Publication Since 2012 | ISSN: 2321-9939 | ©IJEDR 2020 Year 2020, Volume 8, Issue 2 What is Future Scope of PCB Fabrication & Manufacturing in Industries 1Manish Ranjan, 2Sumit Kumar Singh 1Student, 2Student G L Bajaj Group of Institutions, Mathura _____________________________________________________________________________________________________ Abstract - Printed circuit board (PCB) is base of any electronics/electrical equipment. A PCB provides the connectivity to the electronic component such as resistor, capacitor, coils, pots, diodes, FET, transistor, ICs, transformer etc. to form a complete electronic circuit. In the present scenario, the existence of electronics equipment’s cannot be imagined without a PCB. The PCBs are not only providing the connectivity among the electronic components but also reduces the size and increases the efficiency of the electronic equipment. Broadly the PCBs may be divided in two categories i.e. single layer PCBs and multi-layer PCBs. One can easily find the contribution of electronic industries in each and every field of our daily life i.e. entertainment, communication, education, R&D, Public Services, Defence, Transport, Agriculture, health care services etc. With the growing demand of electronic equipment’s/appliances in every sphere of human beings the electronic industry is growing up with a very fast rate. Similarly, the demand of micro servicing industries such as assembling/mounting of electronic component on PCBs to meet the requirement of the small/medium/large scale electronic industries is also increasing. This Paper Discuss what is the future scope of PCB board fabrication and manufacturing in industries. Our Conclusion show that the PCB manufacturing and fabrication is very fast growth in future. keywords - PCB board, fabrication, manufacturing, PCB design industry segment, future scope, growth rate, _____________________________________________________________________________________________________ 1. Introduction The world market for printed circuit boards (PCBs) reached an estimated $60.2 billion in value in 2014, growing just 0.7 percent in real terms, according to IPC’s World PCB Production Report for the Year 2014. Production growth in China, Thailand and Vietnam compensated for declining PCB production in most other regions..[1] The global printed circuit board (PCB) market was valued at USD 63.1 billion 2017 and is expected to reach USD 76.9 billion by 2024, at a CAGR of 3.1%. Factors driving the growth of the market are; rising adoption of automation in various end-user industries, growing demand for wireless devices, increasing miniaturization of devices, surging need for more efficient interconnect solutions, and increasing demand for flexible circuits. Owing to the implementation of processors and sensors in smart gadgets, the size of the PCB has reduced to 74% approximately.[2] 2. Characteristics 2.1 Through-hole technology The first PCBs used through-hole technology, mounting electronic components by leads inserted through holes on one side of the board and soldered onto copper traces on the other side. Boards may be single-sided, with an unplated component side, or more compact double-sided boards, with components soldered on both sides. Horizontal installation of through-hole parts with two axial leads (such as resistors, capacitors, and diodes) is done by bending the leads 90 degrees in the same direction, inserting the part in the board (often bending leads located on the back of the board in opposite directions to improve the part's mechanical strength), soldering the leads, and trimming off the ends. Leads may be soldered either manually or by a wave soldering machine.[3] Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and it limits the available routing area for signal traces on layers immediately below the top layer on multi-layer boards, since the holes must pass through all layers to the opposite side. Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB. 2.2 Surface-mount technology Surface-mount technology (SMT) is a method in which the electrical components are mounted directly onto the surface of a printed circuit board (PCB). An electrical component mounted in this manner is referred to as a surface-mount device (SMD). In industry, this approach has largely replaced the through-hole technology construction method of fitting components, in large part because SMT allows for increased manufacturing automation. Both technologies can be used on the same board, with the through-hole technology often used for components not suitable for surface mounting such as large transformers and heat-sinked power semiconductors. [4] An SMT component is usually smaller than its through-hole counterpart because it has either smaller leads or no leads at all. It may have short pins or leads of various styles, flat contacts, a matrix of solder balls (BGAs), or terminations on the body of the component. IJEDR2002085 International Journal of Engineering Development and Research (www.ijedr.org) 499 Publication Since 2012 | ISSN: 2321-9939 | ©IJEDR 2020 Year 2020, Volume 8, Issue 2 fig.1(a) Through-hole devices mounted on the circuit board. fig.1(b) Surface-mount Components. 