Emerging Trend in Electronics Engg. ( KEC101T/202T ) UNIT 1 Semiconductor Diode: Depletion layer, V-I characteristics, ideal and practical Diodes, Diode Equivalent Circuits, Zener Diodes breakdown mechanism (Zener and avalanche) Diode Application: Diode Configuration, Half and Full Wave rectification, Clippers, Clampers, Zener diode as shunt regulator, Voltage-Multiplier Circuits Special Purpose two terminal Devices: Light-Emitting Diodes, Photo Diodes, Varactor Diodes, Tunnel Diodes, Liquid-Crystal Displays. UNIT 2 Bipolar Junction Transistor: Transistor Construction, Operation, Amplification action. Common Base, Common Emitter, Common Collector Configuration Field Effect Transistor: Construction and Characteristic of JFETs. Transfer Characteristic. MOSFET (MOS) (Depletion and Enhancement) Type, Transfer Characteristic. UNIT 3 Operational Amplifiers: Introduction, Op-Amp Basic, Practical Op-Amp Circuits (Inverting Amplifier, Non-inverting Amplifier, Unit Follower, Summing Amplifier, Integrator, Differentiator).Differential and Common-Mode Operation, Comparators. Introduction of IoT System, Components of IoT system: Microprocessor and Microcontroller, Bluetooth Technology, Wi-Fi Technology, Concept of Networking, Sensor Nodes, concept of cloud. UNIT 4 Digital Electronics: Number system & representation. Introduction of Basic and Universal Gates, using Boolean algebra simplification of Boolean function. K Map Minimization upto 6 Variable. Introduction To IC Technology: SSI, MSI, LSI, VLSI Integrated Circuits. UNIT 5 Fundamentals of Communication Engineering: Basics of signal representation and analysis, Electromagnetic spectrum Elements of a Communication System, Need of modulation and typical applications, Fundamentals of amplitude modulation and demodulation techniques. Introduction to Data Communications: Goals and applications of Networks. General Model of Wireless Communication: Evolution of mobile radio communication fundamentals, GPRS, GSM, CDMA. Elements of Satellite & Radar Communication, Text Books: 1. Robert L. Boylestand / Louis Nashelsky “Electronic Devices and Circuit Theory”, Pearson Education. Program Outcomes PO1 Engineering knowledge: Apply the knowledge of mathematics, science, engineering fundamentals, and an engineering specialization to the solution of complex engineering problems. PO2 Problem analysis: Identify, formulate, review research literature, and analyze complex engineering problems reaching substantiated conclusions using first principles of mathematics, natural sciences, and engineering sciences. PO3 Design/development of solutions: Design solutions for complex engineering problems and design system components or processes that meet the specified needs with appropriate consideration for the public health and safety, and the cultural, societal, and environmental considerations. PO4 Conduct investigations of complex problems: Use research-based knowledge and research methods including design of experiments, analysis and interpretation of data, and synthesis of the information to provide valid conclusions. PO5 Modern tool usage: Create, select, and apply appropriate techniques, resources, and modern engineering and IT tools including prediction and modeling to complex engineering activities with an understanding of the limitations. PO6 The engineer and society: Apply reasoning informed by the contextual knowledge to assess societal, health, safety, legal and cultural issues and the consequent responsibilities relevant to the professional engineering practice. PO7 Environment and sustainability: Understand the impact of the professional engineering solutions in societal and environmental contexts, and demonstrate the knowledge of, and need for sustainable development. PO8 Ethics: Apply ethical principles and commit to professional ethics and responsibilities and norms of the engineering practice. PO9 Individual and team work: Function effectively as an individual, and as a member or leader in diverse teams, and in multidisciplinary settings. PO10 Communication: Communicate effectively on complex engineering activities with the engineering community and with society at large, such as, being able to comprehend and write effective reports and design documentation, make effective presentations, and give and receive clear instructions. PO11 Project management and finance: Demonstrate knowledge and understanding of the engineering and ma and leader in a team,nagement to manage principles projects and inapply multidisc these iplinaryto one’s environments.own work, as a member PO12 Life-long learning: Recognize the need for, and have the preparation and ability to engage in independent and life-long learning in the broadest context of technological change. Course Learning