Electronic Costing & Technology Experts Power electronics – MEMS & Sensors – LED & Optoelectronics – Advanced Packaging – System ADVANCED RF PACKAGING TECHNOLOGY TRENDS ON THE WAY TO 5G AND MMWAVE APPLICATIONS Advanced Packaging & System Integration Technology Symposium Apr. 22-23, 2019 Shanghai, China Romain Fraux CEO – System Plus Consulting 6 COMPANIES TO SERVE YOUR BUSINESS Yole Group of Companies Market, technology and strategy Manufacturing costs analysis IP analysis consulting Teardown and reverse engineering Patent assessment Cost simulation tools www.yole.fr www.systemplus.fr www.knowmade.fr Design and characterization of innovative optical systems Innovation and business maker Due diligence www.bmorpho.com www.piseo.fr www.yole.fr Advanced Packaging & System Integration Technology Symposium, April 23, 2019 2 OUR GLOBAL ACTIVITY Europe office Frankfurt Paris Nantes Yole Korea Yole Inc. HQ in Lyon Seoul Phoenix Vénissieux Yole Japan Tokyo Nice Greater Palo Alto China office 40% Hsinchu of our business 30% 30% of our business of our business Advanced Packaging & System Integration Technology Symposium, April 23, 2019 3 BUSINESS MODEL Reverse Costing Teardown + Cost Analysis Customer Catalog Specific Costing Tools Training Advanced Packaging & System Integration Technology Symposium, April 23, 2019 4 FIELDS OF EXPERTISE UV LED Lamp White/Blue Discrete Module Compound (GaN, SiC) Power RF Pressure Sensor Gyro/Accelero Automotive IMU/Combo Consumer Oscillators/Compass Energy Environment Medical Gas Sensor Telecom Fingerprint Microphone Light/Optic WLP/PLP SiP Embedded 3D Packaging/TSV Infrared Visible Advanced Packaging & System Integration Technology Symposium, April 23, 2019 5 OUTLINE ❑ Introduction ❑ Advanced RF Packaging Technology ▪ Market Supply Chain ▪ Market Forecast ▪ Packaging Technology Review ❑ Packaging toward 5G ▪ mmWave Application: Early glimpse of Future Packaging? Advanced Packaging & System Integration Technology Symposium, April 23, 2019 6 RF MOBILE COMMUNICATION ARCHITECTURE Advanced Packaging & System Integration Technology Symposium, April 23, 2019 7 RF MOBILE COMMUNICATION ARCHITECTURE ❑ From 3G to 4G: Architecture Evolution ▪ Samsung Galaxy Series: Front-End Case Study Samsung Galaxy SIII Block Diagram (2012) Samsung Galaxy S9+ Block Diagram (2018) Advanced Packaging & System Integration Technology Symposium, April 23, 2019 8 ADVANCED PACKAGING PLATFORM Increased functionality, performance… Integration:2D 3D Leadframes w/o IC substrates IC substrates-based Interposer based Flip Chip BGA 3DIC QFN Fan-in Fan-out W/B BGA (Si, Glass, Org) SiP X Package Substrate (organic) Embedded die (in substrate or PCB PCB) (organic board) Bumping, Pillars, Studs, Through-silicon-via, Bump-less, Embedded Technologies... Interconnect: Advanced Packaging & System Integration Technology Symposium, April 23, 2019 9 Advanced RF Packaging Technology ▪ Market Supply Chain & Forecast ▪ Packaging Technology Review Advanced Packaging & System Integration Technology Symposium, April 23, 2019 10 MARKET SUPPLY CHAIN Advanced Packaging & System Integration Technology Symposium, April 23, 2019 11 5G MARKET PLAYER Advanced Packaging & System Integration Technology Symposium, April 23, 2019 12 RF MARKET FORECAST ❑ 5G Activity Market Forecast with Qualcomm entry ▪ Qualcomm example will show the way to competitors 5G mmWave Entry 5G Sub-6 Entry 2017 2018e 2019e 2020e 2021e 2022e 2023e Advanced Packaging & System Integration Technology Symposium, April 23, 2019 13 Advanced RF Packaging Technology ▪ Market Supply Chain & Forecast ▪ RF Packaging Technology Review Advanced Packaging & System Integration Technology Symposium, April 23, 2019 14 RF AREA IN SMARTPHONES ❑ RF Front-End Modules (FEM) ▪ Area of front-end components increased with new frequency bands compatibility ▪ Unused space decreased to keep board area ▪ Better integration at the packaging level → SiP integration Huawei P8 (2015) Huawei Mate 20 (2018) Advanced Packaging & System Integration Technology Symposium, April 23, 2019 15 RF AREA IN SMARTPHONES ❑ RF Front-End Modules (FEM) ▪ Area of front-end components increased with new frequency bands compatibility ▪ Unused space decreased to keep board area ▪ Better integration at the packaging level → SiP integration iPhone 5 (2012) iPhone X (2017) Advanced Packaging & System Integration Technology Symposium, April 23, 2019 16 RF SiP WITH ENHANCED SHIELDING ❑ RF Front-End Modules (FEM) ▪ Shielding 4 Au Wire Bonding EMI Shielding by Wire Bonding revealed by 38 Pd coated Cu Wire Bonding Laser Etching and SiP metalized EMI Shielding by Wire Bonding grounded on the PCB or by contact with SiP metalization Advanced Packaging & System Integration Technology Symposium, April 23, 2019 17 RF SiP WITH ENHANCED SHIELDING ❑ RF