E L Hybrid Systems for August 2014 E 26 PRINT Organic and Printed Electronics CTR by Klaus Hecker Piezoelectric, Pyroelectric, 32 and Ferroelectric Materials ONIC for Printed Electronics by Josh Goldberg E D Conductive Ink Market: 44 Photovoltaic and Touch Screen Sectors by Dr. Khasha Ghaffarzadeh S Printed Electronics 2014: World Standardization Effort Growing Opportunities for Collaboration by Marc Carter, page 12 August 2014 • The PCB Magazine 1 IPC echSummit October 28–30, 2014 • Raleigh, North Carolina Combining three events into one, IPC TechSummit focuses on innovation, reliability and leadership — three cornerstones of successful business in today’s electronics marketplace. Running parallel conferences, this world-class event will provide critical knowledge that you need to solve today’s challenges and prepare for the future. Select from sessions in one conference or from all three. Innovation Electronic System Technologies Conference Reliability 8th International Symposium on Tin Whiskers Leadership Executive Management Sessions Mark your calendar now to join your colleagues for this one-of-a-kind learning and networking event. www.ipc.org/TechSummit Printed Electronics AUGUST What is the story with printed electronics? Where have they been and where are they going? Most F importantly, how are they being used in today’s EATURED CONTENT EATURED market? These questions and more are addressed by this month’s feature contributors from IPC, OE-A, and more. 12 Printed Electronics 2014: 32 Piezoelectric, Pyroelectric, and World Standarization Effort— Ferroelectric Materials for Growing Opportunities for Printed Electronics Collaboration by Josh Goldberg by Marc Carter 26 Hybrid Systems for Organic and Printed Electronics by Klaus Hecker FEATURE SHORT 44 Conductive Ink Market: Photovoltaic and Touch Screen Sectors by Dr. Khasha Ghaffarzadeh 4 The PCB Magazine • August 2014 ELECTRONICS AUGUST 2014 PRINTED CONTENTS VOLUME 4 NUMBER 8 THE DEFINITIVE INTERACTIVE MAGAZINE DEDICATED TO THE GLOBAL PCB INDUSTRY thepcbmagazine.com COLUMNS VIDEO INTERVIEWS 8 Bits and Pieces 46 Sunstone’s New Initiatives by Ray Rasmussen PANEL DISCUSSION FEATURE VIDEO 50 Controlling the ENIG Process for 53 Printed Electronics Discussion Optimum Efficiency and Performance by Michael Carano SHORTS 11 The Passing of an Industry Icon: Dieter Bergman 24 Cheap, Flexible Printed Cameras from Graphene 56 Pressure in Hot Roll Lamination of Dry Film Photoresist NEWS HIGHLIGHTS by Karl Dietz 42 Markets 48 Mil/Aero007 EXTRAS 62 Events Calendar 54 Supplier/New Product 63 Advertisers Index & Masthead 60 Top Ten PCB007 News Highlights 6 The PCB Magazine • August 2014 THE WAY I SEE IT FEATURE FEATURE C OLU Bits and Pieces by Ray Rasmussen M I-CONNECT007 N N The PCB Dream So, if you were starting a PCB facility from I had a recent discussion with a board fabri- scratch, how would you build it? I know that cator about the expansion of his business. The many of you out there can see what’s happen- company was looking into the possibility of ing and what’s possible with the newer systems buying an existing facility and asked that I keep that are now available. I’d love to see your plan them informed if I came across any companies for the PCB factory of the future. Please send that were interested in selling. My first thought me your thoughts. I’ll share them with the rest was that these guys know how to run a business; of the readers. Let’s see what’s doable, today. they’ll do well with a good, strategic acquisition. Watch for my article this fall that describes a Then, after thinking about it a bit, I changed new factory currently taking shape, one that is my mind. Why buy someone else’s obsolete fac- adopting all of the latest technologies in order to tory with all of its environmental baggage? You become the PCB factory of the future. might buy a business for a strong customer base PE, 3D PCB Machine or if you were looking I’ve been really in- for a new capability, but trigued by the marriage it would have to be re- of printed electronics ally compelling. Instead, and 3D printing. After build something new. intently watching the What if you could emergence of printed put together a new, state- electronics over the last of-the-art, highly auto- 5–10 years, I can clearly mated factory without see the intersection be- waste treatment (no air tween the PCB and PE or water)? I have the op- industries. And now, portunity to visit such a factory being built right with the rapid advancement of 3D printing, here in the U.S. by an OEM that is making the we’re starting to see applications for full-blown necessary investments. PCBs. Considering