DP83826E, DP83826I www.ti.com SNLS647D – DECEMBER 2019 –DP83826E, REVISED OCTOBER DP83826I 2020 SNLS647D – DECEMBER 2019 – REVISED OCTOBER 2020 DP83826 Deterministic, Low-Latency, Low-Power, 10/100 Mbps, Industrial Ethernet PHY 1 Features • DP83826I operating temperature range: –40°C to 85°C • Low and deterministic latency • IEEE 802.3 compliant: 10BASE-Te, 100BASE-TX – TX latency: 40 ns, RX latency: 170 ns 2 Applications – Deterministic latency over power cycles < ±2 ns – Fixed phase XI to TX_CLK relationship < ±2 ns • Factory automation, robotics and motion control • Robust and small system solution • Motor drives – Integrated circuitry for enhanced EMC • Grid infrastructure – IEC 61000-4-2 ESD: ±8 kV contact, ±15 kV air • Building automation – IEC 61000-4-4 EFT: ±4 kV @ 5 kHz, 100 kHz • Industrial Ethernet fieldbus – CISPR 22 conducted emissions Class B 3 Description – CISPR 22 radiated emissions Class B The DP83826 offers low and deterministic latency, low – Fast link-drop < 10 µs power and supports 10BASE-Te, 100BASE-TX – Cable reach > 150 meters Ethernet protocols to meet stringent requirements in – Voltage mode line driver real-time industrial Ethernet systems. The device – Integrated terminations on MAC interface includes hardware bootstraps to achieve fast link-up – Voltage tolerance: ±10% time, fast link-drop detection modes and dedicated • Two selectable pin modes in single device reference CLKOUT to clock synchronize other – ENHANCED mode for additional features modules on the systems. – BASIC mode for common Ethernet pinout The two configurable modes are BASIC standard • Low power consumption < 160 mW Ethernet mode that uses a common Ethernet pinout, • MAC interfaces: MII, RMII and ENHANCED Ethernet mode which supports • Programmable energy-saving modes standard Ethernet mode and multiple industrial Ethernet fieldbus applications with the additional – Active sleep features and hardware bootstraps configuration. – Deep power down – Energy Efficient Ethernet (EEE) IEEE 802.3az Device Family Information BODY SIZE – Wake-on-LAN (WoL) PART NUMBER (1) PACKAGE ATTRIBUTES (NOM) • Diagnostic tools: cable diagnostics, built-in self-test 5.00 mm × Lowest latency, DP83826E/I VQFN (32) (BIST), loopback modes 5.00 mm common pinout • Single, 3.3-V power supply Small size, 3.00 mm × • I/O voltages: 1.8 V or 3.3 V DP83825I WQFN (24) optimized solution 3.00 mm • RMII back-to-back repeater mode cost Wide temperature • DP83826E operating temperature range: –40°C to 5.00 mm × DP83822HF/IF/H/I VQFN (32) range, fiber, and 5.00 mm 105°C RGMII support (1) For all available packages, see the orderable addendum at the end of the data sheet. 25 MHz XTAL/Ref Clock 25/50 MHz VDDIO: 3.3 V or 1.8 V VDDA3V3: 3.3 V Media Types Ref Clock: 25/50/125 MHz 100BASE-TX 10BASE-Te Interrupt Media Dependent DP83826 RJ-45 Interface (MDI) MAC MII, RMII (master/slave) MAGNETICS SMI: MDC, MDIO Integrated MDI Terminations Integrated MAC Terminations Simplified Application An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, Copyrightintellectual © 2020 Texas property Instruments matters Incorporated and other important disclaimers. PRODUCTION DATA. Submit Document Feedback 1 DP83826E, DP83826I SNLS647D – DECEMBER 2019 – REVISED OCTOBER 2020 www.ti.com Table of Contents 1 Features............................................................................1 9.1 Overview...................................................................25 2 Applications.....................................................................1 9.2 Functional Block Diagram.........................................26 3 Description.......................................................................1 9.3 Feature Description...................................................26 4 Revision History.............................................................. 2 9.4 Programming............................................................ 46 5 Mode Comparison Tables............................................... 4 9.5 Device Registers.......................................................50 6 Pin Configuration and Functions (ENHANCED 10 Application and Implementation................................ 96 Mode)............................................................................... 5 10.1 Application Information........................................... 96 Pin Functions (ENHANCED Mode)...................................6 10.2 Typical Applications................................................ 96 7 Pin Configuration and Functions (BASIC Mode)..........8 11 Power Supply Recommendations............................100 Pin Functions (BASIC Mode)............................................9 12 Layout.........................................................................101 8 Specifications................................................................ 11 12.1 Layout Guidelines................................................. 101 8.1 Absolute Maximum Ratings ..................................... 11 12.2 Layout Example.................................................... 103 8.2 ESD Ratings .............................................................11 13 Device and Documentation Support........................104 8.3 Recommended Operating Conditions ...................... 11 13.1 Related Documentation........................................ 104 8.4 Thermal Information .................................................12 13.2 Receiving Notification of Documentation Updates104 8.5 Electrical Characteristics ..........................................13 13.3 Support Resources............................................... 104 8.6 Timing Requirements ...............................................16 13.4 Trademarks...........................................................104 8.7 Timing Diagrams.......................................................19 14 Mechanical, Packaging, and Orderable 8.8 Typical Characteristics..............................................24 Information.................................................................. 105 9 Detailed Description......................................................25 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (July 2020) to Revision D (October 2020) Page • Updated Electrical Characteristics table........................................................................................................... 11 Changes from Revision B (March 2020) to Revision C (July 2020) Page • Added link to SNLA338 application note............................................................................................................ 4 • Added link to SNLA338.....................................................................................................................................25 • Energy Efficient Ethernet section......................................................................................................................27 • EEE Overview section...................................................................................................................................... 27 • EEE Negotiation section...................................................................................................................................27 • Added EEE for Legacy MACs Not Supporting 802.3az section....................................................................... 28 • Updated device registers..................................................................................................................................49 • Added link to SNLA338 application note.......................................................................................................... 96 Changes from Revision A (February 2020) to Revision B (March 2020) Page • Added DP83826I temperature range in Electrical Section also..........................................................................1 • Added DP83826I to Device Family Information table......................................................................................... 1 Changes from Revision * (January 2020) to Revision A (February 2020) Page • Added link to DP83826EVM User's Guide .........................................................................................................1 • Deleted pin 18 from Table 5-2 ............................................................................................................................4 • Changed ENHANCED Mode pin map and pin functions table to match pin names...........................................5 • Changed BASIC Mode pin map and pin functions table to match pin names.................................................... 8 • Deleted "This pin can be configured to RX_DV in RMII mode to enable RMII Repeater Mode." from Pin Functions (BASIC Mode).................................................................................................................................... 9 • Added the 100BASE-TX Transmit Latency Timing graphic ............................................................................. 19 • Added the 100BASE-TX Receive Latency Timing graphic ..............................................................................19 • Added steps to disable CLKOUT via register configuration in Section 9.3.8 ...................................................31 2 Submit Document Feedback Copyright © 2020 Texas Instruments Incorporated DP83826E, DP83826I