Front-End Modules (FEM) ▪ Mid/High band LTE SiP integration Integrated Mid/High Band solution Same Filter Nb. IPD Integration +22 % in Area -52 % in I/O Nb. 85 mm² & Only 20 I/O Pins Advanced Packaging & System Integration Technology Symposium, April 23, 2019 18 RF SiP WITH ENHANCED SHIELDING ❑ RF Front-End Modules (FEM) ▪ Mid/High band LTE SiP integration ▪ Broadcom AFEM-8092 Broadcom Mid/High Band LTE SiP Advanced Packaging & System Integration Technology Symposium, April 23, 2019 19 RF SiP WITH ENHANCED SHIELDING ❑ RF Front-End Modules (FEM) Pd Coated Cu Wire Bonding ▪ Mid/High band LTE SiP integration ▪ Broadcom AFEM-8092 ▪ 29 Dies in Flip-Chip ▪ EMI Shielding with Wire Bonding EMI Shielding by Wire Bonding grounded on the PCB or by contact with SiP metallization Broadcom Mid/High Band LTE SiP Advanced Packaging & System Integration Technology Symposium, April 23, 2019 20 RF SiP WITH ENHANCED SHIELDING ❑ RF Front-End Modules (FEM) ▪ Mid/High band LTE SiP integration ▪ Broadcom AFEM-8092 Shielding Wire Bonding Package ▪ 29 Dies in Flip-Chip Shielding ▪ EMI Shielding with Wire Bonding ▪ Package Filter die 9-Layer Coreless Substrate Molding 9-Layer Coreless PCB Substrate Mainboard PCB Broadcom Mid/High Band LTE SiP Cross-Section Advanced Packaging & System Integration Technology Symposium, April 23, 2019 21 RF SIP IN FACE-TO-FACE CONFIGURATION ❑ Diversity Switch Module Adoption ▪Antenna matching IC has the biggest share in the diversity switch and its integration lead to new packaging solution Module Area: 13.3 mm² IPD 6.5 mm² 7 SAW Filter 18.5 mm² Module Area: 18.5 mm² IPD isolated from the SiP IPD represent 30% of the Component area Advanced Packaging & System Integration Technology Symposium, April 23, 2019 22 RF SIP IN FACE-TO-FACE CONFIGURATION ❑ Cost Saving by reducing the PCB area ▪PCB has a non negligible share in the module cost. F2F packaging solution allows almost 10 % of cost saving. 2 Components 1 Component F2F Configuration Module Area: ~37 mm² Module Area: 18.5 mm² Component Cost Breakdown (Medium Yield) Component Cost Breakdown (Medium Yield) SAW Filter Die (x7) Passive Components Substrate SAW Filter Die (x7) Passive Components Substrate Assembly Cost Final Test Cost Yield losses cost Assembly Cost Final Test Cost Yield losses cost 9% 8% 14% 17% 4% 4% 4% -10 % 5% ~$0.7 ~$0.8 16% 42% 28% 49% Advanced Packaging & System Integration Technology Symposium, April 23, 2019 23 HIGHLY INTEGRATED SiP FOR WEARABLE ❑ Apple Watch 2018 2017 2016 2015 xxxxx Advanced Packaging & System Integration Technology Symposium, April 23, 2019 24 HIGHLY INTEGRATED SiP FOR WEARABLE ❑ Apple S4 System in Package ▪ >30 ICs + many passives on one side ➢ Several innovative packaging technologies Skyworks RF SiP TSMC inFO-ePoP Apple S4 System in Package Dialog Double Side Molding Advanced Packaging & System Integration Technology Symposium, April 23, 2019 25 HIGHLY INTEGRATED SiP FOR WEARABLE ❑ Apple S4 System in Package ▪ Specific version for the cellular version Non-Cellular version Cellular version Wireless Charging IC Wireless RFFE Wifi Area Charging Wifi Area Baseband Processor ET Touch Touch Controller Controller PMIC Wireless AP + Memory PMIC Charging AP + Memory Codec Codec Apple S4 System in Package X-Ray Pictures Advanced Packaging & System Integration Technology Symposium, April 23, 2019 26 HIGHLY INTEGRATED SiP FOR WEARABLE ❑ Apple S4 System in Package ▪ Several innovative packaging technologies ➢ ASE SiP – Compartment Shielding and Conformal Shielding Skyworks RF SiP ➢ TSMC inFO-ePoP – AP + DRAM + Flash ➢ Dialog double side molding – PMIC + Passives ➢ Skyworks RF SiP – FEM with double side BGA Dialog Double Side Molding (SPIL) TSMC inFO-ePoP Apple S4 SiP Advanced Packaging & System Integration Technology Symposium, April 23, 2019 27 HIGHLY INTEGRATED SiP FOR WEARABLE ❑ Apple S4 System in Package ▪ Skyworks RF SiP – FEM with double side BGA ➢ SiP with PA, Control IC, Switches, Filters, IPD and passives. ➢ Face-to-Face configuration, an additional switch IC is soldered beneath the PCB substrate ➢ Internal & external shielding Skyworks Low Band RFFE Package Shielding Layer Package Molding Filter Die 6-Layer PCB Substrate Switch die Package Shielding Layer Package Molding Switch die RFIC die IPD die PA die 6-Layer PCB Substrate Skyworks Low Band RFFE Cross-Sections Advanced Packaging & System Integration Technology Symposium, April 23, 2019 28 Packaging toward 5G ▪ mmWave Application: Early glimpse of Future Packaging? Advanced Packaging & System Integration Technology Symposium, April 23, 2019 29 5G SMARPHONES ❑ 5G Smartphones in 2019 ▪ Several 5G smartphones will be released in 2019 from Samsung, Huawei, Xiaomi, Motorola, OnePlus… ▪ Internal development from largest OEM (Samsung, Huawei), most of the other OEMs already