Modeling of a Thermosiphon to Recharge a Phase Change Material Based Thermal Battery for a Portable Air Conditioning Device

Modeling of a Thermosiphon to Recharge a Phase Change Material Based Thermal Battery for a Portable Air Conditioning Device

Modeling of a Thermosiphon to Recharge a Phase Change Material Based Thermal Battery for a Portable Air Conditioning Device Rohit Dhumane Jiazhen Ling Vikrant Aute Reinhard Radermacher Center for Environmental Energy Engineering, University of Maryland, College Park, 4164 Glenn L. Martin Hall Bldg., MD 20742, USA {dhumane,jiazhen,vikrant,raderm}@umd.edu Abstract single phase fluid or two phase fluid, may consist of a co-current or counter-current flow (Haider et al., 2002) Closed loop two phase thermosiphons have a broad range and have open or closed loops (Benne and Homan, 2009). of applications due to their simplicity, reliability, low cost The counter-current thermosiphons are also referred to as and the ability to dissipate high heat fluxes from minimal heat pipes. Industrial applications typically involve the temperature differences. The present study focuses on one co-current thermosiphons and the term thermosiphon used thermosiphon operation which solidifies a phase change henceforth in this paper, will refer to these co-current ther- material (PCM) based thermal battery for a portable air mosiphons. conditioner called Roving Comforter (RoCo). RoCo uses A closed-loop two-phase thermosiphon consists of a vapor compression cycle (VCC) to deliver cooling and closed circuit of refrigerant tube filled with a working fluid stores the heat released from the condenser into a com- (referred to as refrigerant in this paper) and oriented in a pact phase change material (PCM) based thermal battery. vertical plane. The refrigerant evaporates in the lower por- Before its next cooling operation, the PCM needs to be tion of the loop (called evaporator) due to a heat input. re-solidified. This is achieved by the thermosiphon, which The resultant vapor then travels upwards through a verti- operates within the same refrigerant circuitry with the help cal tube called as the riser to reach the condenser, where of a pair of valves. The molten PCM which acts as heat it rejects its latent heat. The condenser is located verti- source affects the dynamics of the thermosiphon which in cally above the evaporator and the condensed refrigerant turn affects the solidification process. Thus the dynamics from its outlet trickles down into the evaporator by gravity of both the PCM and thermosiphon are coupled. For ac- through the downcomer tube. The cycle repeats until the curate transient modeling of this process, the PCM model heat source is exhausted. considers the solidification over a temperature range, vari- The current study is motivated by a need to understand able effects of conduction and natural convection during the dynamics of a thermosiphon used to recharge the ther- the phase change and variable amounts of heat release mal battery of a portable air conditioning device called at different temperatures within the temperature range of Roving Comforter (RoCo) (Du et al., 2016). The dynamic phase change. The paper discusses component modeling model is expected to aid the improvement of design and for this transient operation of thermosiphon and its valida- development of controls. A brief description of RoCo is tion with experimental data. given in the next section. Keywords: Thermosiphon, Thermosyphon, Phase Change Materials 2 System Details 1 Introduction Traditional HVAC (Heating, Ventilation and Air Condi- tioning) systems consume significant amounts of energy A thermosiphon is an energy transfer device capable of to maintain a uniform temperature in the buildings within transferring heat from a heat source to a heat sink over a narrow range, neither of which is necessary for deliv- a relatively long distance, without the use of active con- ering comfort (Hoyt et al., 2015). Personal condition- trol instrumentation and any mechanically moving parts ing systems like RoCo provide an opportunity to save the such as pumps (Dobson and Ruppersberg, 2007). Ther- building energy by relaxing the building thermostat set- mosiphons are used in diverse applications like cooling tings without compromising occupant thermal comfort. of electronic components, light water reactors, solar wa- RoCo uses vapor compression cycle (VCC) to deliver ter heating systems, geothermal systems, and thermoelec- cooling for building occupants and stores the waste heat tric refrigeration systems due to simple designs, simple from the condenser in a compact PCM based thermal bat- operating principles and high heat transport capabilities tery. The schematic of the two modes of operation of (Franco and Filippeschi, 2011). Lack of moving com- RoCo is shown in Figure1. When the PCM is molten, ponent for pumping refrigerant also leads to higher reli- the VCC operation is terminated. Due to the poor ther- ability of the system. Thermosiphons may operate with mal conductivity of PCM, the molten PCM cannot solid- DOI Proceedings of the 12th International Modelica Conference 459 10.3384/ecp17132459 May 15-17, 