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Copyright © 2004, Intel Corporation 2 ULV Intel® Celeron® M Processor at 600 MHz Thermal Design Guide Contents Contents 1.0 Introduction ...............................................................................................................................7 1.1 Document Goals ...................................................................................................................7 1.2 Document Scope ..................................................................................................................7 1.3 Related Documents ..............................................................................................................7 1.4 Definition of Terms................................................................................................................8 2.0 Mechanical Guidelines ..........................................................................................................9 2.1 Processor Package...............................................................................................................9 2.2 Thermal Solution Volumetric Constraint Zones ....................................................................9 3.0 Thermal Design Guidelines ...............................................................................................11 3.1 Heatsink Design Considerations.........................................................................................11 3.1.1 Heatsink Size.........................................................................................................12 3.1.2 Heatsink Weight.....................................................................................................12 3.1.3 Thermal Interface Material.....................................................................................12 3.2 Natural Convection Cooling Considerations .......................................................................13 3.2.1 Local Ambient Temperature (TLA) .........................................................................13 3.2.2 Thermal Resistance of a Heatsink.........................................................................14 3.2.3 Component Placement, System Orientation and Venting......................................18 3.2.4 ULV Intel® Celeron® M Processor at 600 MHz Thermal Specifications ................18 3.3 Processor Power ................................................................................................................19 3.4 Thermal Diode ....................................................................................................................19 3.5 Thermal Monitor..................................................................................................................19 3.6 Power Density and Non-uniform Heating ...........................................................................21 3.7 Processor Thermal Solutions..............................................................................................21 3.7.1 Mini-ITX Form Factor Reference Solution .............................................................21 3.7.2 Vertical Compute Blade Thermal Solution.............................................................24 3.7.3 Additional Heatsink Designs ..................................................................................25 3.7.4 Recommended Thermal Interface Material (TIM)..................................................25 4.0 Vendor Contact Information..............................................................................................27 A Mechanical Drawings...........................................................................................................29 ULV Intel® Celeron® M Processor at 600 MHz Thermal Design Guide 3 Contents Figures 1 Top and Bottom Isometric Views of the Micro-FCBGA Package ................................................. 9 2 Typical Mechanical Stackup .......................................................................................................10 3 Local Ambient Temperature Location.........................................................................................14 ® ® Ψ 4 ULV Intel Celeron M Processor at 600 MHz Natural Convection JA Feasibility................... 16 5 Required Thermal Solution as Various Ambient Temperature Increases .................................. 17 6 Mini-ITX Thermal Model .............................................................................................................22 7 Sample Attachment Method .......................................................................................................23 8 Vertical Compute Blade Thermal Model..................................................................................... 24 9 Mini-ITX Volumetric Constraint Zone (Primary Side)..................................................................30 10 Vertical Compute Blade Volumetric Constraint Zone (Primary Side) ......................................... 31 11 Natural Convection Heatsink Volumetric Constraint Zone (Secondary Side)............................. 32 12 Mini-ITX Reference Thermal Solution (Extruded Aluminum)......................................................33 13 Vertical Compute Blade Thermal Solution..................................................................................34 Tables 1 Document References.................................................................................................................. 7 2 Definitions of Terms...................................................................................................................... 8 3 Processor Thermal Specifications