Using the Latest EFI Development Kit (EDK II) for UEFI Advanced Development and Innovation Penny Gao - Senior Software Engineer, Intel Ping Ping Han - Senior Software Engineer, IBM Dong Wei - Distinguished Technologist, HP EFIS001 Agenda •UEFI Technical Specifications updates •Using UEFI as an enabling foundation for platform innovation •EFI Developer Kit II (EDK II) Overview •Industry leaders discussing how UEFI is helping them innovate and differentiate their products using EDK II 2 Agenda •UEFI Technical Specifications updates •Using UEFI as an enabling foundation for platform innovation •EFI Developer Kit II (EDK II) Overview •Industry leaders discussing how UEFI is helping them innovate and differentiate their products using EDK II 3 Standard Firmware Interfaces UEFI- • UEFI: Unified Extensible UEFI Option enabled Legacy UEFI Shell ROMs Firmware Interface OS OS – a new model for the interface between the OS Compatibility Compatibility UEFI Driver UEFI Driver UEFI Driver UEFI DXE Driver Support Support Module and platform firmware • • • BDS • PI: Platform Initialization – Standardization: key to interoperability across implementations CPU PEI C/S PEI – Modular components like Modules Modules silicon drivers (e.g. PCI) PlatformInitialization Hardware and value-add drivers PI Modular components (security) – Preferred way to build UEFI UEFI is Architected for Dynamic Modularity 4 Latest UEFI Specifications UEFI- UEFI Option enabled Legacy •Platform Initialization UEFI Shell ROMs OS OS (PI) 1.2 Spec Compatibility Compatibility UEFI Driver UEFI Driver UEFI Driver UEFI DXE Driver •Packaging 1.0 Spec Support Support Module • • • BDS •UEFI 2.3 Spec •Self Certification Tests (SCT) for UEFI 2.1 CPU PEI C/S PEI Modules Modules Spec PlatformInitialization Hardware •Shell 2.0 Spec PI Modular components Advancements in firmware technologies continue to evolve. Join the UEFI forum www.UEFI.org 5 UEFI Specification Timeline http://uefi.org UEFI 2.0 UEFI 2.1 UEFI 2.2 UEFI 2.3 PI 1.0 PI 1.1 PI 1.2 Shell 2.0 Packaging 1.0 Specifications 2006 2007 2008 2009 2010 SCT UEFI SCT UEFI 2.0 2.1 EDK 1.01: EDK 1.04: EDK 1.05: UEFI 2.0 UEFI 2.1 UEFI 2.1+ New PI 1.0 PI 1.0 SCT Implementation EDK II: EDK II: PI 1.0 UEFI 2.1+ UEFI 2.3+ PI 1.0 PI 1.2+ Open Source Leg 6 All products, dates, and programs are based on current expectations and subject to change without notice. Agenda •UEFI Technical Specifications updates •Using UEFI as an enabling foundation for platform innovation •EFI Developer Kit II (EDK II) Overview •Industry leaders discussing how UEFI is helping them innovate and differentiate their products using EDK II 7 Utilize UEFI Full Potential Limited Benefits: Legacy BIOS UEFI CSM1 only Class 0 Class 1 OEMs/ODMs internal Development Optimization & Code Modularity Development Good for Internal Internal for Good UEFI Switch - UEFI Pure I/F Full Benefits: CSM & UEFI I/F UEFI Innovation Class 2 Class 3 Performance Needed for for Needed Extensibility ISVs/End users ISVs/End Advanced Usability Build UEFI Class 2/3 UEFI Systems! 8 1 Compatibility Support Module – Legacy BIOS interface on top of UEFI UEFI Enabling Platform Innovation Modern Firmware for Modern IT • Richer configuration (allows for more adapters) • Graphic User Interface in Pre-boot environment Easier to configure • Remote upgrade capability of specific firmware components and deploy • Solves out of-the-box configuration & provisioning issues • Creates a common infrastructure for managing all machines Makes Computers • Enable secure automated management – lower risks of more manageable “Rogue” servers or clients on the network Network Scalable • Enhanced networking APIs in the pre-boot network stack and Secure • Richer network authentication (log-on) Firmware • UEFI Certificate Authority for interoperable trust • Free from architectural limitation - scales technology across Breaks through all platforms (Server, Desktop, Mobile, and Handheld) BIOS barriers • Access to disk range beyond 2TB – utilization of resources • Option Rom Decongestion 9 Agenda •UEFI Technical Specifications updates •Using UEFI as an enabling foundation for platform innovation •EFI Developer Kit II (EDK II) Overview •Industry leaders discussing how UEFI is helping them innovate and differentiate their products using EDK II 10 Package Philosophy • As standards evolve there is a need to target your development on the set of standards you care about • Solution: break the EDK II up into “packages” and enable customers to make their own packages. Kitchen Sink • Only package together what is needed 11 Libraries - UEFI /PI Execution Phases Pre Exposed Verifier OS-Absent Platform App CPU