Integrated Systems Engineering ISE Development, Modeling, and Optimization of Microelectronic TCAD Processes, Devices, Circuits, and Systems ISE TCAD 9.0 Release Notes Contents 1 General information ................................................................................................1 1.1 Compatibility with previous versions........................................................................... 1 1.2 Technical documentation with no release notes......................................................... 1 1.3 Discontinued tools ...................................................................................................... 1 2 GENERIC................................................................................................................1 2.1 Tool version options ................................................................................................... 1 2.2 Diagnostic options ...................................................................................................... 1 2.3 Platform-specific options ............................................................................................ 2 3 DESSIS...................................................................................................................2 3.1 New features .............................................................................................................. 2 3.1.1 Random dopant fluctuations............................................................................. 2 3.1.2 Ferroelectric material........................................................................................ 2 3.1.3 User-defined dopants ....................................................................................... 2 3.1.4 New linear solver: UMFPACK .......................................................................... 3 3.1.5 Anisotropy......................................................................................................... 3 3.1.6 Doping-dependent contact resistivity................................................................ 3 3.1.7 Parameter file printing ...................................................................................... 3 3.1.8 Experimental tunneling mobility........................................................................ 3 3.1.9 Strained-Si simulation....................................................................................... 3 3.1.10 Light-emitting diodes ...................................................................................... 3 3.1.11 Vertical-cavity surface-emitting lasers ............................................................ 3 3.1.12 Edge-emitting lasers....................................................................................... 4 3.1.13 Optical solvers................................................................................................ 4 3.1.14 Polarization-dependent optical matrix ............................................................ 4 3.1.15 Two-dimensional far field................................................................................ 4 3.1.16 Input and output of vectorial optical fields ...................................................... 4 3.1.17 EMLAB grid size............................................................................................. 4 3.1.18 Solution variables ........................................................................................... 4 3.1.19 Heat fluxes...................................................................................................... 4 3.2 Compatibility with previous versions........................................................................... 4 3.3 Fixed bugs .................................................................................................................. 6 4 DEVISE...................................................................................................................6 5 DIOS .......................................................................................................................7 5.1 Fixed bugs .................................................................................................................. 7 6 FLOOPS .................................................................................................................7 7 GENESISe ..............................................................................................................8 7.1 Differences between new and classic GENESISe...................................................... 8 7.1.1 Graphical user interface ................................................................................... 8 7.1.2 Multiple tool instances ...................................................................................... 8 7.1.3 Scenarios.......................................................................................................... 8 7.1.4 Variables........................................................................................................... 8 7.1.5 Preprocessor enhancements and node expressions ....................................... 8 7.1.6 Scheduler support ............................................................................................ 9 7.1.7 LIGAMENT ....................................................................................................... 9 7.1.8 OptimISE integration ........................................................................................ 9 7.1.9 Batch scripting language .................................................................................. 9 7.1.10 Command-line project cleanup utility: gcleanup ............................................. 9 7.2 New features (compared to GENESISe9 from Release 8.5)...................................... 9 i Contents ISE TCAD 9.0 Release Notes 7.3 Compatibility with previous versions........................................................................... 9 7.4 Fixed bugs ................................................................................................................ 10 8 INSPECT ..............................................................................................................10 8.1 New features............................................................................................................. 10 8.2 Note on PostScript generation.................................................................................. 10 8.3 Loading PLX files...................................................................................................... 10 8.4 Compatibility with previous versions......................................................................... 11 8.5 Fixed bugs ................................................................................................................ 11 9 LIGAMENT ...........................................................................................................11 9.1 LIGAMENT Flow Editor ............................................................................................ 11 9.1.1 New Value Editor and shortcut menu ............................................................. 11 9.1.2 Enhanced manipulation of data ...................................................................... 11 9.1.3 Enhancements to locate macro calls quickly.................................................. 11 9.2 LIGAMENT Translator .............................................................................................. 12 9.2.1 Converting DIOS flow to LIGAMENT flow ...................................................... 12 9.2.2 New and discontinued simulator formats........................................................ 12 9.2.3 Additions to the SPR ...................................................................................... 12 9.2.4 Tcl statements and Tcl scripts in string values ............................................... 12 9.3 LIGAMENT Layout Editor ......................................................................................... 12 9.4 Compatibility with previous versions......................................................................... 12 9.5 Fixed bugs ................................................................................................................ 13 10 MDRAW..............................................................................................................13 10.1 Compatibility with previous versions....................................................................... 13 10.2 Fixed bugs .............................................................................................................. 13 11 MESH .................................................................................................................13 11.1 Compatibility with previous versions....................................................................... 13 11.2 Fixed bugs .............................................................................................................. 13 12 NOFFSET3D ......................................................................................................13 12.1 New features: 2D .................................................................................................... 13 12.1.1 Axis-aligned mesh ........................................................................................ 13 12.1.2 Multiple-connected polygons ........................................................................ 13 12.2 New features: 3D ...................................................................................................