USOO9602804B2 (12) United States Patent (10) Patent No.: US 9,602,804 B2 Shi (45) Date of Patent: Mar. 21, 2017 (54) METHODS OF FORMING INTEGRATED 2005, 0046740 A1* 3, 2005 Davis ................... HO4N 5,2254 PACKAGE STRUCTURES WITH LOW Z. 348/373 HEIGHT 3D CAMERA 2008/0001 241 A1 1/2008 Tuckerman ......... HOL 31 (0203 257/434 (71) Applicant: Intel Corporation, Santa Clara, CA 2010/0314703 A1* 12/2010 Chen ................. HOL 27, 14618 (US) 257/432 2010/0321558 A1* 12/2010 Chiu ....................... GO1S 11/12 (72) Inventor: Wei Shi, San Jose, CA (US) 348/360 (Continued) (73) Assignee: Intel Corporation, Santa Clara, CA (US) FOREIGN PATENT DOCUMENTS (*) Notice: Subject to any disclaimer, the term of this EP 2455984 A2 5, 2012 patent is extended or adjusted under 35 WO 2010-007594 A1 1, 2010 U.S.C. 154(b) by 0 days. (21) Appl. No.: 14/669,877 OTHER PUBLICATIONS 1-1. International Search Report and Written Opinion received for (22) Filed: Mar. 26, 2015 International Application No. PCT/US2016/019556, mailed on Jul. (65) Prior Publication Data 15, 2016, 13 pages. US 2016/0284752 A1 Sep. 29, 2016 (Continued) (51) Esas (2006.01) Primary Examiner — Aung S Moe H04N I3/02 (2006.01) Assistant Examiner — John H Morehead, III HOIL 27/46 (2006.01) (74) Attorney, Agent, or Firm — Alpine Technology Law HOIL 3L/0232 (2014.01) Group LLC (52) U.S. Cl. CPC. H04N 13/0203 (2013.01); HOIL 27/14618 (2013.01); HOIL 27/14625 (2013.01); HOIL (57) ABSTRACT 27/14683 (2013.01); HOIL 31/02325 (2013.01) Methods of forming 3D camera devices and structures (58) Field of Classification Search formed thereby are described. An embodiment includes a CPC .......... H04N 13/0203; H01L 27/14627; H01L first optics module and a second optics module disposed on 27/14683; H01L 31/02325 a board, wherein a first sensor die is coupled to the first See application file for complete search history. optics module and a second sensor die is coupled to the second optics module. The first and second sensor die are (56) References Cited directly coupled to the board, and a flexible conductive U.S. PATENT DOCUMENTS connector is coupled to both the first and second optics modules. 2001/0030682 A1 10/2001 Tserkovnyuk et al. 2003/0218251 A1* 11/2003 Seo ................... HOL 27, 14618 257/737 24 Claims, 9 Drawing Sheets US 9,602,804 B2 Page 2 (56) References Cited U.S. PATENT DOCUMENTS 2011/003.8065 A1* 2/2011 Miyawaki .............. GO2B 7,021 359,819 2011/0069189 A1 3f2011 Venkataraman ... HOL27/146.18 348.218.1 2011/0273600 A1* 11/2011 Kriman ............. HOL 27, 14618 348,294 2012/0181646 A1 7, 2012 Han et al. 2014/0264693 A1* 9/2014 Oganesian .............. HO1L 24.95 257/432 2015.OOO 1708 A1 1, 2015 Lin 2016/0026838 A1 1/2016 Gillet ................... GO2B 26, 101 235,462.21 OTHER PUBLICATIONS Office Action and Search Report received for Taiwanese Patent Application No. 105102701, mailed on Dec. 20, 2016, 9 pages including 1 page of English translation. * cited by examiner U.S. Patent Mar. 21, 2017. Sheet 1 of 9 US 9,602,804 B2 FIG 1a 1OO FIG 1b. U.S. Patent Mar. 21, 2017. Sheet 2 of 9 US 9,602,804 B2 110 112 112 FIG. 1C U.S. Patent Mar. 21, 2017. Sheet 3 of 9 US 9,602,804 B2 119 117 | (S106 F.G. 1d U.S. Patent Mar. 21, 2017. Sheet 4 of 9 US 9,602,804 B2 a 19 19. E - 104 108 uperim III DDue O2 L fo0'YO2 11s 123 100102 124 115 122 15108 FIG. 1e U.S. Patent Mar. 21, 2017 Sheet 5 Of 9 US 9,602,804 B2 222/202 208 FIG. 2a U.S. Patent Mar. 21, 2017. Sheet 6 of 9 US 9,602,804 B2 226 E. Eme N206 E. 222 208 222 FIG.2b 231 226 208 225 FIG. 2C U.S. Patent Mar. 21, 2017 Sheet 7 Of 9 US 9,602,804 B2 coupling a first optical module directly to a second side of a first filter to form a first Camera, wherein a first side of the first filter is Coupled to a first die; 04 Coupling a second optical module directly to a second side of a Second filter to form a Second Camera, wherein a first side of the Second filter is Coupled to a Second die, and 306 attaching the first and second cameras to a board, wherein the first and - Second die are directly attached to the board, and wherein a flexible conductive connector is directly coupled to the first filter and the Second filter. FIG. 3 U.S. Patent Mar. 21, 2017. Sheet 8 of 9 US 9,602,804 B2 400 FIG. 4 U.S. Patent Mar. 21, 2017. Sheet 9 of 9 US 9,602,804 B2 INTEGRATED CIRCUIT DE 5O2 ON PROssor MEMORY COMMUNICATIONS CHIP(S) 506 508 WOA MEMORY 510 DSP 516 NON WOA MEMORY 512 CHIPSET 520 GPU 514 GPS 529 TOUCHCREEN DISPLAY 524 BATTERY 528 TOUCHSCREEN SPEER DISPLAY CONTROLLER 526 CAMERA CRYPTO 536 PROCESSOR A. INPUT DEVICES is 538 WAS ORA DEVICE COMPASS 540 530 - is 522 -- VN FIG. 5 US 9,602,804 B2 1. 