Print Troubleshooting Pictorial Guide

Print Troubleshooting Pictorial Guide

<p>PRINT TROUBLESHOOTING PICTORIAL GUIDE</p><p>This guide assumes a basically properly built and calibrated printer http://www.reprap.org/wiki/Main_Pag e. If you have not read through and attempted a complete calibration, see the REPRAP wiki for calibration instructions http://www.reprap.org/wiki/Calibration. Some common calibration issues as well as common build related issues however are discussed.</p><p>The following categories are used identified by either print defects or by cause (if known): <list to be put in sidebar with links to section> CAUSES:</p><p>Material Feed excessive insufficient intermittent Extruding Temperature too hot too cold Clogged Extruder Bed Adherence insufficient excessive Print Speed too high too low Calibration circularity scale Skipping Steps Part Temperature too hot too cold</p><p>PRINT DEFECTS: </p><p>Surface Defects Holes small single filament large area of filament Waviness Solidity of surface Strings Blobs Fineness of Detail Filaments not Touching Body Defects Warping while printing after printing Stepping/Offsetting Interlayer Delamination Failure at Height Overall Disaster</p><p>... Bed Adherence</p><p>#0001, bed adherence, insufficient 01 PROBLEM COMMON CAUSE CORRECTION Prints do not adhere to build Print head too high to push plastic against Change height settings, calibrate bottom stop, level platform build platform build platform Build platform not clean Clean using rubbing alcohol or amonia, or reapply surface tape Build platform temp too low (other than Raise build platform temp (max ~65C) PLA)</p><p>#0002, bed adherence,...</p><p>...</p><p>#0003, Part Temperature, too hot 01 02 PROBLEM COMMON CAUSE CORRECTION Prints warp at height Part temperature builds up as part is built Change settings to turn off or down temp of heated build platform after base layers are complete. Ex: with heat on all through print and off upon print start (starting at full temp but cooling as it goes) (pic01). Reduce print speed to allow time to cool down. Introduce wait states/orbit for each layer. Add fan to reduce heat of part.</p><p>...</p>

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