Hi3559 V100 Hi3559 V100 Professional 2K/4K Mobile Camera SoC Introduction Key Specifications Hi3559 V100 is a new-generation MobileCamTM z 4K30/1440P60 H.265 Encoding intelligent video processor provided by HiSilicon, a leading 4K@30 fps+1080p@30 fps or 1440p@60 fps+1080p@30 supplier in the global ultra-HD video technologies. The Hi3559 fps H.265 encoding V100 processor is launched for the professional camera, high- end drone camera, extreme sports motion DV, 3D/VR camera, z Dual-Sensor Inputs and high-end EDR product fields. 2K x 2K@30 fps 3D or 3K x 3K@15 fps dual-fisheye Hi3559 V100 uses the HiSilicon fifth-generation Hi-Lark inputs high-performance video encoder, which supports simultaneous z 6-DoF DIS 4K@30 fps encoding and 1-channel 1080p@30 fps small- z High-Speed Memory Interfaces stream encoding. Besides, it can also record high-frame-rate videos such as 2K@60 fps, 1080p@120 fps, and 720p@240 USB 3.0 or PCIe 2.0 high-speed interface fps. z RAW Video Output Hi3559 V100 uses the HiSilicon fourth-generation Hi-ISP Professional 1080p@30 fps video RAW output high-performance graphics processor and adopts the latest 3A, z Low Power Consumption 3DNR, and HDR technologies to achieve professional picture effect. Hi3559 V100 supports dual sensor inputs and maximum 1.25 W typical power consumption in the 4K@30 16-megapixel and 8-megapixel video processing to flexibly fps+1080p@30 fps H.265 encoding scenario support the service scenarios that required dual-channel z Miniaturization Package recording, such as the 3D/VR camera. Hi3559 V100 integrates 10 mm x 10 mm (0.39 in. x 0.39 in.) package high-speed transfer and storage USB 3.0 and PCIe 2.0 interfaces that transfer and store 1080P30 RAW data to achieve the effect of a professional camera. Hi3559 V100 integrates the high-performance dual-core CPU (A17+A7). Apart from the video encoding and ISP processing functions, Hi3559 V100 also supports intelligent functions, such as EIS and optical flow hovering. Hi3559 V100 adopts the 28 nm HPC+ advanced manufacturing process and the 10 mm x 10 mm (0.39 in. x 0.39 in.) FC-CSP package. These features enable Hi3559 V100 to continuously lead the industry in high picture quality, low power consumption, and miniaturization. Application Scenario Hi3559 V100 2K/4K 2K/4K drone camera networked 2K/4K mobile 3D/VR EDR camera 4K professional camera camera HiSilicon Proprietary and Confidential Issue 01 (2016-07-29) 3 Copyright © HiSilicon Technologies Co., Ltd. Hi3559 V100 Hi3559 V100 Professional 2K/4K Mobile Camera SoC processing supports only sensor built-in WDR, 2F frame- Major Specifications based/line-based WDR, and local tone mapping. Processor Core z ISP tuning tools for the PC z 1.25 GHz A17 core, supporting 32 KB I-cache, 32 KB D- Audio Encoding/Decoding cache, and 256 KB L2 cache z Voice encoding/decoding complying with multiple z 800 MHz A7 core, supporting 32 KB I-cache, 32 KB D- protocols by using software cache, and 128 KB L2 cache z MP3 or AAC audio encoding format z Neon acceleration, integrated FPU z Audio 3A functions (AEC, ANR, and ALC) z Linux+Huawei LiteOS dual-system heterogeneous architecture Security Engine z AES, DES, and 3DES encryption and decryption Video Encoding algorithms implemented by using hardware z H.264 BP/MP/HP z RSA1024/2048/4096 signature verification algorithm z H.265 Main Profile implemented by using hardware z I/P/B frame H.264/H.265 encoding, supporting the dual-P- z Hash-SHA1/256 and HMAC_SHA1/256 tamper proofing frame reference mode algorithms implemented by using hardware z MJPEG/JPEG Baseline encoding z Integrated 512-bit OTP storage space and hardware Video Encoding Performance random number generator z Maximum 16-megapixel (4608 x 3456) resolution for Video Interfaces H.264/H.265 encoding z VI Interfaces z H.264/H.265 multi-stream real-time encoding capability − Two sensor inputs. The maximum resolution for the of 4K@30 fps+1080p@30 fps+4K@2 fps snapshot main channel is 16 megapixels (4608 x 3456), and the z Maximum 16-megapixel@15 fps JPEG snapshot maximum resolution for the second input is 8 performance megapixels (4096 x 2160). z 2 kbit/s to 100 Mbit/s CBR or VBR control − 8-/10-/12-/14-bit RGB Bayer DC timing VI, at most z Encoding frame rate ranging from 1 fps to 240 fps 150 MHz clock frequency z Encoding of eight ROIs − BT.601, BT.656, and BT.1120 VI interfaces Intelligent Video Analysis − Maximum 12-lane MIPI/LVDS/sub-LVDS/HiSPi z Integrated intelligent analysis acceleration