Front cover IBM System p5 560Q Technical Overview and Introduction Finer system granulation using Micro-Partitioning technology to help lower TCO Modular midrange solution for managing on demand business New POWER5+ processor options using DDR2 memory technology Giuliano Anselmi Bernard Filhol SahngShin Kim Gregor Linzmeier Ondrej Plachy ibm.com/redbooks Redpaper International Technical Support Organization IBM System p5 560Q Technical Overview and Introduction April 2007 Note: Before using this information and the product it supports, read the information in “Notices” on page vii. Second Edition (April 2007) This edition applies to IBM System p5 560Q (product number 9116-561), Linux, and IBM AIX 5L Version 5.3, product number 5765-G03. © Copyright International Business Machines Corporation 2006, 2007. All rights reserved. Note to U.S. Government Users Restricted Rights -- Use, duplication or disclosure restricted by GSA ADP Schedule Contract with IBM Corp. Contents Notices . vii Trademarks . viii Preface . ix The team that wrote this Redpaper . ix Become a published author . .x Comments welcome. .x Chapter 1. General description . 1 1.1 System specifications . 2 1.2 Physical package . 3 1.3 Minimum and optional features . 4 1.3.1 Processor card features . 4 1.3.2 Memory features . 5 1.3.3 Disk and media features . 5 1.3.4 USB diskette drive . 6 1.3.5 I/O drawers . 6 1.3.6 Hardware Management Console models . 8 1.4 Express Product Offerings . 9 1.4.1 Express Product Offerings overview. 10 1.4.2 Configurator starting points for Express Product Offerings. 10 1.5 System racks. 11 1.5.1 IBM 7014 Model T00 rack. 11 1.5.2 IBM 7014 Model T42 rack. 12 1.5.3 IBM 7014 Model S11 rack. 13 1.5.4 IBM 7014 Model S25 rack. 13 1.5.5 S11 rack and S25 rack considerations . 13 1.5.6 The ac power distribution unit and rack content . 14 1.5.7 Rack-mounting rules for p5-560Q. 16 1.5.8 Useful Rack additions . 17 1.5.9 OEM rack . 19 Chapter 2. Architecture and technical overview . 23 2.1 The POWER5+ processor. 24 2.2 Processor and cache . 25 2.2.1 p5-560Q POWER5+ Quad-Core Module . 25 2.2.2 Available processor speeds . 26 2.3 Memory subsystem . 27 2.3.1 Memory placement rules. 27 2.3.2 OEM memory . 28 2.3.3 Memory throughput. 29 2.4 System buses . 29 2.4.1 Processor drawer interconnect cables . 29 2.4.2 SP bus . 30 2.4.3 RIO-2 buses, GX+ buses, and optional host adapters . 30 2.5 Internal I/O subsystem . 31 2.5.1 PCI-X slots and adapters . 31 2.5.2 LAN adapters . 32 2.5.3 SCSI adapters. 33 © Copyright IBM Corp. 2006, 2007. All rights reserved. iii 2.5.4 Internal RAID options . 33 2.5.5 iSCSI. 33 2.5.6 Fibre Channel adapter . 35 2.5.7 Graphic accelerator. 36 2.5.8 InfiniBand Host Channel adapters . 36 2.5.9 Asynchronous PCI-X adapters . 36 2.5.10 Additional support for existing PCI-X adapters . 36 2.5.11 Internal system ports. 37 2.5.12 Ethernet ports . 37 2.6 Internal storage . 37 2.6.1 Internal hot-swappable SCSI disks . 37 2.6.2 Internal media devices . 38 2.7 External disk subsystems . 38 2.7.1 IBM TotalStorage EXP24 Expandable Storage . 38 2.7.2 IBM System Storage N3000 and N5000. 39 2.7.3 IBM TotalStorage Storage DS4000 Series . 39 2.7.4 IBM TotalStorage Enterprise Storage Server . 39 2.8 Logical partitioning . 40 2.8.1 Dynamic logical partitioning . 40 2.9 Virtualization . 40 2.9.1 POWER Hypervisor . 41 2.10 Advanced POWER Virtualization feature . 43 2.10.1 Micro-Partitioning technology . 43 2.10.2 Logical, virtual, and physical processor mapping . 44 2.10.3 Virtual I/O Server . ..