Who Invented the Integrated Circuit? Gene Freeman IEEE Pikes Peak Region Life Member May 2020 Gene Freeman May 2020 Kilby and Noyce Photos (Kilby, TI Noyce, Intel) Gene Freeman May 2020 Commemorative Microchip Stamp Image: Computer- Stamps.com Gene Freeman May 2020 Motivation Gene Freeman May 2020 Trav-ler 4 Tube Tabletop AM Radio around 1949 Gene Freeman May 2020 Discrete passives and point to point wiring Gene Freeman May 2020 •Computers •Space vehicles Motivators •Decrease power, space, cost •Increase reliability Gene Freeman May 2020 • In an article celebrating the tenth anniversary of the invention of the computer, J. A. Morton, A Vice President of Bell Labs wrote in Proceedings of the IRE in 1958: • “For some time now, electronic man has known how 'in principle' to extend greatly his visual, tactile, and mental abilities through the digital transmission and Tyranny of processing of all kinds of information. However, all these functions suffer from what has been called Numbers 'the tyranny of numbers.' Such systems, because of their complex digital nature, require hundreds, thousands, and sometimes tens of thousands of electron devices. Each element must be made, tested, packed, shipped, unpacked, retested, and interconnected one-at-a-time to produce a whole system.” Gene Freeman May 2020 •Active Components: Vacuum Tubes to transistors Solution •Passive Components: Discrete elements to integrated form •Wires to integrated wires Gene Freeman May 2020 Key Companies in the Story 1925 1956 1968 Bell Labs – Western Electric and AT&T Shockley Semiconductor Laboratory – Intel- Formed 1968 consolidate research activities of Bell Started by William Shockley in 1956 By Robert Noyce and Gordon Moore System. William Shockley, John Bardeen (Division of Beckman Instruments). and Walter Brattain invented the Never recovered from Traitorous 8 transistor here December 23, 1947 leaving. Sold to ITT in 1968 then closed. Texas Instruments- Founded 1930 as Geophysical Service Incorporated. Fairchild Semiconductor – Formed 1957– Became Texas Instruments in 1951. Led to creation of Intel and AMD 1930 1957 Gene Freeman May 2020 • Gordon Moore (Moore’s Law) Intel Co- Founder • Sheldon Roberts • Eugene Kleiner, founder of Kleiner Perkins • Robert Noyce, Co founded Fairchild Traitorous Semiconductor 1957 and Intel 1968 eight • Victor Grinich • Julius Blank • Jean Hoerni, developed the Planar Process, key for Xistors and ICs • Jay Last Gene Freeman May 2020 Shockley and the Transistor Gene Freeman May 2020 Transistor Timeline 1947 1951 1948 Bardeen and Junction 1954 Brattain File Shockley Transistor Point Contact files junction Patent TI first Transistor Transistor Granted commercial Patent June Patent June 09/25/1951U silicon Xistor 17 26, 1948 S 2,569,347 TI900 series 1948 1950 1951 1956 Bardeen, Shockley Brattain Bell Labs Nobel Prize Junction Point Contact M1752: Physics Transistor Germanium Transistor – Concept, Transistor Patent Grant NPN Grown Shockley, 01/23/1948 Junction Bardeen, (1951) Brattain Gene Freeman May 2020 Gene Freeman May 2020 Source: Slideshare.net Source: thebronxchronicle.com Gene Freeman May 2020 The Integrated Circuit Gene Freeman May 2020 Integrated Circuit Invention Grant Kilby 6/23/1964 US 1952 Concept Patent No. - Drummer 3,138,743 “Wireless 1959 Noyce Miniaturized Electrical Monolithic Noyce files Electronic Circuits” Idea, 1/1959 7/30/1959 Circuits 1958 Kilby Kilby files Grant Noyce Monolithic 2/6/1959 4/25/1961: US Idea, Patent No. 07/24/1958 2,981,877 Semiconductor Device and Lead Structure Gene Freeman May 2020 • Jack Morton, head of transistor manufacturing at Bell Telephone Laboratories, described an early conception of such a Earliest circuit. In a 1949 internal report he noted: “Imagine a technique in which…the Reference to connecting leads and passive elements are IC Challenge ‘printed’ in one continuous fabrication process. …We do not know the technology of doing these things… Here then is the challenge.” Gene Freeman May 2020 Drummer – Wireless Electrical Circuits Gene Freeman May 2020 • Ran a testing group at the Telecommunications Research Establishment at Malvern, England • “Wireless”: meant not a radio but electrical circuits free of connecting wires and soldered joints Geoffrey • May 1952. At the Symposium on Progress in Quality Electronic Components, held in Washington DC he Drummer – said: • ‘It seems now possible to envisage electronic Wireless equipment in a solid block with no connecting wires. The block may consist of layers of insulating, Electrical conducting, rectifying, and amplifying materials, the Circuits electrical functions being connected directly by cutting out areas of the various layers" • Drummer failed to get financing from his government for the work to implement the idea. Gene Freeman May 2020 Kilby and Texas Instruments Gene Freeman May 2020 Jack Kilby Timeline Born 1923 1958 1969 1967 2000 1947 to Went National In st Nobel 1958 to TI 1 Medal Handheld