2 METHODS OF FORMING INTEGRATED and second optics modules, and may be coupled to both the PACKAGE STRUCTURES WITH LOW Z. first and second optics modules. HEIGHT 3D CAMERA FIGS. 1a-1e depict cross sectional views of embodiments of camera structures, such as 3D camera structures. In an BACKGROUND OF THE INVENTION embodiment, a first side 101 of a die 102, may be coupled with a filter 104, which may comprise an infrared filter 104, As miniaturization advances, there are efforts to construct in some cases (FIG. 1a). In an embodiment, the filter 104 sensors, such as sensors used in cameras, for use in micro may comprise a glass material, and may comprise a glass electronic devices, such as laptops, and mobile devices, for wafer in some embodiments. In an embodiment, the filter example. Such applications may incorporate the use of 3D 10 104 may comprise a first side 107 and a second side 109. In cameras devices, which can include image sensors, such as an embodiment, the filter 104 may comprise a center portion a complementary metal on oxide (CMOS) image sensor that 111 and two end portions 113, 113', wherein the two end may be coupled to an optics module. portions 113, 113' are adjacent the coupling connections 103. 15 In an embodiment, the die 102 may comprise a sensor die BRIEF DESCRIPTION OF THE DRAWINGS 102. In an embodiment, the sensor die 102 may comprise a CMOS sensor die 102, and may be utilized in camera While the specification concludes with claims particularly applications, such as 3D camera applications, for example. pointing out and distinctly claiming certain embodiments, In an embodiment, the first side 101 of the die 102 may be the advantages of these embodiments can be more readily coupled to the first side 107 of the filter 104, and in some ascertained from the following description of the invention cases the die 104 may be directly coupled to the first side 107 when read in conjunction with the accompanying drawings of the filter 104. In an embodiment, the die 102 may in which: comprise a flip chip die 102, and may be coupled to the filter FIGS. 1a-1e represent cross sectional views of structures 104 by the use of conductive connections 103. In an embodi according to embodiments herein. 25 ment, the conductive connections 103 may comprise Solder FIGS. 2a-2b represent cross sectional views of structures connections 103. Such as ball grid array solder connections, according to embodiments. for example. Other type of conductive connections 103 may FIG. 2c represents a top view of structures according to be used to couple the die 102 to the filter 104, in other embodiments. embodiments. In an embodiment, a process wherein solder FIG.3 represents a flow chart of a method according to 30 balls comprising a tin silver alloy may connect the die 102 embodiments. to the filter 104. In another embodiment, non-conductive FIG. 4 represents a cross sectional view of an assembly epoxy may be employed to couple the die 102 to the filter according to embodiments. 104. In an embodiment, the conductive connections 103 may FIG. 5 represents a system according to embodiments. provide a seal. Such as a hermetic seal, in a region 105 35 between the die 102 and the filter 104. DETAILED DESCRIPTION OF THE PRESENT In an embodiment, flexible conductive connectors 108, INVENTION 108" may be coupled/attached to the first side 107 of the filter 104 (FIG. 1b). In an embodiment, flexible conductive con In the following detailed description, reference is made to nectors 108, 108 may comprise flexible printed circuit the accompanying drawings that show, by way of illustra 40 (FPC) connectors 108, 108'. In an embodiment, flexible tion, specific embodiments in which the methods and struc conductive connectors 108, 108 may comprise end portions tures may be practiced. These embodiments are described in 115, 115". In an embodiment, the end portions 115, 115 of sufficient detail to enable those skilled in the art to practice the flexible conductive connectors 108, 108 may be the embodiments. It is to be understood that the various coupled/bonded to the end portions 113, 113' of the filter 104 embodiments, although different, are not necessarily mutu 45 respectively. In an embodiment, a coupling/bonding mate ally exclusive.