TIM-40 MODULE SPECIFICATION Including TMS320C44 Addendum VERSION 1.12. 1 Table of Contents TABLE OF CONTENTS ............................................................................................................................................................... 2 1.THE MODULE CONCEPT........................................................................................................................................................ 4 1.1 INTRODUCTION.................................................................................................................................................................... 4 1.2 ORIGINS OF THE MODULE..................................................................................................................................................... 4 1.3 MODULE CONCEPT............................................................................................................................................................... 4 1.4 MOTHERBOARD CONCEPT .................................................................................................................................................... 4 1.5 SUMMARY ........................................................................................................................................................................... 4 2. PHYSICAL SPECIFICATIONS ............................................................................................................................................. 5 2.1 INTRODUCTION.................................................................................................................................................................... 5 2.2 DIMENSIONS ....................................................................................................................................................................... 5 2.2.1. Board Area (Single Module) ........................................................................................................................................ 5 2.2.2. Component Heights...................................................................................................................................................... 5 2.3 CONNECTORS ...................................................................................................................................................................... 6 2.3.1. Introduction................................................................................................................................................................. 6 2.3.2. Primary Connectors..................................................................................................................................................... 6 2.3.3. Optional Global Bus Connector................................................................................................................................... 7 2.4. MULTIPLE WIDTH MODULES ................................................................................................................................................ 7 2.5. MULTIPLE PROCESSOR CONFIGURATION ............................................................................................................................... 8 2.6. REDUNDANT COMMUNICATIONS PORTS/CONNECTORS........................................................................................................... 8 2.7. REDUNDANT JTAG CONNECTIONS........................................................................................................................................ 8 3. ELECTRICAL SPECIFICATIONS........................................................................................................................................ 9 3.1 INTRODUCTION.................................................................................................................................................................... 9 3.2 SIGNAL REQUIREMENTS ....................................................................................................................................................... 9 3.3 POWER RECOMMENDATIONS ................................................................................................................................................ 9 3.4 IDENTIFICATION ROM ......................................................................................................................................................... 9 3.5 CONFIG LINE..................................................................................................................................................................... 9 3.6 CLOCK GENERATION.......................................................................................................................................................... 10 3.6.1. Distributed Memory Case .......................................................................................................................................... 10 3.6.2. Shared Memory Case................................................................................................................................................. 10 3.7 RESET GENERATION ........................................................................................................................................................ 10 3.8 BOOT CONTROL................................................................................................................................................................. 10 3.9 UNUSED LINKS / SIGNAL CONDITIONING............................................................................................................................. 11 3.10. PRESENCE DETECTION (SENSE FUNCTION)..................................................................................................................... 11 4. IDENTIFICATION ROM FORMAT ................................................................................................................................... 12 4.1 INTRODUCTION.................................................................................................................................................................. 12 4.2 ROM TYPE ....................................................................................................................................................................... 12 4.3 ID DATA LOADED.............................................................................................................................................................. 12 4.4. ASSIGNMENT OF MANUFACTURER’S ID CODES .................................................................................................................... 14 4.5. RESERVED MANUFACTURERS ID ROM CODES.................................................................................................................... 14 4.6. ID ROM FORMAT.............................................................................................................................................................. 14 4.7. CONTROL REGISTER AUTOINITIALISATION FROM ID ROM................................................................................................... 14 4.8 ID ROM BOOT SEQUENCE ................................................................................................................................................. 14 4.9. COMMUNICATIONS PORT BOOTSTRAP ................................................................................................................................. 14 4.9.1. Protection of Writable ROMs.................................................................................................................................... 15 4.9.2. Recall of EEPROM Arrays......................................................................................................................................... 15 4.9.3. Location of Serial and 4-bit ID ROMs........................................................................................................................ 15 4.9.4. ROM Driver for Serial/4-bit ID ROMs....................................................................................................................... 16 4.9.5. Accessing Serial/4-bit ID ROMs................................................................................................................................. 16 4.9.5.1. Bus Controller Set-up during ID ROM Access ....................................................................................................................... 16 4.9.5.2. Accessing the ROM............................................................................................................................................................... 16 4.9.5.3. Unused Bits .......................................................................................................................................................................... 16 4.9.5.4. Resetting the ID ROM........................................................................................................................................................... 16 4.9.5.5. Maximum Access Rate.......................................................................................................................................................... 16 4.10. ROM BOOTSTRAP .......................................................................................................................................................... 16 4.10.1. Protection of Writable ROMs ................................................................................................................................