Trends in RF/Wireless Packaging An Overview, 2004 Don Brown, Director Rene Douville, Technical Director International Wireless Packaging Consortium ™ TEL: 215-293-9000 [email protected] http://www.iwpc.org Outline • Thank You for your slides • About IWPC • Conclusions • Wireless Industry Overview • Portable and Mobile Wireless • Infrastructure & Broadband Equipment •MMwave • Automotive • Antennas • Shielding • Materials • Environmental Issues (RoHS) • Other Advanced Packaging Technology Options • Collaboration Thank You for your Slides • Agere • Merrimax •AMKOR • Microsoft • Arlon • Motorola • ASCOM • Motorola •BWA • Nortel • Cambridge Silicon Radio (CSR) • Ogier Electronics • Celestica • Park Nelco • Chip Pak • Perlos • Continental Temec • Philips Semiconductors •CTIA • Polyphaser • Daimler Chrysler • Raytheon • Dr. Robert Heile •RFM • Emerson & Cuming • Road Eye • Endwave • Rogers •IBM • Rosenberger • Imbera • Samsung • Infineon • Saratel •Intel • Skyworks • Kyocera • Texas Instruments • Laird Technologies • WL Gore •M/A-COM • Xytrans About IWPC IWPC Mission Founded 1998 The International Wireless Packaging Consortium, IWPC, is a pro-active organization of 115+ WIRELESS and RF PRODUCT OEM’s and their SUPPLIERS. Our mission is to facilitate communication up and down the entire wireless industry supply chain, to: – Identify/Clarify New/Existing Markets and Product/Service Opportunities – Reduce Costs – Improve performance and – Decrease time to market ... with an emphasis on packaging and interconnect technologies. Our Definition of Packaging • From sand to systems IWPC Members (as of May 2004) 3M Flextronics PCH International Aeroflex Fujitsu Quantum Devices Perlos Corp. Agere Harris Corp. Philips Agilent HEI Inc. PMC-Sierra Alcatel Hitachi Chemical Polyphaser Amkor Hittite Microwave Powerwave Tech. ANADIGICS Huber + Suhner Radio Frequency Systems Analog Devices Hughes Raytheon Andrew Corp. Hypres Renaissance Electronics Arlon Inc. IBM Research In Motion (RIM) BridgeWave Comm. Infineon Technologies AG RF Monolithics Brush Engineered Materials Intel RJR Polymers Cambridge Silicon Radio Interconnect Devices Rogers Corp. Celestica Inc. Jabil Circuit Rosenberger ChipPac Johanson Technology Sarantel Ltd. CommScope Kaneka High-Tech Siemens Conexant Kathrein Inc. SiGe Semiconductor CoorsTek Kyocera America Inc. Skyworks CSIRO L3Comm., Narda Sonion Kirk A/S Dielectric Laboratories Laird Technologies Sony Ericsson Dow Corning Lucent Technologies Symmorphix DragonWave Mark IV Taconic DuPont Merix Corp. Terabeam E2V Technology Merrimac Industries Tessera EADS Deutschland GmbH Microwave Photonics Texas Instruments Elcoteq Milmega Ltd. Thales Microelectronics EMS Millisys TLC Precision Wafer Processing Emerson & Cuming Mimix Broadband TRAK Communications Emerson & Cuming Microwave Motorola TriQuint Semiconductor Endwave Nera Networks Tyco, M/A-COM Division EPCOS Nortel Networks Tyco Germany Fairchild RF Northrop Grumman United Monolithic Semiconductors Farran Technology Paratek Microwave WL Gore Filtronic Park Electrochemical Xilinx Flarion Technologies Xytrans IWPC Thrusts •Mobile and Portable Products ! Cellular, Wireless PDAs, PCS, GPS, short range radios, (Bluetooth, WPANs, WLANs, automotive telematics, etc) •Cellular Infrastructure Products ! Base Stations, WLAN Distribution Networks, Smart Antennas, Repeaters, In-building coverage extension, etc. •Broadband and Millimeterwave Products ! MMDS, LMDS, MVDS, PTP, PMP, MMWave Unlicensed, Satellite, Stratospheric ! Last Mile Access Solutions (wireless and optoelectronic) ! Automotive ACC, side radar, sensors •Cross-thrust workshops (technologies, financial or markets) ! Wall Street Sessions ! Outsourcing Trends ! Environmental Issues ! other •Technology Exchange Forums and Telecons (within each thrust) IWPC Workshops 2004 (planned) • Millimeterwave Automotive and • Implementing Environmental Communication Markets and Compliance in the Wireless Industry Technologies Supply Chain Hosted by: Daimler Chrysler, Hosted by: Celestica, Lucent Siemens, Alcatel August 10-13, 2004, Toronto, Canada October 18-21, 2004, Germany • 802.16x vs 802.20x vs 3G vs 4G • High Efficiency, High Linearity Power Hosted by: France Telecom Amplifiers for 3G+ Basestations Dec. 2004, San Francisco, CA Hosted by: Filtronic, Powerwave, Andrew Sept 20-21, 2004, U.K. • Other topics to be announced (Suggestions welcomed) • Lowering Basestation Equipment OPEX Hosted by: T-Mobile Sept 21-24, 2004, U.K. IWPC Workshops Held - 2004 • Emerging 60 and 70-90 GHz • A Day with Ford Motor Company “GigaBit Wireless” Hosted by: Ford Motor Company Communications April 2004 January 18-21, 2004 San Jose, CA • Future SmartPhone