the cost associated with prov- Think about it: Increasingly better CAD and ing out a PCB design, offering up PCB proto CAM software makes going from design to direct machines seems like the logical first market for imaging more of a reality. If you fully investigat- these systems. With a market PCB protos alone ed a one-off panel production flow, just in time, to be in the billions of dollars, with thousands of along with a system like Mutracx which guaran- potential systems, it must look quite attractive tees panel quality, you could flow from design to those building these systems. It’s not just the through etch without a pause. I imagine a PCB cost of the PCB; it’s the value of the time as well. factory looking more like a PCB assembly line, Taking a couple of days or weeks out of the prod- with long columns of equipment moving prod- uct development cycle is worth a lot more than uct through the factory. I believe everything is the PCB. With that in mind, we see the introduc- available to take a board from one end to the tion of a few new entries to the market. other in a smooth flow, without too many stops. Recently, we posted this article on pcb007. And if we just invested a bit more in those areas com: FirePick Delta 3D: One Step Closer to where product stops, we could build a PCB from Desktop Electronics Manufacturing. The sys- end to end, quickly and efficiently. tem described in the article is quite interesting 8 The PCB Magazine • August 2014 Electronics Final Finishing PallaBond – Direct pure EP and EPAG for Soldering, Au- and Cu-Wire Bonding PallaBond Process Cleaner PallaBond CLN Microetch PallaBond ME Cu wire 20 µm Pre Dip (Heraeus Maxsoft PallaBond PREDIP Cu wire copper) on pure Activator EP finish view PallaBond ACT from top E’less Pd Bath PallaBond PD Features and Benefit Optional for EPAG: E’Less AU ▪ Environmentally friendly process PallaBond AU ▪ Finish thickness < 0.3 μm allowing very fin lines and spaces (e.g. L/S 10 µm). PallaBond – Fine Line Capability ▪ Very good wire bonding capability with Al, Au, Ag, Cu and Cu-Pd wires PallaBond ▪ Suitable for eutectic and Pb free soldering 29.6 µm 0.15 µm Pd ▪ Suitable for high frequency applications 30 µm Optional ▪ Suitable for key press application 0.1 µm Au ▪ Good solder joint reliability ▪ Low energy and water consumption com- ENIG pared to ENIG, ENEPIG and immersion Sn ▪ Excellent compatibility with basematerials and 15.9 µm 7 µm Ni soldermasks because of very mild process 0.10 µm Au 30 µm conditions Recommended Thickness: ENEPIG Ni Pd Au 7 µm Ni [µm] [µm] [µm] 15.5 µm 0.15 µm Pd PallaBond EP - 0.15 - 30 µm 0.10 µm Au PallaBond EPAG 0.1- 0.1 Atotech Main Offic · P.O. Box 21 07 80 · 10507 Berlin · Germany Tel.: +49 30 - 349 85-0 · Fax:+49 30 - 349 85-777 · www.atotech.com BITS AND PIECES continues and gives us a glimpse of where this is heading. jumped into the fray: “The Internet of Things Here’s a quote: represents a vast landscape of amazing potential; This machine is capable of doing two of the we are just now beginning to grasp how truly most important and difficult tasks in the process far the growing convergence of many tradition- of assembling working electronic devices. While ally standalone applications and cyber-physical it’s not quite to the point of simply being able systems can take us,” said Oleg Logvinov, IEEE to press a button and have it print out an entire committee chair who is director, special assign- working device on its own, it certainly shows us ments, Industrial and Power Conversion Divi- how close we are to one day having a machine sion, STMicroelectronics. that will print and assemble working electronic To read more about IEEE’s efforts, click here. devices at the touch of a button. I wouldn’t say I’m mesmerized by all these In another recently posted article, Advan- new and emerging technologies and industries, tech Launches Printing Tech for Microelectronic but I am certainly intrigued. I am quite hope- Industry, we find this quote: Features and devic- ful that our industries will embrace some of the es below 5 µm are typically the realm of Chips/ newer manufacturing technologies as well as the VLSI. Features above 30 µm are the realm of tra- emerging ones and incorporate them into their ditional printed circuit and device technologies. offerings as soon as is applicable. I hope the in- The manufacturing processes of these two worlds dustry will not be blindsided by what’s coming, have rarely intersected. Advantech US has devel- but will instead seize the opportunities they of- oped a printing process that allows these worlds fer. That’s why we cover this the way we do.