Interface Init Transient OS Chipset verify Device, Environment Init Bus, or Board Service Driver Transient OS Init Boot Loader EFI Driver Boot OS-Present Dispatcher Manager App Intrinsic Final OS Final OS ? Services Boot Loader Environment security Security Pre EFI Driver Execution Boot Dev Transient Run Time After (SEC) Initialization Environment Select System Load (RT) Life (PEI) (DXE) (BDS) (TSL) (AL) Power on [ . Platform initialization . ] [ . OS boot . ] Shutdown Same lib classes exist across multiple phases 12 Platform Configuration Database Knobs to fine tune your firmware • PCD entries are used for module “parameterization”. • Benefits: – Reduce the need to edit source code – No searching for “magic” #define statements – Maximize module reuse across platforms – APIs for access to PCD entries • PCDs can store platform information – Vital Product Data (VPD) – Serial Number, etc… – Setup options 4 5 6 4 5 6 4 5 6 3 7 3 7 3 7 2 8 2 8 2 8 1 9 1 9 1 9 0 10 0 10 0 10 Maximizes the re-use of modules Minimize Source code editing 13 EDK II Benefits Package Distribution Distribution Description File <DistributionHeader ReadOnly" true" RePackage="false"> <Name BaseName="NosuchChipset"> NosuchChipset</Name> • UEFI Packaging 1.0 <GUID Version="1.2">AF0DDA2E-EA83-480b-B2CE- FC0BB2F894C2</GUID> <Vendor>NosuchCorporation</Vendor> Specification <Date>2008-03-24T09:30:00</Date> <Copyright>Copyright©2008, NosuchCorporation.All rights reserved.</Copyright> Distribution Description Content File Workspace Directory Package File BaseTools\ Conf\ (ZIP, .dist) NoSuchCorpPkg \ Bus \ Pci \ Disttribution PeerBusDxe \ Description File PciBusDxe \ (XML, .pkg) SuperDuperIODxe\ Include \ Common \ Disttribution GUID \ Content File (ZIP, ● ● ● .content) MdePkg \ MdeModulePkg\ EDK II Implementation of UEFI makes everything just WORK!!! 14 Agenda •UEFI Technical Specifications updates •Using UEFI as an enabling foundation for platform innovation •EFI Developer Kit II (EDK II) Overview •Industry leaders discussing how UEFI is helping them innovate and differentiate their products using EDK II 15 Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing ® IBM EDKII Era: EDKII Innovation on System x Servers Ping Ping Han Senior Software Engineer China System & Technology Lab, IBM 16 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing Agenda . IBM’s Role in uEFI . IBM EDK Based System x Servers . Embracing EDKII –What value EDKII adds to development effort –What value EDKII adds to the customer & OEM . IBM Value Add in EDKII . IBM eX5 Launch on EDKII Based Products 17 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing IBM’s Role in UEFI . One of 11 uEFI forum promoters . uEFI in System x Servers – Global Development (4+ time zones) – Raleigh – Austin – Kirkland – Shanghai/Taipei – 2007 kick off – 2009 ship the first product based on EDK – 2010 ship EDKII based System x servers 18 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing Agenda . IBM’s Role in uEFI . IBM EDK Based System x Servers . Embracing EDKII –What value EDKII adds to development effort –What value EDKII adds to the customer & OEM . IBM Value Add in EDKII . IBM eX5 Launch on EDKII Based Products 19 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing EDK Based System x Servers • Comprehensive transition of the System x portfolio to UEFI based firmware • UEFI 2.1 PI 1.0 specification compliant 20 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing Agenda . IBM’s Role in uEFI . IBM EDK Based System x Servers . Embracing EDKII –What value EDKII adds to development effort –What value EDKII adds to the customer & OEM . IBM Value Add in EDKII . IBM eX5 Launch on EDKII Based Products 21 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing EDKII benefits to development effort Package resource Integration effort Developer efficiency . Package can come from . Reduce integration . Improve developer different providers, such effort with package efficiency as TianoCore, IHV etc based release – Much better build time – Dramatically lower – Better/more complete code documentation integration time for Intel code drops ( – Strong/Explicit package structure to support Intel code is mostly isolation and clean touchless in EDKII) Core/Platform model – New features such as PCD, Library class speed up the development 22 © 2010 IBM Corporation Modular and Blade Systems | Intel Developer Forum – April 2010 Beijing EDKII benefits to customers & OEMs More standardized, more features and consistent look & Feel – EDKII core code more strictly follows the UEFI and PI standards. – New features will be more likely to be integrated to the EDKII products such as IPv6 etc