2017, Prague, Czech Republic Modeling of a Thermosiphon to Recharge Phase Change Material Based Thermal Battery for a Portable Air Conditioning Device Figure 1. Schematic of two modes of operation of RoCo with the thermal battery marked in grey box Figure 2. The thermal battery of RoCo in the experimental setup (Du et al., 2016) ify by itself within a reasonable time duration by reject- 3 Model Development ing heat to ambient air. Consequently, to enable a faster The system model for the thermosiphon consists of several recharge of the thermal battery (i.e. PCM solidification), components which are shown in Figure3. The evaporator a thermosiphon is used. The thermosiphon operation is (See Figure2) consists of four symmetric refrigerant cir- ideal in this situation because of its high rate of heat dissi- cuits and to save computational effort, only one of them pation even from relatively small temperature differences is modeled. The splitter and mixer components are between the heat source and the heat sink. The refrigerant used to scale the dynamic behavior of a single refriger- circuitry is designed to enable a single direction flow of ant circuit to the complete evaporator. The splitter di- refrigerant. By operating a pair of valves, the refrigerant vides refrigerant mass flow rates equally into four, while circuit switches from VCC circuit to thermosiphon circuit. the mixer combines them. The refrigerant then flows into the riser, condenser, refrigerant tube and downcomer be- The PCM selected for the current application is fore flowing back to the evaporator. The refrigerant tube is paraffin-based, with the midpoint of its solidification tem- a non-adiabatic flow passage for the refrigerant. The PCM perature range at 35°C. The temperature choice is based blocks are connected to a tube control volume, which is a on a trade-off between two opposing factors. The temper- simple model of circular wall for pipes. The tube control ature should be high enough so that the PCM does not so- volume component is also used to model the pcm con- lidify at typical room temperatures (< 26°C). At the same tainer. Finally, the heat losses by natural convection and time, the temperature should also be low enough so that radiation from the pcm container to the ambient are incor- the condenser temperature for VCC operation is not very porated. Detailed description of the component models is high. Higher condenser temperature leads to poor coeffi- provided in this section. cient of performance (COP). Thus, a very narrow range of temperature range is applicable for the solidification tem- 3.1 Phase Change Material perature of PCM in RoCo. Paraffin based PCM is chosen Recall that the PCM Heat Exchanger (PCM-HX) consists because as a class paraffin is safe, reliable, predictable, of helical refrigerant tubes surrounded by PCM. The PCM less expensive and non-corrosive. It melts and freezes re- solidification is a complex phenomenon due to the fact that peatedly without phase segregation and consequent degra- the solid-liquid boundary moves depending on the rate of dation of its latent heat of fusion (Sharma et al., 2009). It heat transfer and hence its position with time forms part crystallizes with little or no supercooling (Sharma et al., of the solution (Zalba et al., 2003). The rate of heat trans- 2009). The only major disadvantage of paraffin based fer varies progressively during the phase change due to PCM is its low thermal conductivity. To address this issue, the varying effects of conduction and natural convection the thermal battery consists of helical coils of refrigerant which depends on the state of PCM. Thus, the dynamics tubing enclosed within PCM volume (See Figure2). This of PCM and thermosiphon are coupled. The helical nature arrangement enables higher surface area of heat transfer of the refrigerant tube further increases the complexity by and better reach within the PCM volume. making the problem three-dimensional. 460 Proceedings of the 12th International Modelica Conference DOI May 15-17, 2017, Prague, Czech Republic 10.3384/ecp17132459 Session 7B: Thermodynamic Systems duration=0 mdot air inlet duration=0 boundary condenser conditions Condenser Tair duration=0 riser RH refrigerant tube Mixer downcomer evaporator cv Heat losses from PCM tube cv Splitter container to surroundings pCMConductor const pcm conductor Gc k=0.2322 C pcm capacitor convection fixedTemperature pCMCapacitor bodyRadiation K T=299.35 Gr=0.073215 pcm container Figure 3. Schematic of System Model for Thermosiphon. The model used in the current work is a trade-off for ac- Modelica.Blocks.Sources.CombiTable1D block is curacy, complexity and usability. The PCM block is taken used for input of enthalpy-temperature profile. as a lumped control volume to eliminate the modeling of The enthalpy-temperature profile is calculated as shown momentum equation for the molten PCM flow from natu- in equation (2) ral convection. Two components are used to model PCM: PCMConductor to model the rate of heat transfer from the 8 R TA c dT; solid PCM and PCMCapacitor to model the PCM heat storage.

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