Quad-Core Intel® Xeon® Processor 5400 Series Datasheet August 2008 318589-005 INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. 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Copyright © 2007-2008, Intel Corporation. 2 Quad-Core Intel® Xeon® Processor 5400 Series Datasheet Contents 1Introduction..............................................................................................................9 1.1 Terminology ..................................................................................................... 10 1.2 State of Data .................................................................................................... 13 1.3 References ....................................................................................................... 13 2 Quad-Core Intel® Xeon® Processor 5400 Series Electrical Specifications................ 15 2.1 Front Side Bus and GTLREF ................................................................................ 15 2.2 Power and Ground Lands.................................................................................... 16 2.3 Decoupling Guidelines........................................................................................ 16 2.3.1 VCC Decoupling...................................................................................... 16 2.3.2 VTT Decoupling ...................................................................................... 16 2.3.3 Front Side Bus AGTL+ Decoupling ............................................................ 16 2.4 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking ....................................... 17 2.4.1 Front Side Bus Frequency Select Signals (BSEL[2:0]).................................. 17 2.4.2 PLL Power Supply................................................................................... 18 2.5 Voltage Identification (VID) ................................................................................ 18 2.6 Reserved, Unused, and Test Signals..................................................................... 21 2.7 Front Side Bus Signal Groups.............................................................................. 22 2.8 CMOS Asynchronous and Open Drain Asynchronous Signals .................................... 24 2.9 Test Access Port (TAP) Connection....................................................................... 24 2.10 Platform Environmental Control Interface (PECI) DC Specifications........................... 24 2.10.1 DC Characteristics .................................................................................. 24 2.10.2 Input Device Hysteresis .......................................................................... 25 2.11 Mixing Processors.............................................................................................. 26 2.12 Absolute Maximum and Minimum Ratings ............................................................. 26 2.13 Processor DC Specifications ................................................................................ 27 2.13.1 Flexible Motherboard Guidelines (FMB) ...................................................... 27 2.13.2 VCC Overshoot Specification .................................................................... 38 2.13.3 Die Voltage Validation............................................................................. 39 2.14 AGTL+ FSB Specifications................................................................................... 39 3 Mechanical Specifications ........................................................................................ 43 3.1 Package Mechanical Drawings ............................................................................. 43 3.2 Processor Component Keepout Zones................................................................... 47 3.3 Package Loading Specifications ........................................................................... 47 3.4 Package Handling Guidelines............................................................................... 48 3.5 Package Insertion Specifications.......................................................................... 48 3.6 Processor Mass Specifications ............................................................................. 48 3.7 Processor Materials............................................................................................ 48 3.8 Processor Markings............................................................................................ 48 3.9 Processor Land Coordinates ................................................................................ 49 4Land Listing............................................................................................................. 51 4.1 Quad-Core Intel® Xeon® Processor 5400 Series Pin Assignments ........................... 51 4.1.1 Land Listing by Land Name...................................................................... 51 4.1.2 Land Listing by Land Number................................................................... 61 5 Signal Definitions .................................................................................................... 71 5.1 Signal Definitions .............................................................................................. 71 6 Thermal Specifications ............................................................................................ 79 6.1 Package Thermal Specifications........................................................................... 79 6.1.1 Thermal Specifications ............................................................................ 79 6.1.2 Thermal Metrology ................................................................................. 90 6.2 Processor Thermal Features................................................................................ 90 Quad-Core Intel® Xeon® Processor 5400 Series Datasheet 3 6.2.1 Intel® Thermal Monitor Features...............................................................90 6.2.2 On-Demand Mode...................................................................................92 6.2.3 PROCHOT# Signal ..................................................................................93 6.2.4 FORCEPR# Signal ...................................................................................93 6.2.5 THERMTRIP# Signal ................................................................................94 6.3 Platform Environment Control Interface (PECI) ......................................................94 6.3.1 Introduction...........................................................................................94 6.3.2 PECI Specifications .................................................................................96 7Features..................................................................................................................97 7.1 Power-On Configuration Options ..........................................................................97 7.2 Clock Control and Low Power States.....................................................................97