Power Hosts: Cisco Systems, IBM, Management Infineon, Endwave, Velocium Hosted by: Microsoft May 10-13, 2004 • Short Range Radio Equipment, Technologies & Markets • Wall Street Meets the Wireless Co-Hosted by: EPCOS, Fairchild RF Industry Supply Chain (*), Infineon, Intel (*), Philips Hosted by: CIBC World Markets Semiconductor (*), RF Monolithics, Skyworks (*), Texas Instruments May 19-20 2004 April 2004 NEW IWPC WEB Based Discussion Centers IWPC Discussion Center links Available • The IWPC has formed a number of new WEB based discussion centers. • Please forward this list to your colleagues and invite any of them to opt-into any group(s) by simply sending an email to the link(s) provided. – General IWPC Member Discussion Center [email protected] – Environmental issues of electronics design, manufacturing, process and recycling [email protected] – Power Amplifier Packaging [email protected] – Software Defined Radio (SDR) and the issues related to RF Front End development [email protected] – IWPC China Wireless Industry Research – issues, comments, questions [email protected] – IWPC Broadband Roadmap Development [email protected] – IWPC_Environmental_DiscussionGP [email protected] IWPC Workshops Held - 2003 • Wall Street Meets Wireless Industry • Outsourcing Trends in Wireless Supply Chain Industry January 14 June 17-20 San Francisco, CA Toronto Canada Host: Merrill Lynch Host: Celestica • Emerging In-Building • Last Mile Broadband Access & Short Range Wireless Equipment September 30/October 1-2 January 15,16 United Kingdom San Francisco, CA Host: British Telecom Hosts: EMS and Intersil • Upgradeable BaseStations and • Basestation Coverage 2G/3G Transition Enhancement Equipment November 4-7 March 4-7 United Kingdom Kansas City, Missouri Host: O2 Host: Sprint PCS • A Day with Elcoteq • Mmwave Markets, Applications and 2D --> 3D --> SiP Migration & Technologies from 20-100 GHz : An Electro-Mechanical Integration November 9-10, 2003 Overview Espoo, Finland May 5-8 -- Stuttgart, Germany Host: Elcoteq Hosts: DaimlerChrysler, Endwave, Stratex, IBM, UMS, Velocium, Raytheon • Next Generation “Ecological” Handset Design & Manufacturing December 9-12 Plantation, Florida Hosted by: Motorola and Amkor and Nextel IWPC Workshops Held -- 2002 • Unlicensed Band Short Range • Last-Mile Broadband Solutions Radios, WLAN, Bluetooth Trends, Tradeoffs and Requirements of January 29-31 Consumer Priced Wireless, Optoelectronic, Austin, TX Copper Equipment July 22-25 Hosts: Wayport, Philips, Intersil Montreal, Canada • Ka-Band Satcom Terminals Hosts: Bell Canada, Telcordia & Lucent February 26-28 Technologies Rome, Italy Host: Alenia Spazio • Handset Packaging • Frequency Agile, Adaptive Workshop III Towards 40% Integration at NO Additional Base Stations Cost April 9-12 Sept 10-13 Stuttgart, Germany Aalborg, Denmark Host: Alcatel Host: Flextronics • Millimeterwave Backhaul • Automotive Telematics and 60 GHz Unlicensed Band Radios & Wall Street Session Plus – Dec 3-6 Dearborn, MI WALL STREET SESSION Host: Ford Motor Company and Solectron June 17-20 San Jose, CA Host: Harris Corp. Workshops Held, 2000/01 • 2001 – GigaBits to the Desktop, Convergence of MMWave Radio and OptoElectronics at 10's of GB/S (hosts Endwave and Lucent) – Wireless Internet -- Impact on Next Generation Handheld Packaging (Host France Telecom) – Millimeterwave Supply Chain Summit II (Host Winstar) – Future Bluetooth and Bluetooth-Like Applications & Packaging (Host Philips) – High Capacity Power Efficient 2.5G/3G Basestations & Systems (Host Nortel Networks) – Multi-GigaBit OptoElectronics -- Breakthrough Packaging and Assembly (Host JDS Uniphase) – Next Generation Handset Integrated Packaging Roundtable (Host Sony/Ericsson) • 2000 – Millimeterwave Design and Manufacturing Supply Chain Initiative (Host Raytheon) – Next Generation Handset Packaging (Host Sprint PCS) – Future… Bluetooth, Home RF, WLAN, Automotive Wireless Packaging (Intel and ITSA) – EPDeS 4 Working Groups Workshop – Broadband MMWave Service Providers & Supply Chain Summit ( Hosts WCA, Morgan Keegan) – Reliable Tower Top Electronics Packaging and Smart Antennas (Host Ericsson) – Future Broadband User Terminal Packaging (Host Alcatel) – Automotive Wireless Packaging (Host Ford) Workshops Held, 1998/99 • 1999 – Electronic Product Design System 1 (EPDeS) (hosted by Nokia Corp.) – Consumer Priced Millimeter Wave/Microwave Antenna Subsystem for Ground Based LEO Satellite Systems (hosted by Motorola/Teledesic – EPDeS 2 (hosted by Qualcomm Corp.) – Fanless Basestations (Co-hosted by Nortel Networks and Harris) – Breakthrough Packaging for LMDS (hosted by Raytheon Systems) – First EPDeS DEMO (hosted by Lucent) •