<p> AIT PRODUCT APPLICATION ANALYSIS & ASSISTANCE FORM QOF-7.2-1 Rev. H 7/29/2013 ©AI Technology, Inc., All rights reserved.</p><p>Date: AIT Contact: Contact Source: Call-In Website Customer Visit Tradeshow Name of Show: </p><p>I. CUSTOMER Company: Name of Contact: Title of Contact: Address: Tel: Email: </p><p>II. APPLICATION (Circle Application Type and Check Please Check One Applicable Box Only (SketchApplicable the Box) assembly 1. Die Attach: Paste Conductive Insulating Flip-Chip Solder- with the applied material Film Replacement whenever Possible: You 2. Component Attach: Paste Mechanical Only Solder- are welcome to email us 3.Film Underfill: Paste Flip-ChipReplacement Thermo-mechanical Component separate pictures or 4.Film Substrate-Module Attach: Paste ElectricallyThermo-mechanical Conductive Insulating Insulating with drawings.) 5.Film Encapsulation and Potting Wire-BondHigh Thermal Glob-Top Glob-Top with Dam Multi- 6. Thermal Interface Grease-Paste GreaseComponent PottingGel-Forming Grease Electro-Grease Thermal 7. Thermal Interface Pad-Tape-Film CompressibleAdhesive Paste Phase-Change Gap-Filling Pad Thermal PSA 8. Insulated Metal Substrate Std.Dry FilmInsulated CU over AL Base Insulated CU over CU Base 9. Flexible PWB Single-Sided InsulationFlexible IMS Thickness: Copper Thickness: 1oz 1/2oz 10.Two-Sided Lid-Seal: Paste Mechanical1/4oz and Semi-Hermetic 11.Film Coating (Moisture and Water TransparentMechanical with UV BlockEMI Pigmented UV Block PWB Conformal 12.Resistant) Sealant (Moisture and Water FlexibleEMI Shield Insulating Tough-Rigid Insulating Resistant) 13. Dicing Tape ControlFlexible PeelEMI ShieldRelease UV Release Heat- 14.Grinding Tape (for Wafer or Wafer-SubstrateThermal Release Only Wafer with Au Bumps Wafer with 15.GrindingSubstrate Thinning) Temporary Bonding Spin-CoatingSolder Bumps IPA Liquid IPA Soluble Film Thickness: “Wax” 16. Custom and Special Others (Please specify) III. DISPENSING Please check one and provide details whenever possible 1. Needle Dispensing Pressure-Time Needle Gauge: Volumetric Needle Gauge: 2. Screen Stenciling Stencil or Emulsion Thickness:  Preferred Specific Viscosity & Viscosity (cps, @5 rpm): Thixotropic Index Range: 3. FilmThixotropy (Preform-Sheet-Roll) Dry Tacky-PSA Preform-Sheet-Roll Width-Length-Thickness: IV. BONDING & CURING CONDITIONS: (Please be as precise as possible) 1. Max. Cure Temp: oC oF 2. Max. Cure Time: Hour Minute Second 3. Max. Pressure (For Film Adhesives Only): PSI (or other unit) Fixture in Place During Curing Melt-Flow Tacking V. RELIABILITY AND TECHNICAL CONSIDERATIONS:  Bonding or Interface Area (For Stress Width: Length: Diameter: Dimension (e.g. 0.5cmx 2.0cm or Consideration) 5cm Ø)  Adherends Material (For CTE Mismatch Part Material: Substrate Material: Material(e.g. Aluminum, Copper, FR4) Consideration)  Flatness Tolerance (For Thickness Widthwise: Lengthwise: e.g. 6mils total or 2mil/inch, etc. Consideration)  Electrically Insulating or Dielectric Strength in V/mil, Insulating : Conductive : Conductive Resistivity in -cm  Device Power (For Thermal Interface Watts: Watts (e.g. 30 watts) Consideration)  Highest Operating Temperature Degree: oC oF e.g. 80oC, 150oC, 250oC Degree: oC oF Duration: Hr Min e.g. 250oC wire-bonding, 350oC for 5  Highest Intermittent Temperature Sec minutes o o  Max Temp. and Load (For Adhesive Tg Max. Temp: C F T ensile or Shear Load e.g. 125oC, 125psi, tensile and/or Consideration) (PSI): shear load o o  Temperature Cycling (For Stress Low Temp: High Temp: C F No. of e.g. –40oC/85oC, –55oC/150oC for 1000 Consideration) Cycle: cycles NASA outgassing Mil Std 883H/5011.5  Others (Check all applicable boxes) Others: HAST</p><p>VI. PROJECTED USAGE VOLUME (Per Year): VII. DATES REQUIRED: Sample Date: Prototype-Pilot Date: Production Start Date: Additional Requirements and Comments: </p><p>Drawings or Pictures Attached for Additional Clarification: Other Documents and Attachments: Please fax (609) 799-9308 or email:[email protected] the completed form to AIT. Call (609) 799-9388 for additional questions or assistance. AIT Recommendations or Comments (Do Not Fill In. For AIT Use Only): </p>