EEL 4914 Senior Design I Solar Powered Audio Amplifier with DSP Effects Team # 16: Hugo Castellanos Sandra Muñoz Gretchen Rivera 1 Table of Contents 1 Technical objectives and requirements .......................................................................5 1.1 Audio Amplification Subsystem ............................................................................................5 1.2 Digital Signal Processing Subsystem ...................................................................................5 1.3 Power Management System....................................................................................................5 2 Technology Research ..........................................................................................................6 2.1 Previous Works / Similar Projects.......................................................................................6 2.1.1 Similar Projects......................................................................................................................................6 2.1.2 Commercial Amplifier Products.....................................................................................................8 2.2 Solar Panels............................................................................................................................... 11 2.2.1 Crystalline Silicon PVs ..................................................................................................................... 11 2.2.2 Thin film PVs........................................................................................................................................ 11 2.2.3 Amorphous Silicon PVs ................................................................................................................... 12 2.3 Batteries ..................................................................................................................................... 12 2.3.1 Lithium‐ion Batteries....................................................................................................................... 12 2.3.2 Sealed Lead Acid................................................................................................................................. 13 2.3.3 Nickel Cadmium ................................................................................................................................. 13 2.3.4 Nickel Metal Hydride........................................................................................................................ 14 2.4 Solar Power Management Microcontroller .................................................................... 14 2.4.2 Texas Instrument TMS320F2808............................................................................................... 15 2.4.3 Atmel AVR 8‐Bit Microcontroller................................................................................................ 16 2.5 Power System Topology........................................................................................................ 16 2.6 DSP Component Research .................................................................................................... 18 2.6.1 V1000SP Chip ...................................................................................................................................... 18 2.6.2 Arduino UNO Microcontroller...................................................................................................... 19 2.6.3 ADAU1702 Chip.................................................................................................................................. 20 2.7 Microcontroller for Display Research.............................................................................. 22 2.7.1 Microchip PIC18F87J90 microcontroller ................................................................................ 22 2.7.2 Freescale MC9S08LH64 microcontroller ................................................................................ 23 2.7.3 Arduino Pro.......................................................................................................................................... 25 2.8 LCD Component Research .................................................................................................... 25 2.8.1 Hitachi HD44780 LCD...................................................................................................................... 26 2.8.2 Nokia 3310............................................................................................................................................ 26 2.9 Audio Amplifier Technologies ............................................................................................ 27 2.9.1 Valves...................................................................................................................................................... 27 2.9.2 Solid‐State Amplifiers ...................................................................................................................... 29 2.9.3 Switching Amplifiers ........................................................................................................................ 35 2.9.4 Noise........................................................................................................................................................ 38 2.9.5 Thermal Noise ..................................................................................................................................... 38 2.10 Audio Interfaces .................................................................................................................... 39 2.10.1 Audio Connectors and Cables .................................................................................................... 39 2.10.2 Impedance Matching and Bridging.......................................................................................... 41 2 2.2.3 Pre‐Amplification............................................................................................................................... 42 2.11 Audio Equalizing ................................................................................................................... 43 2.11.1 Background........................................................................................................................................ 43 2.11.2 Audio Filters...................................................................................................................................... 44 3. Design...................................................................................................................................46 3.1 Component selection.............................................................................................................. 46 3.1.1 Power Supply....................................................................................................................................... 46 3.1.2 Battery .................................................................................................................................................... 51 3.1.3 Microcontroller................................................................................................................................... 53 3.1.4 Display Screen..................................................................................................................................... 54 3.1.5 DSP Component.................................................................................................................................. 57 3.1.6 EEPROM Component........................................................................................................................ 60 3.1.7 Push Buttons........................................................................................................................................ 62 3.2 Design Implementation......................................................................................................... 63 3.2.1 Battery Charger Circuit ................................................................................................................... 63 3.2.2 LCD Block Diagram ........................................................................................................................... 69 3.2.3 DSP Block Diagram/Schematic.................................................................................................... 70 3.2.4 Push Buttons Block Diagram ........................................................................................................ 71 3.2.5 Equalizer Circuit................................................................................................................................. 73 3.2.6 Audio Amplifier .................................................................................................................................. 82 3.3 Methods ...................................................................................................................................... 83 3.3.1 Coding ..................................................................................................................................................... 83 3.4 Overall Design .......................................................................................................................... 86 4. Prototyping.........................................................................................................................90 4.1 Personnel Distribution.........................................................................................................