Life Cycle Assessment of the Fairphone 2 Final Report Marina Proske Christian Clemm Nikolai Richter Berlin, November 2016 Contact: Fraunhofer IZM Gustav-Meyer-Allee 25, 13355 Berlin, Germany Phone: +49.30.46403-771 Fax: +49.30.46403-211 Email: [email protected] Please note: The annex is excluded from this public version of the study as it contains confi- dential information. As the actual study text was not changed, several references to the annex are still included. Content Content ................................................................................................................................ 2 List of Tables ....................................................................................................................... 4 List of Figures ..................................................................................................................... 6 Abbreviations ...................................................................................................................... 8 1 Executive Summary ....................................................................................................10 2 Goal and Scope Definition ..........................................................................................13 2.1 Goal .................................................................................................................................... 13 2.2 Scope ................................................................................................................................. 13 3 Life Cycle Inventory ....................................................................................................14 3.1 Raw material acquisition and manufacturing ..................................................................... 14 3.1.1 Core module .......................................................................................................... 16 3.1.2 Top module ............................................................................................................ 16 3.1.3 Camera module ..................................................................................................... 16 3.1.4 Bottom module ....................................................................................................... 17 3.1.5 Display module ...................................................................................................... 17 3.1.6 Battery module ....................................................................................................... 20 3.1.7 Back cover ............................................................................................................. 21 3.1.8 Assembly process .................................................................................................. 21 3.1.9 Cross-module approaches .................................................................................... 21 3.1.10 Packaging ............................................................................................................ 27 3.2 Use phase .......................................................................................................................... 29 3.3 End-of-Life .......................................................................................................................... 30 3.4 Transport ............................................................................................................................ 31 3.4.1 Transport to final assembly ................................................................................... 32 3.4.2 Transport to distribution hub .................................................................................. 32 3.4.3 Transport to customer............................................................................................ 33 4 Impact Assessment ....................................................................................................35 4.1 Definition of impact categories ........................................................................................... 35 4.2 Results ............................................................................................................................... 36 4.3 Contribution Analysis ......................................................................................................... 37 4.3.1 Production .............................................................................................................. 37 4.3.2 Use phase .............................................................................................................. 43 4.3.3 EoL......................................................................................................................... 44 4.3.4 Transport ............................................................................................................... 45 4.3.5 Modularity .............................................................................................................. 50 4.4 Sensitivity Analysis ............................................................................................................ 51 4.4.1 ICs.......................................................................................................................... 51 4.4.2 Display ................................................................................................................... 55 4.4.3 Battery ................................................................................................................... 55 4.5 Interpretation ...................................................................................................................... 56 4.5.1 Comparison with Fairphone 1 LCA ........................................................................ 58 4.5.2 Comparison with other smartphone LCAs ............................................................. 58 5 Scenarios .....................................................................................................................59 2 5.1 Repair Scenario ................................................................................................................. 59 5.1.1 Production .............................................................................................................. 60 5.1.2 Use......................................................................................................................... 61 5.1.3 End-of-Life ............................................................................................................. 61 5.1.4 Transport ............................................................................................................... 61 5.1.5 Results and Interpretation ..................................................................................... 62 5.2 Scenario Housing ............................................................................................................... 63 5.2.1 Results and Interpretation ..................................................................................... 64 6 Conclusions and Recommendations .........................................................................65 6.1 Recommendations ............................................................................................................. 65 7 Literature .....................................................................................................................70 8 Annex ...........................................................................................................................73 8.1 Comparison with Fairphone 1 LCA .................................................................................... 74 8.2 Inventory lists ..................................................................................................................... 76 8.2.1 Core module .......................................................................................................... 77 8.2.2 Mainboard .............................................................................................................. 90 8.2.3 Top module .......................................................................................................... 103 8.2.4 Camera module ................................................................................................... 109 8.2.5 Bottom module ..................................................................................................... 113 8.2.6 Display module .................................................................................................... 119 8.2.7 Battery module ..................................................................................................... 123 8.2.8 Back cover ........................................................................................................... 125 3 List of Tables Table 3-1: Main parts per module .........................................................................................14 Table 3-2: Panel production data by AUO ............................................................................18 Table 3-3: Die area per display area [Deubzer 2012] ...........................................................20 Table 3-4: Mass percentage of the most important cell materials .........................................20 Table 3-5: Material composition of board-to-board connectors (totals) according to material declarations from GSN .........................................................................................................22