i.MX8M Plus SOM NXP i.MX 8M Plus Processor Up to 4 x Arm Cortex-A53 cores, 1 x Cortex-M7 System on Module ● Integrated NPU (2.3 TOPs) for embedded AI/ML applications and edge inferencing ● Dual to Quad-core options with onboard WiFi/BT, eMMC, MIPI-CSI, LVDS ● Connect up to 2 MIPI cameras, 4K vision with HDR for detailed image processing i.MX8M Plus Dual i.MX8M Plus Quad CPU Name NXP i.MX8M Plus Dual NXP i.MX8M Plus Quad 2 x Cortex A53 4 x Cortex A53 CPU Type 1 x Cortex M7 1 x Cortex M7 1 x NPU up to 2.3 TOPS 1 x NPU up to 2.3 TOPS CPU Details 1.8GHz Commercial 1.8GHz Commercial CPU Speed 1.6GHz Industrial 1.6GHz Industrial Floating Point VFPv4 VFPv4 SIMD NEON NEON Memory & Storage 1GB LPDDR4 1GB LPDDR4 Internal Storage 8GB eMMC 8GB eMMC RAM NOR-Flash NOR-Flash External Storage Support SD SD PCIe-SSD PCIe-SSD 2 x 10/100/1000 Mbps (By default only 1 PHY assembled) 2 x 10/100/1000 Mbps (By default only 1 PHY assembled) Ethernet Networking 1 x with TSN 1 x with TSN Wireless 802.11 ac/a/b/g/n + BT 5.0 802.11 ac/a/b/g/n + BT 5.0 GPU Vivante GC7000UL Vivante GC7000UL OpenGL ES 3.1/3.0 OpenGL ES 3.1/3.0 Vulkan Vulkan 3D GPU Support OpenCL 1.2 FP OpenCL 1.2 FP OpenVG 1.1 OpenVG 1.1 Video Decoder 1080p60 1080p60 Video Encoder 1080p60 1080p60 Multimedia Display Interfaces HDMI 2.0, MIPI-DSI, LVDS HDMI 2.0, MIPI-DSI, LVDS 1 x MIPI-CSI2 (4 Lane) 1 x MIPI-CSI2 (4 Lane) Camera Interface 2 x ISP 2 x ISP S/PDIF Input / Output 1 1 18x I2S TDM, DSD512, 8-ch PDM Mic input, eARC, ASRC 18x I2S TDM, DSD512, 8-ch PDM Mic input, eARC, ASRC Digital Audio Serial Interface Low power voice accelerator: Cadence® Tensilica® HiFi 4 DSP @ Low power voice accelerator: Cadence® Tensilica® HiFi 4 800 MHz DSP @ 800 MHz USB 3.0 2 2 PCIe 1 (Gen 3.0) 1 (Gen 3.0) I2C 3 3 SPI 1 1 UART 2 (RTS/CTS/RX/TX) +1 (TX/RX) 2 (RTS/CTS/RX/TX) +1 (TX/RX) Connectivity GPIO 75 75 PWM 4 4 CAN 2 2 SD/MMC 1 1 JTAG Test point header Test point header OS Support Embedded Linux Linux Linux Size 47 x 30 mm 47 x 30 mm Physical Interface 3 x Hirose DF40 connectors 3 x Hirose DF40 connectors Main Voltage 5V 5V Power I/O Voltage 3.3V/1.8V 3.3V/1.8V Commercial: 0°C to 70°C Commercial: 0°C to 70°C Temperature Environment Industrial: -40°C to 85°C Industrial: -40°C to 85°C Humidity Humidity (non-condensing): 10% – 90% Humidity (non-condensing): 10% – 90% www.solid-run.com i.MX8M Plus SOM RGMII 32 Bits 10/100/1000 LPDDR4 ADIN1300 1588 ADI Up to 8GB RGMII 10/100/1000 ADIN1300 1588 SDIO3, 8 Bits ADI eMMC HDMI2.0a USB1 (USB3.0/USB2.0 OTG) SDIO1 4 Bits WiFi b,g,n,ac USB2 (USB3.0/USB2.0 OTG) UART 1 BT 5.0 MIPI-DSI (4 Lanes) LVDS1 (4 Lanes) MIPI-CSI1 (4 Lanes) PCIe 3.0 SDIO2 4 Bits UART 1/2/3/4 Connectors ESPI2 SSO I2C1/I2C2/I2C3/I2C4 QSPI (4 Bits), SSO LVDS2 (4 Lanes) SAI2/3/5 Header 2 x FCAN GPIO Boot Mode, Boot SEL Reset, Control 3.3V Cortex M7 5V PMIC Ordering Information Available on Shop SKU Description SRMP8QDW00D01GE008V10C0 SOM i.MX8M Plus Quad | No WiFi/BT | 1GB RAM | 8GB eMMC | Com.Temp | R1.0 | Unfused SRMP8QDWB1D01GE008V10C0 SOM i.MX8M Plus Quad | Inc. WiFi/BT | 1GB RAM | 8GB eMMC | Com.Temp | R1.0 | Unfused i.MX8 Plus Starter Kit - SOM i.MX8M Plusi Quad | HummingBoard Pulse | Inc. WiFi/BT | 1GB RAM | 8GB eMMC| Com.Temp | R02 | Inc. SRMP8-KIT001 Heatsink | 12V 1.5A Power adapter | Micro SD | USB to Micro USB Cable | WiFi Antenna ● To choose your ideal configuration see our Product Configurator Tool Accessories: SKU Description HS00016K i.MX8M Heatsink Kits SKU Description SRMP8QDW00D01GE008M01CH SOM i.MX8M Plus Quad |HummingBoard Mate | No WiFi/BT | 1GB RAM | 8GB eMMC | Com.Temp | R01 | Inc. Heatsink SRMP8QDWB1D01GE008M01CH SOM i.MX8M Plus Quad |HummingBoard Mate | Inc. WiFi/BT | 1GB RAM | 8GB eMMC | Com.Temp | R01 | Inc. Heatsink For more information about the i.MX8M Plus SOM Software/Hardware visit our: Developer Center www.solid-run.com.