3. PCB Manufacturing Process 3.1 PCB Constituents Printed circuit boards, PCBs, can be made from a variety of substances. The most widely utilized in a sort of optical fibre-based board referred to as FR4. This provides an inexpensive degree of stability under temperature variation and is doesn't breakdown badly, while not being excessively expensive. Other cheaper materials are available for the PCBs in low cost commercial products. For high performance frequency designs where the dielectric constant of the substrate is vital, and low levels of loss are needed, then PTFE based computer circuit boards can be used, although they are far more difficult to work with.[5] In order to make a PCB with tracks for the components, copper clad board is first obtained. This consists of the substrate material, typically FR4, with copper cladding normally on both sides. This copper cladding consists of a thin layer of copper sheet bonded to the board. This bonding is normally very good for FR4, but the very nature of PTFE makes this more difficult, and this adds difficulty to the processing of PTFE PCBs. 3.2 main types of PCB board There are three main types of PCB in current manufactures are • Single-Sided Circuit Boards: These boards when made with a FR4 base have rigid laminate of woven glass epoxy material, which is then covered on one side with a copper coating that is applied in varying thicknesses depending on the application. Fig.2 Single layer PCB Board • Double-Sided Circuit Boards: Double-sided boards have the same woven glass epoxy base as single-sided boards — however, in the case of a double-sided board, there is copper coating on both sides of the board, also to varying thicknesses depending on the application. Fig.3 Double sided PCB Board • Multi-Layer Boards: These use the same base material as single and double-sided boards, but are made with copper foil instead of copper coating — the copper foil is used to make “layers,” alternating between base material and copper foil until the number of desired layers is reached. IJEDR2002085 International Journal of Engineering Development and Research (www.ijedr.org) 500 Publication Since 2012 | ISSN: 2321-9939 | ©IJEDR 2020 Year 2020, Volume 8, Issue 2 Fig.4 Multi-layer PCB board 3.3 Part of PCB There are four main part of PCB • Substrate: The first, and most important, is the substrate, usually made of fiberglass. Fiberglass is used because it provides a core strength to the PCB and helps resist breakage. Think of the substrate as the PCB’s “skeleton”. • Copper Layer: Depending on the board type, this layer can either be copper foil or a full-on copper coating. Regardless of which approach is used, the point of the copper is still the same — to carry electrical signals to and from the PCB, much like your nervous system carries signals between your brain and your muscles. • Solder Mask: The third piece of the PCB is the solder mask, which is a layer of polymer that helps protect the copper so that it doesn’t short-circuit from coming into contact with the environment. In this way, the solder mask acts as the PCB’s “skin”. • Silkscreen: The final part of the circuit board is the silkscreen. The silkscreen is usually on the component side of the board used to show part numbers, logos, symbols switch settings, component reference and test points. The silkscreen can also be known as legend or nomenclature. Fig.5 Main part of PCB 3.4 Basic Manufacturing Process With the bare PCB boards chosen and available the next step is to create the required tracks on the board and remove the unwanted copper. The manufacture of the PCBs is normally achieved using a chemical etching process. The most common form of etch used with PCBs is ferric chloride. In order to gain the correct pattern of tracks, a photographic process is used. Typically, the copper on the bare printed circuit boards is covered with a thin layer of photo-resist. It is then exposed to light through a photographic film or photo-mask detailing the tracks required. In this way the image of the tracks is passed onto the photo-resist. With this complete, the photo-resist is placed in a developer so that only those areas of the board where tracks are needed are covered in the resist. The next stage in the process is to place the printed circuit boards into the ferric chloride to etch the areas where no track or copper is required.