Outcomes and relationship with Program Outcomes: Course Statement (On completion of this course, the student will be able to) Outcome CO1 Understand the concept of PN Junction diode. CO2 Understand and analyze the concept of BJT, FET and MOSFET. CO3 Understand and analyze concept of Operational amplifier & IoT system Analysis and verification of Truth Table of Various Logic Gate and its CO4 applications. CO5 Analyze the fundamental of various communication System Mapping of CO with PO Course Program Outcomes outcome 1 2 3 4 5 6 7 8 9 10 11 12 CO1 3 3 2 - - - - - - - - 3 CO2 3 3 2 - - - - - - - - 3 CO3 3 3 2 - - - - - - - - 3 CO4 3 3 3 - - - - - - - - 3 CO5 3 2 1 - - - - - - - - 3 Average 3 2.8 2 - - - - - - - - 3 UNIT 1 Semiconductors Materials that permit flow of electrons are called conductors (e.g., gold, silver, copper, etc.). Materials that block flow of electrons are called insulators (e.g., rubber, glass, Teflon, mica, etc.). Materials whose conductivity falls between those of conductors and insulators are called semiconductors. Semiconductors are “part-time” conductors whose conductivity can be controlled. There are two types of semiconductors (i) Elemental Semiconductors and (ii) Compound semiconductors. Elemental semiconductors are usually Group IV elements of Periodic Table. Silicon and Germanium are two very popular elemental semiconductors. Their atomic numbers are 14 and 32 respectively. They are tetravalent elements i.e having 4 valence electrons. Atoms in a pure silicon wafer contains four electrons in outer orbit (called valence electrons). – Germanium is another semiconductor material with four valence electrons. In the crystalline lattice structure of Si, the valence electrons of every Si atom are locked up in covalent bonds with the valence electrons of four neighbouring Si atoms. In pure form, Si wafer does not contain any free charge carriers. An applied voltage across pure Si wafer does not yield electron flow through the wafer. A pure Si wafer is said to act as an insulator. Silicon is the most common material used to build semiconductor devices. Si is the main ingredient of sand and it is estimated that a cubic mile of seawater contains 15,000 tons of Si. N-Type Semiconductor Pentavalent impurities such as phosphorus, arsenic, antimony, and bismuth have 5 valence electrons. When phosphorus impurity is added to Si, every phosphorus atom’s four valence electrons are locked up in covalent bond with valence electrons of four neighbouring Si atoms. However, the 5th valence electron of phosphorus atom does not find a binding electron and thus remains free to float. When a voltage is applied across the silicon-phosphorus mixture, free electrons migrate toward the positive voltage end. When phosphorus is added to Si to yield the above effect, we say that Si is doped with phosphorus. The resulting mixture is called N-type silicon (N: negative charge carrier silicon). The pentavalent impurities are referred to as donor impurities. In an n-type material, the electron is called the majority carrier and the hole the minority carrier. P-Type Semiconductor Trivalent impurities e.g., boron, aluminium, indium, and gallium have 3 valence electrons. When boron is added to Si, every boron atom’s three valence electrons are locked up in covalent bond with valence electrons of three neighbouring Si atoms. However, a vacant spot “hole” is created within the covalent bond between one boron atom and a neighbouring Si atom. The holes are considered to be positive charge carriers. When a voltage is applied across the silicon-boron mixture, a hole moves toward the negative voltage end while a neighbouring electron fills in its place. When boron is added to Si to yield the above effect, we say that Si is doped with boron. The resulting mixture is called P-type silicon (P: positive charge carrier silicon). The trivalent impurities are referred to as acceptor impurities. The hole of boron atom points towards the negative terminal. The electron of neighbouring silicon atom points toward positive terminal. The electron from neighbouring silicon atom falls into the boron atom filling the hole in boron atom and creating a “new” hole in the silicon atom. It appears as though a hole moves toward the negative terminal. In a p-type material the hole is the majority carrier and the electron is the minority carrier. PN Junction Diode Now that both n - and p -type materials are available, we can construct our first solid-state electronic device: The PN Junction diode. No Applied Bias ( VD = 0 V) At the instant the two materials are “joined” the electrons and the holes in the region of the junction will combine, resulting in a lack of free carriers in the region near the junction. This region of uncovered positive and