Disrupting the datacenter: Qualcomm Centriq™ 2400 Processor November 8, 2017 Safe Harbor This presentation by Qualcomm Incorporated and its indirect wholly-owned subsidiary, Qualcomm Datacenter Technologies, Inc. (“QDT”), contains forward-looking statements. Such forward-looking statements involve known and unknown risks, uncertainties and other factors which may cause Qualcomm Incorporated’s or QDT’s actual results, performance or achievements to be materially different from any future results, performance or achievements expressed or implied by the forward-looking statements. Neither Qualcomm Incorporated nor QDT undertakes any obligation to revise or update any forward-looking statements in order to reflect any event or circumstance that may arise after the date of this presentation and each entity reserves the right to revise their respective product roadmaps at any time for any reason without notice. Any third-party statements included in the presentation are not made by either Qualcomm Incorporated or QDT, but instead by such third parties themselves and neither Qualcomm Incorporated nor QDT has any responsibility in connection therewith. 2 Transforming our world Technology leadership in advanced computing, connectivity, security, and systems design 3 Inventing technologies that fuel innovation Long history of anticipating big industry challenges and developing system-level solutions to solve them 4 5G will power a new cloud and connectivity paradigm Enhanced mobile Mission-critical Massive Internet broadband services of Things A unified connectivity platform facilitating distributed intelligence between cloud and device 5 Automotive High performance at Distributed intelligence leading process nodes Computing drives new requirements 5G for high speed, low latency connectivity Networking Intelligence distributed Low power, efficient, integrated computing platforms from cloud to device Media consumption Optimized machine Utilizing our technology Industrial IoT learning leadership to drive innovation at scale across industries Comprehensive Smart homes security 6 Arm vs x86: Architectural footprint X86 Arm 2005 2006 2007 2008 100B+ 2009 Arm-based chips have shipped since 1991 2010 2011 Expect next 100B to ship by 2021 2012 2013 2014 2015 2016 7 Structural trends driving tectonic shift in the data center Cloud Manufacturing process 8 A new world in datacenter— cloud Monolithic Worldwide cloud IT Scale-out architecture infrastructure shifts to cloud* architecture 100% Cloud 50% Traditional enterprise IT Then Now On-premise Revenue Server Datacenter % Total 0% Cloud distributed Centralized system 2013 2014 2015 2016 2017 2018 2019 2020 system 9 A new world in datacenter— manufacturing process 305M 294M 280M PC Global PC vs. Smartphone shipments units units units Smartphone 1.3B 1.4B 1.5B units units units 219M 230M 269M units units units 56M 82M 124M Then units units units Now Fab process technology Fab process technology driven by PC driven by mobile phones 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 10 A new world in datacenter— manufacturing process 305M 294M 280M PC 350 250 180 130 90 65 45 32 22 units units units Smartphone nm nm nm nm nm nm nm nm nm 1.3B 1.4B 1.5B units units units 219M 230M 269M units units units 56M 82M 124M ~2 year Then units units units scale) (Log density* Defect Now Fab process technology Fab process technology driven by PC driven by mobile phones 2005 2006 2007 2014 2015 2016 11 A new world in datacenter— manufacturing process 65nm 45nm 28nm 20nm 14nm 10nm Mobile driven 1st in the industry PC driven 45nm 32nm 22nm 14nm 10nm Then Now Fab process technology Fab process technology driven by PC driven by mobile phones 2008 2010 2012 2014 2016 2018 12 Qualcomm Centriq™ 2400 Disrupting the datacenter Processor 13 Reimagining the datacenter Process technology leadership Built for the cloud Open ecosystem Custom design expertise Industry’s first and only 10nm server processor. 14 Innovative design on leading edge node “Samsung's 10nm process technology with specific optimizations for high performance, combined with QDT’s + = leading-edge custom SoC design, allow us to deliver a world-class server processor that will disrupt the datacenter market.” World Industry leading ES Jung, President and GM, Foundry class design process node Business, Samsung Electronics 15 Benefits of leading Better performance, power, area edge node Transistor speed Higher performance Transistor density Lower cost Transistor power Higher perf/Watt 16 Qualcomm Centriq™ 2400 Now shipping for revenue* 17 Industry is shifting to the cloud 100% Cloud 75% 50% Traditional 25% enterprise IT 0% % Total datacenter revenue server datacenter % Total 2013 2014 2015 2016 2017 2018 2019 2020 18 Cloud software trends Infrastructure Platform Software and services services API services Cloud native Applications increasingly decoupled from ISA applications Monolithic Microservices, Multi-threaded