<p>.Presentation at Singapore Symposium on Interconnect Reliability in 25-26 Sep 2017 at UTown/NUS/Singapore</p><p>Inductive Heat-Seed Development for Microelectronic Interconnect Bonding</p><p>R. Gopala Krishnan and Eng Soon TOK Electronic Materials Growth and Interface Characterization Lab (MaGIC Lab) Physics Department, Blk S12, Science Drive 3, Singapore - 117551 Email/weblink: [email protected] / [email protected] ( http://www.researchgate.net/profile/Gopal_Krishnan2 ) & G. Yaadhav RAAJ & G Srayes Advanced Integrated Analytical Test Services (Singapore) Pte.Ltd ( A-IATS ) No 9, Kaki Bukit road 2, #02-16 Gordon Warehouse Building Singapore-417842 Email/weblink: [email protected] / ( www.a-iats.com & www.microsurftech.com )</p><p>Advancement in Electronic Solder-Substrate Interface Integrity in flexible, bendable and wearable products is becoming a necessity with the inevitable integrated demands of Tsensors, IoT and Solar photovoltaic batteries. Low-frequency electromagnetic induction (EMI) based reflow oven process and magnetic-micro seed dispersion are strategically gaining importance in recent years through the foundational use of Ferromagnetic ( FMM ) based Sn-based solder system. In this presentation, results of FMM-SAC305/Cu- BGA solder joint system from a cluster of process and analytical techniques such as low- temperature ball-milling, rapid thermal process (RTP), isothermal annealing, cross- section/fine polishing, XRD, VSM, DSC and SEM-EDX are compiled and discussed in depth for EMI-centric reflow oven development and deployment. </p><p>Keywords: </p><p>Magnetic microseed, inductive heat, SAC305 solder, VSM, SEM/EDX/BSE, and Mechanical Alloying Dr. Gopal Krishnan : Received Doctoral degree from Physics Department/National University of Singapore ( NUS ) and currently works as Technical Advisor and consultant supporting Scientific Research and Industry Technology Development through advanced analytical technologies and road mapping. He has published a number of research papers with colleagues and students in electronic materials science area in international journals, conference proceedings, and had travelled widely for technical presentation through his work experience at NUS Physics Department, A*STAR, and professional associations. He is/was a member of Institute of Physics (Singapore), Singapore Surface Engineering Association( SSEA/http://www.aseansurfin.org/ ), MRS, AVS, ASTM, NASF, International Institute of Forecasting (USA) and SICCI. He has founded the Symposium on Surface Engineering for Industrial Applications at Singapore in 2005 with SSEA and has been the conference General Chair/Joint-Chair at Singapore, Chennai/India and Russia. He has founded A-IATS/Singapore (http://www.a-iats.com/) and Surface Technologies/Chennai/INDIA (http://www.microsurftech.com/ ) and plays advisory role. Dr Krishnan is also serving as Senior Research Fellow (Adj) at Physics, NUS, Singapore since 2010 and is reachable at ([email protected] ) or http://www.researchgate.net/profile/Gopal_Krishnan2</p>