Vol. 26, No. 10 October 2016 Developments in Advanced Packaging Lead to a New Generation of Suppliers As the Internet of Things (IoT) by creating miniature SiP modules OSAT Worldwide Market Share (%), 2015 becomes increasingly common, there is under one operation instead of three an emerging trend in favor of “module separate ones, as is currently done? manufacturing,” which includes IC While the higher gross margins are packaging and compound clearly the leading attraction, also semiconductor assembly. The recent important is the need for miniaturization success of system-in-package (SiP) and and lower cost, all of which is made multichip module (MCM) solutions is possible by this new and so-called leading top-tier EMS and ODM “integrated” manufacturing model. companies to explore alliances with IC There is evidence that IC packaging packaging and optoelectronics firms. and PCB assembly manufacturing The logic behind this is clear: IC equipment are already converging, packaging firms have operating partly due to alliances between margins more than double those of equipment suppliers such as ASMP and Source: NVR EMS firms—averaging around 18% to Siemens, K&S and Assembléon, as 20%—whereas EMS firms have gross well as others, who see this as an Then there is ASUSTeK and AzureWave—a margins of only 2% to 10%. Foundry opportunity to streamline the supply wireless module provider under ASUS Group chip companies that are farther up the chain and concurrently capture higher that produces wireless communication and supply chain maintain gross margins of margins. digital image processing–related module 40% to 50%, and may offer attractive Perhaps the best example is Foxconn’s products. Main customers include ASUSTeK, opportunities for outsourced acquisition of ShunSin, a SiP module Pegatron, Google, and Xiaomi. AzureWave semiconductor assembly and test manufacturer of RF power amplifiers, became the supplier of the 3x3 MIMO Wi-Fi (OSAT) and EMS providers to LNA and MEMS products, and other module card for Apple’s iMac and Mac Pro in improve earnings. How far up the optical transceivers and solar 2015. Additionally, the market expects it to supply chain these companies will go photovoltaic concentrator modules. In supply Wi-Fi SiP modules for iPhones and remains to be seen, but MMI has 2014, SiP accounted for 85–90% of its iPads sometime in 2016. observed that there is currently quite a revenue; Apple is its main end Jabil is active in the SiP module business, as bit of activity going on in this space. customer. Other customers include evidenced by its acquisition of AOC EMS companies like Foxconn, Avago, Qorvo (formerly TriQuint), Technologies in optical networking modules, Pegatron, Flex, Jabil, and Wistron all Skyworks, and RFMD. and other internal investments in RF modules have active programs in SiP, but many more ODMs—such as ASUSTek, Byde, Compal, Delta, Inventec, Some articles in this issue Qisda, TPV, and others—have jumped Cover Story…………………………………………………………………………………….1 on the SiP train, where OSATs have Developments in Advanced Packaging Lead to a New Generation of Suppliers traditionally been the dominant Some Quarterly Results…………………………………………………………………………….3 players. The question that these Company News…………………………………………………………………………………………4 companies are asking is, can these new Apple Sets Up First R&D Center in China…………….………………..….……………….6 hybrid or mixed-model companies Foxconn’s Sharp to Spend $570 Million on OLED Panel Production……………7 contribute to faster time to market and lower costs and in semiconductor photonics. In an designs and manufactures SiP modules Likewise, Foxconn has been developing interview, Vice President of Strategic for handheld devices, PCI-E modules additional upstream semiconductor Capabilities/Engineering & Technology for PCNB, mini-PCI modules for capabilities with its acquisition of and Services Dan Gamota remarked that “it embedded applications, and USB investments in Fitipower (IC design (EMS and IC packaging) is an area that dongles (the company also offers highly house for PMIC and LCD driver ICs), we are actively observing and have integrated solutions with Wi-Fi, Fiti (semiconductor and TFT-LCD been watching for quite a while. Bluetooth, GPS, and DVB-H functions equipment), and Socle Technology Miniaturization is creating opportunities in a single module). There is also (system-on-chip [SoC] design and in different domains such as Compal and Arcadyan, which provides implementation services). Also, just this communications and networking, optics broadband access, multimedia and month, the company has expanded its and cameras, automotive, consumer wireless technology, and wireless semiconductor focus in partnership with lifestyle products, wearables, equipment and devices to telecom ARM Holdings to serve Apple and aerospace, and healthcare, which are all operators and consumer electronics Foxconn’s subsidiary Ennoconn benefiting from miniaturization and vendors and retailers (major products becoming the major shareholder in module integration. In some cases, we include broadband [AD, IP-STB, and