SW containerized SW Scale out Portable 19 What cloud means for processor architecture Qualcomm Centriq™ Throughput performance Key metrics Thread density • Perf / thread Quality of service • Perf / Watt 2400 Energy efficiency • Perf / $ 20 DDR DDR DDR Qualcomm Centriq 2400: Built for cloud MC MC MC 8 - ® L3 L3 L3 L3 L3 L3 Serdes Serdes - SATACTL 8 Qualcomm Large cache ™ PCle EMAC Falkor CPU Falkor Falkor Falkor Falkor Falkor Falkor • 64 KB L1 instruction cache with 24 KB duplex duplex duplex duplex duplex duplex HDMA 8 - Serdes single-cycle L0 cache OCMEM • 5th-generation custom core design Falkor Falkor Falkor Falkor Falkor Falkor duplex duplex duplex duplex duplex duplex QGIC • 2.2 GHz base frequency, 2.6 GHz peak* • 512 KB L2 per duplex USB USB USB USB • Arm v8-compliant • 60 MB unified L3 cache Falkor Falkor Falkor Falkor Falkor Falkor 8 - duplex duplex duplex duplex duplex duplex Serdes QFPROM • AArch64 only Falkor Falkor Falkor Falkor Falkor Falkor PCle IMC duplex duplex duplex duplex duplex duplex Bi-directional multi-ring Coherent segmented ring interconnect 8 - Serdes High core count • Fully coherent MPM/CC L3 L3 L3 L3 L3 L3 • >250GB/s aggregate bandwidth PW • Up to 48 single-thread CPU cores MC MC MC DDR DDR DDR 21 DDR DDR DDR Qualcomm Centriq 2400: Built for cloud MC MC MC 8 - L3 L3 L3 L3 L3 L3 Serdes Serdes - SATACTL 8 Highly integrated SoC Security PCle EMAC • Distributed architecture Falkor Falkor Falkor Falkor Falkor Falkor • Immutable root of trust duplex duplex duplex duplex duplex duplex HDMA 8 - Serdes • Single chip platform-level solution • EL3 (TrustZone) and EL2 (hypervisor) OCMEM Falkor Falkor Falkor Falkor Falkor Falkor duplex duplex duplex duplex duplex duplex • Arm SBSA Level 3-compliant QGIC USB USB USB USB Cloud workload enhancers Falkor Falkor Falkor Falkor Falkor Falkor 8 - duplex duplex duplex duplex duplex duplex Serdes QFPROM High memory BW • Inline memory bandwidth compression Falkor Falkor Falkor Falkor Falkor Falkor PCle IMC duplex duplex duplex duplex duplex duplex • 6 Channels of DDR4 2667 MT/s • Cache Quality of Service Coherent segmented ring interconnect 8 - • Up to 768 GB of memory Serdes MPM/CC L3 L3 L3 L3 L3 L3 • 128 GB/s peak aggregate BW Integrated chipset PW MC MC MC Low power • 32 PCIe Gen3 lanes with 6 PCIe controllers DDR DDR DDR • Low speed IO; integrated management controller • Up to 120W TDP 22 DDR DDR DDR Qualcomm Centriq 2400: Built for cloud MC MC MC 8 - L3 L3 L3 L3 L3 L3 Serdes Serdes - SATACTL 8 • 48 physical 2.6 GHz custom cores with large cache PCle EMAC Falkor Falkor Falkor Falkor Falkor Falkor duplex duplex duplex duplex duplex duplex HDMA 8 - Serdes • High bandwidth coherent ring OCMEM Falkor Falkor Falkor Falkor Falkor Falkor duplex duplex duplex duplex duplex duplex QGIC USB USB • Constant peak frequency USB USB Falkor Falkor Falkor Falkor Falkor Falkor 8 - duplex duplex duplex duplex duplex duplex Serdes QFPROM Falkor Falkor Falkor Falkor Falkor Falkor • Cache quality of service PCle IMC duplex duplex duplex duplex duplex duplex Coherent segmented ring interconnect 8 - Serdes MPM/CC • Inline memory bandwidth compression L3 L3 L3 L3 L3 L3 PW MC MC MC • Security rooted in hardware DDR DDR DDR • Leading performance and power efficiency 23 Qualcomm Centriq 7% better performance 13% better 657 Qualcomm Centriq 2460 613 607 48 cores / 48 threads leadership 534 120W TDP Intel Xeon Platinum 8160 24 cores / 48 threads 150W TDP SPECint®_rate2006 estimate* SPECfp®_rate2006 estimate* 24 Comparative SKU lineup Intel Xeon — Top bin Platinum, Gold, Silver SKUs* SKU Core Count L3 Cache Frequency Power SKU Core Count L3 Cache Frequency Power (base and turbo** freq) (TDP) (base and peak** freq) (TDP) Intel Xeon Platinum 8180 28 38.5 MB 2.5 / 3.8 GHz 205W Qualcomm Centriq 2460 48 60 MB 2.2 / 2.6 GHz 120W Intel Xeon Gold 6152 22 30.25 MB 2.1 / 3.7 GHz 140W Qualcomm Centriq 2452 46 57.5 MB 2.2 / 2.6 GHz 120W Intel Xeon Silver 4116 12 16.5 MB 2.1 / 3.0 GHz 85W Qualcomm Centriq 2434 40 50 MB 2.3 / 2.5 GHz 110W 25 Qualcomm Centriq ~Parity 8% better 4% better performance Qualcomm 13.9 13.7 13.8 13.6 14.1 Centriq 12.8 leadership Intel Xeon SPECint®_rate2006 Estimate per Thread per Estimate SPECint®_rate2006 Qualcomm Centriq 2460 120W TDP Qualcomm Centriq 2452 120W TDP Qualcomm Centriq 2434 110W TDP vs. vs. vs. Intel Xeon Platinum 8180 205W TDP* Intel Xeon Gold 6152 140W TDP* Intel Xeon Silver 4116 85W TDP* 26 Qualcomm Centriq 45% better 32% better 31% better 5.5 5.3 Qualcomm performance 5.1 Centriq 4.0 Intel Xeon leadership 3.8 3.9 SPECint®_rate2006 Estimate per TDP W TDP per Estimate SPECint®_rate2006 Qualcomm Centriq 2460 120W TDP Qualcomm Centriq 2452 120W TDP Qualcomm Centriq 2434 110W TDP vs. vs. vs. Intel Xeon Platinum 8180 205W TDP* Intel Xeon Gold 6152 140W TDP* Intel Xeon Silver 4116 85W TDP* 27 120W TDP Qualcomm Centriq 120 energy efficiency 100 ) 80 s Median = 65W Watt ( 60 Power Power 40 20 8W idle power 0 400.