VELIZY VELIZY R&D Center NOTE D'ETUDE / TECHNICAL DOCUMENT FICHE RECAPITULATIVE / SUMMARY SHEET Ed Date Référence Rédacteur(s) Relecteur(s) Pages modifiées / Changed Observations pages Date Reference Writer(s) Reviser(s) Comments 1 06/10/2006 URD1–5608.1- S. WANG M. Updated the RoHS mention, and 015 N°69301 BOUTBOUL the MO200 § 1.6 and §7 updated extended temperature range § 2 Block diagram correction § 3.8 added the spare Ios § 3.12 removed § 4.1 Added the NC pins in MO200 column § 4.2 Added the pin list on the 120 point connector § 5.2 Added the delta list between XS200 and MO200 § 6.10 addition of pulse duration at cold temperature § 11.2.3.2 corrected the inactive level of MOD_RESET*_CMD 2 3 4 5 6 7 Note d’étude / Technical document : URD1– 5608.1– 015 / 69301 Edition 01 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document. Reproduction and disclosure prohibited page 3/70 TABLE OF CONTENTS 1. OVERVIEW ...................................................................................................................6 1.1 Object of the document .....................................................................................................................6 1.2 Standards compliance.......................................................................................................................6 1.3 compliance with fcc guidelines ........................................................................................................7 1.4 Terms and abbreviation.....................................................................................................................7 1.5 Conventions........................................................................................................................................8 1.6 Product features.................................................................................................................................9 2. BLOCK DIAGRAM ......................................................................................................11 3. FUNCTIONAL DESCRIPTION....................................................................................12 3.1 SIM .....................................................................................................................................................12 3.2 Audio .................................................................................................................................................13 3.3 Network LED .....................................................................................................................................14 3.3.1 Network / Low BATTERY............................................................................................................14 3.3.2 Messages....................................................................................................................................14 3.3.3 Handfree call...............................................................................................................................14 3.3.4 Summary chart............................................................................................................................15 3.4 Data....................................................................................................................................................15 3.4.1 Data services ..............................................................................................................................15 3.4.2 UART1: V24................................................................................................................................15 3.4.3 UART 2 .......................................................................................................................................15 3.5 Antenna .............................................................................................................................................16 3.6 DAI .....................................................................................................................................................16 3.7 Clocks................................................................................................................................................16 3.8 SPARE I/OS.......................................................................................................................................16 3.9 Power management and charge .....................................................................................................16 3.9.1 Battery.........................................................................................................................................16 3.9.2 VRIO ...........................................................................................................................................17 3.9.3 Vbackup ......................................................................................................................................17 3.9.4 Charge ........................................................................................................................................17 3.9.5 AC/DC switching charger............................................................................................................17 3.9.5.1 Operating temperature ............................................................................................................17 3.9.5.2 Electrical ratings ......................................................................................................................17 3.9.5.2.1 Primary input voltage .........................................................................................................17 3.9.5.2.2 Primary/secondary insulation.............................................................................................18 3.9.5.2.3 Static output template ........................................................................................................18 3.9.5.2.4 Dynamic output template ...................................................................................................18 3.9.5.2.5 Reverse current (main off) .................................................................................................19 3.9.5.3 Thermal ratings........................................................................................................................19 3.9.6 Simple battery charger................................................................................................................19 3.10 Power management .........................................................................................................................20 Note d’étude / Technical document : URD1– 5608.1– 015 / 69301 Edition 01 Document Sagem Communication Reproduction et divulgation interdites Sagem Communication document. Reproduction and disclosure prohibited page 4/70 3.10.1 Interface identification and diagrams..........................................................................................20 3.10.2 Recommended strategy : software management.......................................................................20 3.11 Data / Command multiplexing.........................................................................................................20 4. PINOUT .......................................................................................................................22 4.1 Comparative Pinout .........................................................................................................................22 4.2 Pin list on the 120 point connector ..............................................................................................27 5. DELTA LIST................................................................................................................31 5.1 Between MO190 and MO200 ........................................................................................................31 5.2 Between XS200 and MO200 .........................................................................................................32 6. ELECTRICAL SPECIFICATION .................................................................................33 6.1 VBAT..................................................................................................................................................33 6.2 VRIO...................................................................................................................................................34 6.3 DAI interface .....................................................................................................................................34 6.4 Network LED .....................................................................................................................................34 6.5 SERIAL INTERFACE (µWIRE)..........................................................................................................34 6.6 SIM .....................................................................................................................................................34 6.7 V24 (UART 1).....................................................................................................................................35 6.8