Intel® Xeon® Processor E7- 4800/8800 v3 Product Families Datasheet - Volume 1: Electrical, Mechanical and Thermal May 2015 Reference Number: 332314-001US Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software or service activation. Learn more at Intel.com, or from the OEM or retailer. No computer system can be absolutely secure. Intel does not assume any liability for lost or stolen data or systems or any damages resulting from such losses. You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which includes subject matter disclosed herein. No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document. 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All Rights Reserved. 2 Intel® Xeon® Processor E7-4800/8800 v3 Product Families Datasheet Volume1: EMTS, May 2015 Table of Contents 1Overview...................................................................................................................7 1.1 Introduction .......................................................................................................7 1.1.1 Processor Feature Details ..........................................................................7 1.1.2 Supported Technologies ............................................................................7 1.2 Interfaces ..........................................................................................................8 1.2.1 System Memory Support ...........................................................................8 1.2.2 PCI Express* ...........................................................................................8 1.2.3 Direct Media Interface Gen 2 (DMI2)...........................................................9 1.2.4 Intel® QuickPath Interconnect (Intel® QPI) .............................................. 10 1.2.5 Platform Environment Control Interface (PECI)........................................... 10 1.3 Power Management Support ............................................................................... 10 1.3.1 Processor Package and Core States........................................................... 10 1.3.2 System States Support ........................................................................... 11 1.3.3 Memory Controller.................................................................................. 11 1.3.4 PCI Express* ......................................................................................... 11 1.3.5 Intel® QPI ............................................................................................ 11 1.4 Thermal Management Support ............................................................................ 11 1.5 Package Summary............................................................................................. 11 1.6 Terminology ..................................................................................................... 11 1.7 Related Documents ........................................................................................... 14 1.8 State of Data .................................................................................................... 14 2 Electrical Specifications ........................................................................................... 15 2.1 Processor Signaling ........................................................................................... 15 2.1.1 System Memory Interface Signal Groups ................................................... 15 2.1.2 PCI Express Signals ................................................................................ 15 2.1.3 DMI2/PCI Express Signals ....................................................................... 15 2.1.4 Intel® QuickPath Interconnect (Intel® QPI) ............................................... 15 2.1.5 Platform Environmental Control Interface (PECI) ........................................ 16 2.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)......................... 16 2.1.7 JTAG and Test Access Port (TAP) Signals ................................................... 17 2.1.8 Processor Sideband Signals ..................................................................... 17 2.1.9 Power/Ground and Sense Signals ............................................................. 17 2.1.10 Reserved or Unused Signals..................................................................... 21 2.2 Signal Group Summary ...................................................................................... 22 2.3 Power-On Configuration (POC) Options................................................................. 25 2.4 Fault Resilient Booting (FRB)............................................................................... 26 2.5 Mixing Processors.............................................................................................. 27 2.6 Flexible Motherboard Guidelines (FMB) ................................................................. 28 2.7 Absolute Maximum and Minimum Ratings ............................................................. 28 2.7.1 Storage Conditions Specifications ............................................................. 28 2.8 Power Limit Specifications .................................................................................. 29 2.9 DC Specifications .............................................................................................. 29 2.9.1 Voltage and Current Specifications............................................................ 30 2.9.2 Die Voltage Validation............................................................................. 34 2.9.3 Signal DC Specifications .......................................................................... 35 2.10 Signal Quality ................................................................................................... 40 2.10.1 Intel® Scalable Memory Interconnect Gen 2 (Intel® SMI2) Signal Quality Specifications .................................................................... 41 2.10.2 I/O Signal Quality Specifications............................................................... 41 2.10.3 Intel® QuickPath Interconnect Signal Quality Specifications ......................... 41 2.10.4 Input Reference Clock Signal Quality Specifications..................................... 41 2.10.5 Overshoot/Undershoot Tolerance.............................................................. 41 Intel® Xeon® Processor E7-4800/8800 v3 Product Families 3 Datasheet Volume1: EMTS, May 2015 3 Processor Land Listing .............................................................................................45 3.1 Listing by Land Name .........................................................................................45 3.2 Listing by Land Number ......................................................................................69 4 Signal Descriptions ..................................................................................................95 4.1 System Memory Interface ...................................................................................95 4.2 PCI Express Based Interface Signals.....................................................................95 4.3 DMI2/PCI Express Port Signals ............................................................................95 4.4 Intel® QuickPath Interconnect Signals ..................................................................96 4.5 PECI Signal.......................................................................................................96 4.6 System Reference Clock Signals ..........................................................................96 4.7 JTAG and TAP Signals.........................................................................................96 4.8 Serial VID Interface (SVID) Signals ......................................................................97 4.9 PIROM Signals...................................................................................................97 4.10 Processor Asynchronous Sideband and Miscellaneous Signals...................................98 4.11 Processor Power and Ground Supplies ................................................................ 100 5 Thermal Management Specifications ...................................................................... 103 5.1 Package Thermal Specifications ......................................................................... 103 5.1.1 TCASE