www.newelectronics.co.uk 1328 April June 2021 2016 ROVERSCOMMUNICATIONSSPACE EXCEED ELECTRONICS EXPECTATIONS TEST • SAFETY• • SYSTEMSREDEFINING & SECURITY DESIGN HARDWARE •• LIGHTING ENCLOSURESIN REAL TIME • • BOARDCATCHING • EMC TECHNOLOGY SHIELDINGUP WITH CLOCKS THE REAL DEAL? Are augmented and virtual reality fi nally set to become the next big computing platforms? THE PERFECT STORM Shortages of components have raised questions as to how the supply chain operates New Electronics’ weekly eZine features the latest blogs, news, articles and more. To register for your copy, go to www.newelectronics.co.uk CONTENTS VOL 54 NO 6 16 18 10 22 25 COVER IMAGE: Corona Borealis/stock.adobe.com COMMENT 5 COVER STORY 10 LIGHTING 20 A shortage of The perfect storm Throwing a light on Bluetooth semiconductors is seeing Shortages of semiconductors, along with other According to the Bluetooth SIG connected a number of governments components, have raised questions as to how lighting solutions are growing rapidly. consider building cutting the supply chain operates. By Neil Tyler Neil Tyler finds out more edge fabs INTERVIEW 14 SYSTEMS DESIGN 22 NEWS Building resilience Simplifying IoT applications Cadence unveils next- James Woodhead talks to New Electronics Chipset specific IPDs are intended to simplify generation Palladium Z2 about the need to build greater business the development of next gen wireless IoT and Protium X2 systems 6 resilience through supply chain rationalisation applications, as New Electronics discovers Siemens looks to accelerate ENGINEERING ‘GREEN’ 16 COMMUNICATIONS TEST 25 design-to-manufacturing Heading full throttle to Increasing data throughput handoff for printed circuit net zero carbon With the upcoming 802.11be WLAN standard boards 7 Every component counts in the UK Rail nearly complete, Werner Dürport and Systems’ programme to deliver net zero Lisa Ward look at how it will impact test Arm introduces the Armv9 carbon, as Leigh Chapman explains & measurement requirements architecture to improve security and deliver AI 8 BOARD DESIGN 18 Easy as PI MISSION STATEMENT How is the Sony Corporation’s electronics ‘New Electronics keeps designers and manufacturing arm, UK Tec, using the managers abreast of the latest developments Raspberry Pi to unlock Industry 4.0? in the world’s fastest moving industry’ By Ankur Tomar www.newelectronics.co.uk 13 April 2021 3 NEW FHD 13.3” Display with eDP interface The TM133VDGP01 is the latest display to come out of Tianma. This 13.3” a-Si TFT has FHD of 1920 x 1080 ArmARM Based Embedded Modules and an eDP interface. With high brightness built-in and ArmEmbedded Based Modules a colour range of 16.7M this display is ideal for factory EmbeddedThe building blocks for Modules Industrial, medical, automation, kiosks, military and ProductI o T, smart families home, smart with city expandableand automotive boards. ProductLinuxapplications.They or familiesWindows accelerate with operating expandablethe development systems boards. transportation. It also has the advantage Linuxcycle and or substantially Windows reduce operating developments systems costs. LongLong term term availability availability until at leastwith 2029. excellent of a long production life cycle with an LongsupportProduct term families for availability both with expandable hardware with boards. andexcellent software upgrade path to brighter units. supportLinux or Windows for both operating hardware systems. and software ProductExcellent support families: for both hardware and software. Product• armStone: families: PicoITX SBC •Product armStone:Cortex families A5/A9 PicoITX , LVDS SBC TFT , WLAN/BT RDS is ISO 13485 Qualified to design and •• CortexEfus: armStone: System A5/A9 PicoITX ,on LVDS Module SB TFTC , WLAN/BT manufacture complete systems. • Efus:SmallCortex System form A5/A9, factor on WLAN/BT, Module – 47 x 62mm LVDS TFT,DVI SmallCortex form A9 , factorcamera, – 47 PCIe x 62mm , SATA, WLAN/BT Innovative Design and • efus: System on Module • CortexPicoCOMSmall A9form :, -camera, factorsmall –size 47PCIe xSOM 62mm , SATA, WLAN/BT Manufacture of IoT • PicoCOMCortexA/A5/M4Cortex A9 : -, camera,small size PCIe SOM , SATA , WLAN/BT Platforms and CortexA/A5/M4Single robust connector Devices. • PicoCOM – small size SOM • SinglePicoCoreCortex robust A5/A7/A9 – 35 connector x 40mm SOM • PicoCoreCortexSingle A7, robust – A5335 connectorx , 40mmMW SOM CortexWLAN/BTCAN, A7,USB, MIPI-DSIA53 Ethernet, , MW Serial •• WLAN/BTStarter PicoCore- kits MIPI-DSI for35 xall 40mm modules SOM for speedy development.. • StarterCortex kits A7/A9/M4.A53 for all modules for speedy development.. www.mansky.co.ukWLAN/BT , RGB , LVDS, MIPI www.mansky.co.ukTwo plug connector 80/100pin