Prize in Jefferson Centralab for of Calculator Physics City, Scale Science MO 1950 BSEE 1978 to 1947 1952 Feb 1984 EE 1982 2005 Attended 1959 National U of I, Professor Bell Labs Filed at Inventors Death seminar from MS IC Texas Hall of on Xistors Patent Fame Cancer U of A and M W 1950 Gene Freeman May 2020 Original Kilby Circuit Gene Freeman May 2020 Source: cnet.com Patent Drawing of Phase Shift Oscillator Gene Freeman May 2020 • Integration and Interconnection • Integration – All parts of the circuit could be made from the same material • Interconnection – wires could be printed Jack Kilby onto the chip as part of the production Invention process. • For the proof of concept Kilby integrated all Path the circuit components but didn’t have time to work out the interconnection so he connected the parts of the chip by hand with gold wires which was not a large scale production solution Gene Freeman May 2020 • Worrying RCA was going to apply for a patent , they needed a picture of the interconnection solution. Lacking a model they used the demo chip (the “flying wire”) picture. • Although the invention has been shown and Filing on described in terms of specific embodiments, it will be evident that changes and modification are February 6, possible which do not in fact depart from the 1959 inventive concepts taught herein. • “ connections may be provided in other ways. For example… silicon oxide may be evaporated on the semiconductor circuit wafer…. Material such as gold may then be laid down on the [oxide] to make the necessary electrical connections.” Gene Freeman May 2020 Multivibrator Circuit from 3,138,743 Kilby Gene Freeman May 2020 Noyce and Fairchild Semiconductor Gene Freeman May 2020 From intel . com Gene Freeman May 2020 • Noyce had recognized the possibility of printing connecting strips of metal on a chip • This was made possible by Jean Hoerni’s invention of the planar process (filed May 1, 1959), this led Robert him to the idea of integration. • Spring of 1959 Fairchild engaged in working out Noyce details of the planar process so Noyce had a Invention description and drawing of a chip with the interconnections built right in. Path • 1st part of the application was interconnections • Leads could be deposited at the same time and in the same manner as the components themselves. • There were no wires in the pictures…. Gene Freeman May 2020 Photomicrograph of Model 2N1613 planar transistor Source: spectrum.ieee.org Gene Freeman May 2020 Noyce’s First Chip Source: chiphistory.org Gene Freeman May 2020 Gene May Freeman Semiconductor Device and Lead Structure – Noyce – Filed July 30, 1959 Gene Freeman May 2020 Patent Battle Gene Freeman May 2020 Legal Battle Timeline 2/24/1967 11/7/ 1970 5/1962 10/1964 TI Rebutts Supreme Board of Fairchild and Board Court Patent attacks rules in Interference “Flying Kilby’s favor denies a Opens Case Wire” and hearing Kilby vs Laid Down vs Noyce Adherent to 7/28/1964 Summer 11/6/1969 Kilby 1966 TI and Appeals Testifies with Fairchild Court Idea and meet and Reverses Filing Date cut a cross again in license deal favor of Noyce Gene Freeman May 2020 • Connections may be provided in other ways (gold wires thermally bonded was the primary example) • …silicon oxide may be evaporated on the Kilby semiconductor circuit wafer through a mask. • … to cover the wafer completely except at Interconnect the points where electrical contact is to be Description made • …Electrically conducting material such as gold may then be laid down on the insulating material to make the necessary electrical circuit connections. Gene Freeman May 2020 • In brief, the present invention utilizes • Dished junctions extending to the surface of the body of extrinsic semiconductor • Insulating surface layer consisting essentially of Noyce oxide of the same semiconductor extending Interconnect across the junctions • Leads in the form of vacuum-deposited or Description otherwise formed metal strips extending over and adherent to the insulating oxide layer for making electrical connections to and between various region of the semiconductor body without shorting the junctions Gene Freeman May 2020 Legal Battle Timeline 2/24/1967 11/7/ 1970 5/1962 10/1964 TI Rebutts Supreme Board of Fairchild and Board Court Patent attacks rules in Interference “Flying Kilby’s favor denies a Opens Case Wire” and hearing Kilby vs Laid Down vs Noyce Adherent to 7/28/1964 Summer 11/6/1969 Kilby 1966 TI and Appeals Testifies with Fairchild Court Idea and meet and Reverses Filing Date cut a cross again in license deal favor of Noyce Gene Freeman May 2020 • US Supreme Court Kilby was denied. 10 years and 10 months after Kilby applied for his patent , Noyce won…. however… • In the 10 years while the case was litigated, IC s were recognized as the most important new product in the history of electronics. By the time the courts resolved Resolution of the issue ICs were a multi-billion dollar industry. • Summer of 1966 a deal was cut.