High Level Assembler for z/OS & z/VM & z/VSE 1.6 Installation and Customization Guide IBM SC26-3494-05 Note Before using this information and the product it supports, be sure to read the general information under “Notices” on page 193. This edition applies to IBM High Level Assembler for z/OS & z/VM & z/VSE, Release 6, Program Number 5696-234 and to any subsequent releases until otherwise indicated in new editions. Make sure that you are using the correct edition for the level of the product. Order publications through your IBM® representative or the IBM branch office serving your locality. IBM welcomes your comments. For information on how to send comments, see “How to send your comments to IBM” on page xx. © Copyright International Business Machines Corporation 1992, 2021. US Government Users Restricted Rights – Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Figures................................................................................................................. xi Tables................................................................................................................ xiii About this document.......................................................................................... xvii Brief overview of High Level Assembler...................................................................................................xvii Who should use this document................................................................................................................xvii Experienced users installing on z/OS................................................................................................. xvii Experienced users installing on z/VM.................................................................................................xvii Experienced users installing on z/VSE...............................................................................................xviii Experienced users installing on zLinux..............................................................................................xviii Terminology in this information...............................................................................................................xviii List of APARs and PTFs in this book........................................................................................................ xviii Other documentation you might need.................................................................................................... xviii Syntax notation........................................................................................................................................ xviii Format.................................................................................................................................................. xix How to send your comments to IBM......................................................................................................... xx If you have a technical problem........................................................................................................... xx Summary of changes.................................................................................................................................. xx Chapter 1. Planning for installing High Level Assembler on z/OS............................. 1 What you receive with High Level Assembler............................................................................................. 1 Distribution media.................................................................................................................................. 1 Basic material......................................................................................................................................... 1 Optional material....................................................................................................................................2 Program publications and softcopy....................................................................................................... 2 What you need to install High Level Assembler.......................................................................................... 2 Required and optional software for the target system..........................................................................3 DASD storage required for the target system........................................................................................ 3 FMIDs deleted..............................................................................................................................................5 Installing with CBPDO..................................................................................................................................5 Planning to use SMP/E................................................................................................................................. 5 Planning to change installation jobs............................................................................................................6 Publications useful during installation........................................................................................................ 6 Program support.......................................................................................................................................... 6 Program services.................................................................................................................................... 6 Preventive Service Planning...................................................................................................................6 Statement of support procedures..........................................................................................................6 Program and service level information........................................................................................................7 Program level information......................................................................................................................7 Service level information........................................................................................................................7 Cumulative service tape......................................................................................................................... 7 Chapter 2. Planning for customizing High Level Assembler on z/OS.........................9 Deciding whether and what to customize................................................................................................... 9 SMP/E and High Level Assembler................................................................................................................9 Selecting multicultural support................................................................................................................... 9 Planning to customize High Level Assembler options.............................................................................. 10 Why do it............................................................................................................................................... 10 iii Choices to make now........................................................................................................................... 10 Planning to customize the user exits.........................................................................................................13 Planning to customize cataloged procedures...........................................................................................13 Why do it............................................................................................................................................... 13 Choices to make now........................................................................................................................... 14 Example................................................................................................................................................ 14 Planning to install in the link pack area.....................................................................................................14 Why do it............................................................................................................................................... 14 Choices to make now........................................................................................................................... 15 Chapter 3. Installing High Level Assembler on z/OS..............................................17 Overview of installation............................................................................................................................. 17 Modifying High Level Assembler jobs.................................................................................................. 17 If using a CBPDO.................................................................................................................................. 17 Installation checklist............................................................................................................................17 Step 1: SMP/E considerations for installing High Level Assembler..........................................................18 SMP/E environment..............................................................................................................................18 SMP/E options subentry values..........................................................................................................