www.review-displays.co.uk +44 (0)1959 563 345 e: [email protected] PXI Signal Switching, Simulation & Software Design, Deploy & Sustain your automated test system more effectively... ...by taking advantage of Pickering’s deep portfolio of 1,000+ PXI, PCI, LXI and USB products, services and expertise. Reduce your PXI test system switching cost 30-40% and design what you need. pickeringtest.com/pxisavings Diagnostic Test Tools Application Software 1,000+ Switching & Simulation Modules Available & Expert-level Support & Software Drivers pickeringtest.com 01255 687900 | [email protected] COMMENT SUPPLY CHAIN A supply chain in fl ux A SHORTAGE OF SEMICONDUCTORS IS SEEING A GROWING NUMBER OF GOVERNMENTS LOOK AT CONSTRUCTING THEIR OWN CUTTING-EDGE FABS he COVID-19 crisis, a re at a Renesas facility and the pro-longed and exceptional winter weather in Texas have all combined to cause a chip shortage undermining the automotive and electronics industries and, in turn, have highlighted just how dependent the world is on supplies from Taiwan and South Korea. TGovernments are said to be weighing up the possibilities of subsidising the construction of new semiconductor factories in response with the US, the EU, India and Japan looking at the possibility of developing cutting-edge ‘fabs’. With more than two- thirds of advanced computing chips now manufactured in Taiwan there is seen to be a need for factories outside of Asia and Intel, Samsung and TSMC have already drawn up plans to build factories in the US. In the case of Intel, it is also talking about building a new factory in Europe. However, is any of this likely? It would be “economically unrealistic” for the US and Europe to build local foundry capacity for local demand, according to TSMC’s chairman Mark Liu, who has suggested that any new capacity would likely end up being ‘non- “Europe pro table’, and that there’s already enough capacity in the system to meet the rising dropped out of demand for AI and 5G chips. He suggests that the pandemic and growing trade tensions this race a long between the US and China are both abnormal factors which have affected the supply time ago and no chain – left alone, things will return to normal. While that might be true in Japan, Canon, Tokyo Electron and Screen Semiconductor longer has the Electron have joined a government funded programme to develop advanced 2nm chips, necessary local while India is looking to build on its strengths as a design centre for global chip rms know-how.” and lure factories with new subsidies. Helmut Gassel, It does appear that every country wants to build its own fab in what could be seen Infi neon as a return to the 1970s, before the US and Europe outsourced chip manufacturing to the Far East. In Europe there are clashes between the EU and national governments over the need for advanced computer chip factories - a policy that’s being promoted by the EU’s internal market chief Thierry Breton. In opposition, Helmut Gassel, head of strategy at German chipmaker In neon has warned that, “Europe dropped out of this race a long time ago and no longer has the necessary local know-how,” to deliver. So, if we are to see a new tranche of factories appearing are we then going to see nations developing their own semiconductor industries? If they do and a chip ‘arms race’ develops might we simply end up with too much chip making capacity and in the process waste limited resources and vast amounts of tax payers’ money? Neil Tyler, Editor ([email protected]) www.newelectronics.co.uk 13 April 2021 5 NEWS EDA Cadence unveils Editor Neil Tyler [email protected] new ‘Dynamic Duo’ CADENCE UNVEILS NEXT-GENERATION PALLADIUM Contributing Chris Edwards, John Walko Editors [email protected] Z2 AND PROTIUM X2 SYSTEMS. NEIL TYLER REPORTS Art Editor Chris Charles Cadence Design Systems UltraScale+ VU19P FPGAs migration and testing from [email protected] has announced the Palladium in these systems provide emulation to prototyping. Z2 Enterprise Emulation customers with 2X capacity “Pre-silicon veri cation of Illustrator Phil Holmes and Protium X2 Enterprise and 1.5X performance advanced SoC design requires Sales Manager James Creber Prototyping systems that are improvements over their a solution with multi-billion- [email protected] intended to handle increasing predecessors, allowing design gate capacity that offers both Publisher Peter Ring system design complexity and engineers to run more validation highest performance and [email protected] time-to-market pressures. cycles on bigger chips in less rapid predictable debug,” Managing Jon Benson Both have been designed time. Both systems offer said Paul Cunningham, senior Director [email protected] to enable high throughput pre- breakthrough