S&T AG, which is taking a 30% stake develop the capabilities in-house and in LTE, 60–65% of sales] and AP/gateway in German Kontron AG. Before other situations we are better served and Wi-Fi modules). Finally, there is adopting SiP, the key EMS process was through M/A activities.” In 2015, Jabil Wistron and Wistron NeWeb (WNC), to mount components on PCBs through also expanded its diversified integration which designs and manufactures surface-mount technology. With these capabilities by acquiring Clothing Plus, wireless connectivity products (major strategic alliances, the benefit for a Finland-based textile electronics product lines include smart home, Foxconn clearly is the potential synergy pioneer, and Kasalis, a leading active automotive, and mobile with SiP development, including that alignment provider for camera and communication). for the Apple Watch. gesture-recognition modules. So who will assemble these SiPs? Foxconn claims that the TAM for the More than any other company, Currently, the leading suppliers are the SiP/module business reached about Foxconn seems to be taking the lead in OSAT companies, of which ASE is the $25B in 2015 (10.5B units), five times this mixed business model in its recent market leader (see chart showing OSAT bigger than ASE’s SiP/EMS revenue bid to acquire Siliconware Precision market share, page 1). These contract forecast, which equaled 18% of Industries (SPIL), which has also been manufacturers are familiar with design Foxconn’s 2015 revenue. This market is pursued for the last year by Advanced tools for modules/packages, including expected to grow to $40B in 2018 (15B Semiconductor Engineering (ASE). electrical and thermal modeling and units), signifying a 17% CAGR. SPIL ASE Group owns Universal Scientific antenna design, and have a history of and Foxconn could well become the Instrumentation (USI), a global EMS obtaining die from many sources. number-one player in terms of market company with 2015 revenue of nearly Moreover, they have capabilities in share. $3 billion and a leading technology fine-pitch wire bond or flip chip die Five specific SiP areas appear to be of manufacturer of wireless modules for bonding, and in providing required EMI interest: 1) fingerprint (FP) modules, mobile devices. USI has claimed that it shielding and package test capability. 2) camera modules, 3) RF PA modules, had 10–15% global market share in a On the other hand, EMS suppliers have 4) MEMS modules, and 5) LNA/ASM Wi-Fi SiP module (Wi-Fi + Bluetooth + good ability to purchase and manage modules for antenna switches. Other FM) in 2012, and 50% allocation from materials through the supply chain, can growing application areas include IoT Apple (Lenovo is another key provide components from multiple and wearables. customer). If Foxconn is successful in sources, and have high-throughput The OSAT + EMS strategy is a good its bid over ASE to acquire SPIL, it will SMT machines capable of die and one used by ASE to mitigate rising be positioned to be one of the leading passive device placement. There is no competition within the pure OSAT suppliers of both EMS and IC module reason why, in the module process industry, especially in China, where packaging services. Foxconn clearly capability, EMS companies could not JCET last year acquired STATS wants control and domination of the do embedded die and SiP assemblies. ChipPAC. The potential team-up revenue real estate that comes from IC Vertical integration has been a between SPIL and Foxconn would packaging services. consistent industry trend over the last jeopardize this strategy by creating an But what other players are involved in decade. As mentioned, there is a major OSAT + EMS powerhouse that would this space? There are many, and at this battle raging between ASE and compete head-on against ASE, which moment it is a bit of a free-for-all in Foxconn over the assets of SPIL, not could bode ill for this OSAT leader and regard to M/A activities. For example, just to cannibalize existing customer other pure OSAT players in the long there is Pegatron and Kinsus, a major relationships, but also to prepare the run. substrate supplier with high exposure to industry for a solid volume ramp-up. Foxconn’s strategy would enhance its communication IC (FC-CSP, WB-CSP, SPIL has been evaluating various competitive edge in the EMS space and SiP) markets, with major customers that vertical cooperation opportunities since benefit from the rising trends of include Qualcomm, Broadcom, 2010 and ASE has been exploring miniaturization and modules in the Altera, Xilinx, and MediaTek. There growth potential, focusing on its EMS mobile devices industry by leveraging is Quanta and QMI, a company that and testing and packaging capability. SPIL’s capabilities in advanced Manufacturing Market Insider, October 2016 2 packaging. Meanwhile, ShunSin Foxconn’s share of iPhone assembly Technology, which specializes in SiP orders is gradually eroding from 70%+ The OEMs, IDMs, OSATs, and EMS/ODM products and in which Foxconn holds a to 60–65%, and may stabilize in the players are already lining up.