engine, which interface for the main channel allows customers to develop intelligent applications − Maximum 4-lane MIPI/LVDS/sub-LVDS/HiSPi targeted for the mobile camera product, such as optical interface for the second sensor interface flow hovering and target tracking − Compatibility with mainstream HD CMOS sensors Video and Graphics Processing provided by Sony, Aptina, OmniVision, and Panasonic − Compatibility with the electrical specifications of z 3DNR, image enhancement, and DCI parallel and differential interfaces of various sensors z Anti-flicker for output videos and graphics − Programmable sensor clock output z 1/30x to 16x video scaling z VO interfaces z Horizontal seamless stitching of 2-channel videos − One PAL/NTSC output for automatic load detection z 1/2x to 2x graphics scaling − One BT.1120/BT.656 VO interface for connecting to z OSD overlaying of eight regions before encoding an external HDMI or SDI, 1080p@60 fps output at z Video graphics overlaying of two layers (video layer and most graphics layer) − LCD output ISP Audio Interfaces z 2-channel independent ISP processing z Integrated audio codec supporting 16-bit audio inputs and z Adjustable 3A functions (AE, AWB, and AF) outputs z FPN removal z I2S interface for connecting to the external audio codec z Highlight suppression, backlight compensation, gamma z Dual-channel differential MIC inputs for reducing correction, and color enhancement background noises z DPC, NR, and DIS z Anti-fog Peripheral Interfaces z LDC and fisheye correction z POR z Picture rotation by 90° or 270° z External reset input z Picture mirror and flip z Internal RTC z Sensor built-in WDR, 4F/3F/2F frame-based/line-based z Integrated 3-channel LSADC WDR, and local tone mapping. The second channel of ISP z Five UART interfaces HiSilicon Proprietary and Confidential Issue 01 (2016-07-29) 4 Copyright © HiSilicon Technologies Co., Ltd. Hi3559 V100 Hi3559 V100 Professional 2K/4K Mobile Camera SoC z IR interface, I2C interface, SSP master interface, and − 4-/8-/24-/40-/64-bit ECC GPIO interface − Components with 8 GB or larger capacity z Eight PWM interfaces (four independent interfaces and z Booting from the SPI NOR flash, SPI NAND flash, or four ones multiplexed with other pins) NAND flash z Two SD 3.0/SDIO 3.0 interfaces, supporting SDXC z Booting from an eMMC or PCIe z One USB 3.0/USB 2.0 host/device port SDK z One PCIe 2.0 interface in master/slave mode z Dedicated SDK for the consumer mobile camera External Memory Interfaces z High-performance H.265 iOS/Android decoding library z DDR4/DDR3/DDR3L/LPDDR3 interface Physical Specifications − 32-bit LPDDR3 z Power consumption − 32-bit DDR4/DDR3/DDR3L − Typical power consumption of 1.25 W − Maximum capacity of 1024 MB for a 16-bit DDR − Multi-level power saving mode SDRAM z Operating voltages − Maximum total capacity of 2048 MB for two 16-bit − 0.9 V core voltage DDR SDRAMs − 3.3 V I/O voltage and 3.8 V margin voltage z SPI NOR flash interface − 1.2 V, 1.5 V, 1.35 V, and 1.2 V voltage for the DDR4, − 1-/2-/4-line mode DDR3, DDR3L, and LPDDR3 SDRAM interface, − 3-byte or 4-byte address mode respectively − Maximum capacity of 32 MB z Package z SPI NAND flash interface − RoHS, FC-CSP − Maximum capacity of 512 MB − Body size of 10 mm x 10 mm (0.39 in. x 0.39 in.) z eMMC 5.0 interface − Lead pitch of 0.4 mm (0.02 in.) − Maximum capacity of 2 TB z NAND flash interface − 8-bit data width − SLC or MLC Functional Block Diagram ARM subsystem Image subsystem 32-bit CVBS/ DDR4/DDR3 DDRC TDE+IVE /DDR3L/ Cortex A17 Cortex A7 BT.1120/ LPDDR3 @1.25 GHz @800 MHz VPSS+VGS+ LCD GDC MIPI/ ISP LVDS/ SDHC/XC SDIO 3.0 x2 (3A\WDR) HiSPi SPI NOR/ Flash I/F NAND flash AMBA 3.0 bus NAND I/F NAND flash RTC I2Cx4 Video subsystem H.264 BP/MP/HP SSPx4 USB 2.0/3.0 USB 2.0/3.0 H.265 MP host/device MJPEG/JPEG encoder GPIOs 1xLane PCIe 2.0 IR PCIe 2.0 AES/DES/3DES RSA/HASH/TRNG UARTx5 Audio I2S OTP codec PWMx8 LSADCx3 Hi3559 V100 HiSilicon Proprietary and Confidential Issue 01 (2016-07-29) 5 Copyright © HiSilicon Technologies Co., Ltd. Hi3559 V100 Hi3559 V100 Professional 2K/4K Mobile Camera SoC Hi3559 V100 Motion Camera and Professional Camera Solution NAND DDR@32 bits SPI flash Screen z Supports 6-DoF flash 4K@30 fps video DIS in the gyro auxiliary DDR4/LPDDR3 SPI NAND information. CMOS RGB/LCD ISP0 z Supports HDR sensor BT.1120 HDMI photographing. z Supports RAW video Hi3559 V100 output. SDIO 3.0 Wi-Fi z Support low-power Audio codec LPDDR3 and DDR4.