NFC Forum Chairs As of June 2018

NFC Forum Chairs As of June 2018

NFC Forum Chairs as of June 2018 Group Chair Co-Chair or Vice-Chair Secretary / Editor Board of Directors Koichi Tagawa, Dai Nippon Printing Alexander Rensink, NXP Frank Dawidowsky, Sony Liaison Task Force Frank Dawidowsky, Sony Paula Hunter, NFC Forum Membership Task Force Paula Hunter, NFC Forum Strategy Task Force Koichi Tagawa, Dai Nippon Printing Chairs Group Frank Dawidowsky, Sony Group Chair Vice-Chair or Co-Chair Secretary / Editor Technical Committee Jürgen Böhler, STMicroelectronics Michael Stark, NXP (Vice-Chair) Analog Working Group Mohammed Ratni, Sony Andreas Wörle, Infineon Wireless Charging Task Force Nobuyoshi Hayashi, ROHM Erwan Le Fer, Micropross (Vice-Chair) NFC Devices Working Group Klaus Roehrle, Sony John Hillan, Qualcomm LLCP: (Vice-Chair) NCI: Jingqing Mei, Huawei T1T: T2T: Henk Dannenberg, NXP T3T: Klaus Roehrle, Sony T4T: Henk Dannenberg, NXP T5T: Erich Reisenhofer, NXP Digital Working Group Michael Stark, NXP John Hillan, Qualcomm Activity: Klaus Roehrle, Sony (Vice-Chair) Digital: Katsuyuki Teruyama, Sony Reference Applications Framework Daniel Orsatti, STMicroelectronics Working Group Security Working Group NFC Forum Chairs as of June 2018 Group Chair Co-Chair or Vice-Chair Secretary / Editor Compliance Committee Henk Dannenberg, NXP Minimum Level of Interoperability Michael Stark, NXP Working Group Compliance Program Working Group Stanley Cho, FIME Testing Working Group Diego Lébron, AT4 Wireless RF Testing Task Force Benoit Hedou, KEOLABS Arnaud Schreiner, NXP Stanley Cho, FIME Wireless Charging Testing Task Arnaud Schreiner, NXP Erwan Lefer, Micropross Force Group Chair Vice-Chair or Co-Chair Secretary / Editor Special Interest Group (SIG) Koichi Tagawa, Dai Nippon Printing Committee Japan Task Force Daisuke Takai, Dai Nippon Printing Kenji Oguma, NEC Corporation Internet of Things SIG Vincent Chauvin, Apple Erich Reisenhofer, NXP Erwan Le Fer, Micropross (Vice-Chair) Automotive Task Force Rainer Lutz, NXP Jack Lee, Samsung Retail & Payment SIG Matt Bright, Thin Film Transport SIG Joerg Schmidt, Infineon Cord Bartels, BSI .

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