Electronic Component Zero Orientation For CAD Library Construction 3000 Lakside Drive PCB Libraries, Inc. Suite 309S 701 Lee Street Bannockburn, IL, 60015 Des Plaines, IL 60016 Tel: 847-615-7100 Fax: 847-615-7105 Tel: 877-722-4441 Fax: 847.745.0450 www.ipc.org www.PCBLibraries.com Component Orientations INTRODUCTION CONTENTS 1 INTRODUCTION ............................................................................................................1 1.1 Scope ...................................................................................................................1 1.2 Purpose ................................................................................................................1 2 CHIP COMPONENTS.....................................................................................................3 2.1 Chip Capacitor ......................................................................................................3 2.2 Chip Resistor ........................................................................................................3 2.3 Chip Inductor ........................................................................................................3 3 MOLDED COMPONENTS...............................................................................................4 3.1 Molded Capacitors ................................................................................................4 3.2 Molded Diodes ......................................................................................................4 3.3 Molded Inductors...................................................................................................4 4 PRECSION WIRE-WOUND ............................................................................................5 4.1 Precision Wire Wound Components .......................................................................5 5 MELF COMPONENTS ....................................................................................................6 5.1 MELF Diodes ........................................................................................................6 5.2 MELF Resistors.....................................................................................................6 6 ALUMINUM ELECTROLYTIC CAPACITORS...................................................................7 6.1 Aluminum Electrolytic Capacitors...........................................................................7 7 SOT COMPONENTS ......................................................................................................8 7.1 SOT23-3 ...............................................................................................................8 7.2 SOT23-5 ...............................................................................................................8 7.3 SOT343 ................................................................................................................8 7.4 SOT223 ................................................................................................................8 8 TO COMPONENTS ........................................................................................................9 8.1 TO252 (DPAK) ......................................................................................................9 9 SMALL OUTLINE GULLWING COMPONENT................................................................ 10 9.1 SOIC, SOP & SSOP ............................................................................................ 10 9.2 TSSOP ............................................................................................................... 10 10 SMALL OUTLINE J-LEAD COMPONENTS.................................................................... 11 10.1 SOIC J-Lead ....................................................................................................... 11 11 QUAD FLAT PACKAGE................................................................................................ 12 11.1 Square QFP Pin 1 on Side................................................................................... 12 11.2 Rectangle QFP Pin 1 on Side .............................................................................. 12 12 BUMPER QUAD FLAT PACKAGE................................................................................. 13 12.1 Bump QFP Pin 1 on Side..................................................................................... 13 12.2 Bump QFP Pin 1 in Center .................................................................................. 13 13 CERAMIC FLAT PACKAGE .......................................................................................... 14 13.1 Ceramic Flat Package ......................................................................................... 14 14 CERAMIC QUAD FLAT PACKAGE ............................................................................... 15 14.1 CQFP (Ceramic Quad Flat Package) ................................................................... 15 i Component Orientations INTRODUCTION 15 PLASTIC LEADED CHIP CARRIERS ............................................................................ 16 15.1 PLCC Square ...................................................................................................... 16 15.2 PLCC Rectangular .............................................................................................. 16 16 LEADLESS CHIP CARRIERS ....................................................................................... 17 16.1 LCC Square ........................................................................................................ 17 16.2 Chip Array........................................................................................................... 17 17 QUAD FLAT NO-LEAD ................................................................................................. 18 17.1 QFN Square........................................................................................................ 18 17.2 QFN Rectangular Vertical.................................................................................... 18 17.3 QFN Rectangular Horizontal ................................................................................ 18 18 BALL GRID ARRAY...................................................................................................... 19 18.1 BGA Square........................................................................................................ 19 18.2 BGA Rectangular ................................................................................................ 19 19 COMPONENT ZERO ORIENTATIONS.......................................................................... 20 19.1 Summary ............................................................................................................ 20 20 APPENDIX A - EIA Survey for Component Orientation ................................................ 21 20.1 Purpose .............................................................................................................. 21 20.2 Driving factors..................................................................................................... 21 20.3 Examples of Possible Conflict.............................................................................. 22 20.4 Recommendation ................................................................................................ 24 20.5 Presentation of Results ....................................................................................... 28 21 APPENDIX B – Internet Search Results........................................................................ 29 21.1 Device Orientation (Catalyst)............................................................................... 29 21.2 Device Orientation (LRC China)........................................................................... 29 21.3 Device Orientation (Diodes, Incorporated)............................................................ 30 21.4 Device Orientation (Fairchild Semiconductor)....................................................... 31 21.5 Device Orientation (Linear Technology) ............................................................... 31 21.6 Device Orientation (RF Technologies).................................................................. 34 21.7 Device Orientation (Microchip Devices)................................................................ 36 21.8 Device Orientation (ZETEX) ................................................................................ 40 21.9 Device Orientation (IDT)...................................................................................... 41 22 APPENDIX C – Comment Form .................................................................................... 43 23 CREDITS ..................................................................................................................... 44 23.1 Contributions....................................................................................................... 44 ii Component Orientations INTRODUCTION 1 INTRODUCTION 1.1 Scope To establish a consistent technique for the description of electronic component orientation, and their land pattern geometries, that facilitates and encourages a common data capture and transfer methodology amongst and between global trading partners. 1.2 Purpose IPC, in conjunction with the International Electrotechnical Commission (IEC), have established several standards that are in the process of being