Analysis of Thallium in Gold Plating Solution (Flame Method)

Analysis of Thallium in Gold Plating Solution (Flame Method)

Technical Report AA No.180003 Atomic Absorption Spectrophotometer Analysis of thallium in gold plating solution (flame method) Because of its excellent corrosion resistance, conductivity and other properties, gold plating is frequently used in electronics and mobile telephones, as well as in jewelry, etc. Thallium (Tl) is sometimes added to gold plating solution as a crystal regulator to obtain stable precipitates in the solution for bonding use. Stable quality can be maintained by controlling the Tl concentration in the plating solution. ZA3000, which features the polarized Zeeman background correction method, can make precise quantitative determinations that correct for background without being affected by Model ZA3000 Atomic materials coexisting in the plating solution. Absorption Spectrophotometer Analysis of Tl in gold plating solution Plating solution was measured. A reference solution was prepared by diluting a standard solution made by Kanto Chemical Co., Inc. with 0.1% nitric acid. 1 mg/L thallium was added to the plating solution. Good results of 104% and 105% were obtained from recovery testing. ■ Measurement conditions Table 1 - Tl equipment conditions Table 2 - Tl measurement conditions Element Tl Atomizer STD Burner Meas. Mode Working Curve Instrument ZA3000 Flame Air - C2H2 Signal Mode BKG Corrected Atomization Flame Fuel (C2H2)2.0 L/min Curve Order Linear Wavelength 276.8 nm 160 kPa Calculation Integration Oxidant (Air) Lamp Current 6.0 mA 15.0 L/min Time Constant 5.0 s Slit Width 1.3 nm Burner Height 7.5 mm Calculation Time 5.0 s ■ Measurement results Delay Time 5 s ABS 0.05 Plating solution 1 ABS +Tl 2 mg/L Tl 0.02 3 mg/L Plating solution 1 Tl +Tl 1 mg/L Plating solution 2 2 mg/L Tl 2 mg/L Tl Plating solution 3 0.01 1 mg/L Plating solution 1 R2: 0.9999 0.00 0.00 Blank 0 1 2 3 Concentration (mg/L) Figure 1 – Tl atomic absorption signal profile Figure 2 - Tl calibration curve Table 3 - Concentration and absorbance of each sample Table 4 - Measurement results of Tl in plating solution Concentration Measurement ID Sample name (mg/L) Absorbance Recovery Sample name result STD 1 Blank 0.00 0.0003 rate (mg/L) STD 2 Tl 1 mg/L 1.00 0.0078 STD 3 Tl 2 mg/L 2.00 0.0151 Tl 2 mg/L 2.01 ― STD 4 Tl 3 mg/L 3.00 0.0221 Plating solution 1 0.82 ― UNK 1 Tl 2 mg/L 2.01 0.0150 Plating solution 1 + Tl 1 1.87 105% UNK 2 Plating solution 1 0.82 0.0064 mg/L Plating solution 1 + Tl 2 UNK 3 Plating solution 1 + Tl 1 mg/L 1.87 0.0140 2.89 104% UNK 4 Plating solution 1 + Tl 2 mg/L 2.89 0.0214 mg/L UNK 5 Plating solution 2 0.82 0.0064 Plating solution 2 0.82 ― UNK 6 Plating solution 3 1.91 0.0143 Plating solution 3 1.91 ― [KEY WORDS] material/fabricated material, industrial chemicals, plating solution, thallium, Tl, AA, ZA3000, flame, material Hitachi High-Tech Science Corporation http://www.hitachi-hightech.com/hhs/ Sales Department Headquarters 24-14, 1-chome, Nishishimbashi, Minato-ku, Tokyo 105-0003 TEL: (050)3131-6844 Osaka TEL: (050)3139-4876 Nagoya TEL: (050)3139-4565 Kyushu TEL: (050)3139-4271 ©2019 Hitachi High-Tech Science Corporation.

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